JPS5766657A - Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device - Google Patents

Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device

Info

Publication number
JPS5766657A
JPS5766657A JP14238380A JP14238380A JPS5766657A JP S5766657 A JPS5766657 A JP S5766657A JP 14238380 A JP14238380 A JP 14238380A JP 14238380 A JP14238380 A JP 14238380A JP S5766657 A JPS5766657 A JP S5766657A
Authority
JP
Japan
Prior art keywords
molded
molded film
semiconductor device
lead frame
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14238380A
Other languages
Japanese (ja)
Other versions
JPS6217873B2 (en
Inventor
Katsumi Umeda
Kanji Umekawa
Hironori Minowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOGE DENKI KOGYO KK
Noge Electric Industries Co Ltd
Original Assignee
NOGE DENKI KOGYO KK
Noge Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOGE DENKI KOGYO KK, Noge Electric Industries Co Ltd filed Critical NOGE DENKI KOGYO KK
Priority to JP14238380A priority Critical patent/JPS5766657A/en
Publication of JPS5766657A publication Critical patent/JPS5766657A/en
Publication of JPS6217873B2 publication Critical patent/JPS6217873B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To remove an unnecessary molded film with high efficiency, by applying water jet to the unnecessary molded film on a lead frame. CONSTITUTION:After the molded film on a resin-molded seminconductor device lead frame is electrolyzed to swell, the lead frame 1 is carried from the left to the right by means of a roller driving apparatus. On doing this, the pressurized water led from water-pressurizing tanks 11, 11' is formed into high-speed water jet streams through nozzles 12, 12' and jetted to the lead frame 1, thereby to remove an unnecessary molded film.
JP14238380A 1980-10-14 1980-10-14 Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device Granted JPS5766657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14238380A JPS5766657A (en) 1980-10-14 1980-10-14 Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14238380A JPS5766657A (en) 1980-10-14 1980-10-14 Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device

Publications (2)

Publication Number Publication Date
JPS5766657A true JPS5766657A (en) 1982-04-22
JPS6217873B2 JPS6217873B2 (en) 1987-04-20

Family

ID=15314081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14238380A Granted JPS5766657A (en) 1980-10-14 1980-10-14 Apparatus for automatically removing molded film before finish plating for external lead of molded semiconductor device

Country Status (1)

Country Link
JP (1) JPS5766657A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111335A (en) * 1982-12-17 1984-06-27 Toshiba Corp Removing method of resin unnecessary for semiconductor device
JPS61119048A (en) * 1984-11-15 1986-06-06 Kyushu Nogeden:Kk Automatic removing device of film oozing out of mold
JPS61160944A (en) * 1985-01-09 1986-07-21 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS61295637A (en) * 1985-06-24 1986-12-26 Tamura Seisakusho Co Ltd Method for removing excessive mold from ic lead frame
JPS62190732A (en) * 1986-02-18 1987-08-20 Hitachi Ltd Conveying rail for semiconductor burr removing apparatus
JPH0590944U (en) * 1991-09-18 1993-12-10 マコー株式会社 Lead frame transport mechanism in lead frame cleaning device
EP0794559A2 (en) * 1996-03-05 1997-09-10 Nec Corporation Lead frame flash removing method and apparatus
EP1465241A2 (en) * 2003-04-04 2004-10-06 ASM Technology Singapore Pte Ltd. Apparatus and method for cleaning an electronic device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111335A (en) * 1982-12-17 1984-06-27 Toshiba Corp Removing method of resin unnecessary for semiconductor device
JPS61119048A (en) * 1984-11-15 1986-06-06 Kyushu Nogeden:Kk Automatic removing device of film oozing out of mold
JPS61160944A (en) * 1985-01-09 1986-07-21 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS61295637A (en) * 1985-06-24 1986-12-26 Tamura Seisakusho Co Ltd Method for removing excessive mold from ic lead frame
JPS62190732A (en) * 1986-02-18 1987-08-20 Hitachi Ltd Conveying rail for semiconductor burr removing apparatus
JPH0590944U (en) * 1991-09-18 1993-12-10 マコー株式会社 Lead frame transport mechanism in lead frame cleaning device
EP0794559A2 (en) * 1996-03-05 1997-09-10 Nec Corporation Lead frame flash removing method and apparatus
EP0794559A3 (en) * 1996-03-05 1998-03-18 Nec Corporation Lead frame flash removing method and apparatus
AU709916B2 (en) * 1996-03-05 1999-09-09 Renesas Electronics Corporation Lead frame flash removing method and apparatus
EP1465241A2 (en) * 2003-04-04 2004-10-06 ASM Technology Singapore Pte Ltd. Apparatus and method for cleaning an electronic device
EP1465241A3 (en) * 2003-04-04 2006-11-15 ASM Technology Singapore Pte Ltd. Apparatus and method for cleaning an electronic device

Also Published As

Publication number Publication date
JPS6217873B2 (en) 1987-04-20

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