JPS5744464A - Method of bonding preparatory molding solder ring to cover for vessel - Google Patents

Method of bonding preparatory molding solder ring to cover for vessel

Info

Publication number
JPS5744464A
JPS5744464A JP56082592A JP8259281A JPS5744464A JP S5744464 A JPS5744464 A JP S5744464A JP 56082592 A JP56082592 A JP 56082592A JP 8259281 A JP8259281 A JP 8259281A JP S5744464 A JPS5744464 A JP S5744464A
Authority
JP
Japan
Prior art keywords
cover
solder ring
vessel
ring
preparatory molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56082592A
Other languages
English (en)
Inventor
Chiyuu Riangu Shiyou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teck Metals Ltd
Original Assignee
Teck Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teck Metals Ltd filed Critical Teck Metals Ltd
Publication of JPS5744464A publication Critical patent/JPS5744464A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP56082592A 1980-06-02 1981-06-01 Method of bonding preparatory molding solder ring to cover for vessel Pending JPS5744464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/155,025 US4328921A (en) 1980-06-02 1980-06-02 Attachment of solder preform to a cover for a sealed container

Publications (1)

Publication Number Publication Date
JPS5744464A true JPS5744464A (en) 1982-03-12

Family

ID=22553830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56082592A Pending JPS5744464A (en) 1980-06-02 1981-06-01 Method of bonding preparatory molding solder ring to cover for vessel

Country Status (6)

Country Link
US (1) US4328921A (ja)
JP (1) JPS5744464A (ja)
CA (1) CA1151011A (ja)
DE (1) DE3120572A1 (ja)
FR (1) FR2483282B1 (ja)
GB (1) GB2077168B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115401285A (zh) * 2022-07-28 2022-11-29 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151037A (ja) * 1982-03-02 1983-09-08 Mitsubishi Metal Corp 半導体装置用ｐｂ合金ろう材
US4557411A (en) * 1983-10-26 1985-12-10 At&T Information Systems Interconnected solder pads and the method of soldering
FR2556132B1 (fr) * 1983-12-01 1987-05-07 Ceraver Procede d'assemblage d'un boitier d'un composant semi-conducteur
GB8719498D0 (en) * 1987-08-18 1987-11-18 Ferranti Plc Seals
US5036584A (en) * 1989-06-13 1991-08-06 Texas Instruments Incorporated Method of manufacture of copper cored enclosures for hybrid circuits
US5043139A (en) * 1990-10-09 1991-08-27 Eastman Kodak Company Amalgam preform, method of forming the preform and method of bonding therewith
US5600102A (en) * 1996-02-27 1997-02-04 Indium Corporation Of America Solder preform wrappable around a printed circuit card edge
US6390353B1 (en) * 1998-01-06 2002-05-21 Williams Advanced Materials, Inc. Integral solder and plated sealing cover and method of making the same
JP4522752B2 (ja) * 2004-06-10 2010-08-11 三菱電機株式会社 半田付けによる端子接合方法
EP2390037A1 (fr) * 2009-06-15 2011-11-30 Schneider Electric Industries SAS Procédé d'assemblage par brasage réactif et ampoule à vide assemblée selon ce procédé
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1166952A (fr) * 1957-02-21 1958-11-18 Fr Des Fers Emailles Soc Presse à braser à cadence rapide
US3451836A (en) * 1966-09-12 1969-06-24 Engelhard Ind Inc Method of continuously bonding a narrow solder stripe on metal strip material
US3538597A (en) * 1967-07-13 1970-11-10 Us Navy Flatpack lid and method
US3648357A (en) * 1969-07-31 1972-03-14 Gen Dynamics Corp Method for sealing microelectronic device packages
US3937388A (en) * 1971-09-15 1976-02-10 The Johns Hopkins University Method for sealing packages
US3943620A (en) * 1974-03-04 1976-03-16 Corning Glass Works Method of forming a hermetic enclosure
US3985283A (en) * 1974-08-01 1976-10-12 United Aircraft Products, Inc. Method of joining braze alloy to a parent metal part
US4020987A (en) * 1975-09-22 1977-05-03 Norman Hascoe Solder preform for use in hermetically sealing a container

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115401285A (zh) * 2022-07-28 2022-11-29 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法
CN115401285B (zh) * 2022-07-28 2024-06-07 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法

Also Published As

Publication number Publication date
GB2077168B (en) 1985-01-09
FR2483282B1 (fr) 1985-08-30
DE3120572A1 (de) 1982-06-24
GB2077168A (en) 1981-12-16
US4328921A (en) 1982-05-11
CA1151011A (en) 1983-08-02
FR2483282A1 (fr) 1981-12-04

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