JPS5743979A - Composite ni electroless plating device - Google Patents
Composite ni electroless plating deviceInfo
- Publication number
- JPS5743979A JPS5743979A JP11820480A JP11820480A JPS5743979A JP S5743979 A JPS5743979 A JP S5743979A JP 11820480 A JP11820480 A JP 11820480A JP 11820480 A JP11820480 A JP 11820480A JP S5743979 A JPS5743979 A JP S5743979A
- Authority
- JP
- Japan
- Prior art keywords
- precipitates
- plating
- plating liquid
- composite material
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To enable the continuous use of a plating liquid and to facilitate the removal of Ni precipitates, by installing an attenuating means for agitating force to separate spherical Ni precipitates having a prescribed particle size or more in a lower part of a plating tank having air agitating devices installed on its bottom.
CONSTITUTION: An object to be plated 1 is suspended in a plating liquid having a composite material such as SiC dispersed in it in a plating tank 2 having air agitating devices 3 installed on its bottom, and composite Ni electroless plating of the object 1 is carried out. At that time, a composite material or iron matter included in the plating liquid forms a nucleating agent. Around particles of such a nucleating agent, spherical Ni precipitates grow. Grown up spherical Ni precipitates having a particle size of a prescribed value or more are confined in a layer under an attenuating plate 5 for air agitating force is attenuated in a layer over the plate 5. Thus, such large sized Ni precipitates are nearly completely prevented from transferring into an upper layer. Therefore, the plating liquid drawn out of an outlet 6 is a liquid having only a composite material dispersed in it so that it can be used repeatedly. Further, the plating liquid drawn out of an outlet 4 has a high concentration of the Ni precipitate so that removal of the Ni precipitate becomes easy.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820480A JPS5743979A (en) | 1980-08-27 | 1980-08-27 | Composite ni electroless plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11820480A JPS5743979A (en) | 1980-08-27 | 1980-08-27 | Composite ni electroless plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5743979A true JPS5743979A (en) | 1982-03-12 |
| JPS6241317B2 JPS6241317B2 (en) | 1987-09-02 |
Family
ID=14730762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11820480A Granted JPS5743979A (en) | 1980-08-27 | 1980-08-27 | Composite ni electroless plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5743979A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103590091A (en) * | 2013-11-21 | 2014-02-19 | 沈阳仪表科学研究院有限公司 | Machining method of multilayer ultrathin diamond blade |
| CN111825460A (en) * | 2020-07-31 | 2020-10-27 | 贵州师范学院 | High-efficiency low-cost thermal reduction nickel plating method for silicon carbide particle surface |
-
1980
- 1980-08-27 JP JP11820480A patent/JPS5743979A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103590091A (en) * | 2013-11-21 | 2014-02-19 | 沈阳仪表科学研究院有限公司 | Machining method of multilayer ultrathin diamond blade |
| CN103590091B (en) * | 2013-11-21 | 2016-07-20 | 沈阳仪表科学研究院有限公司 | The processing method of Multilayer ultrathin diamond blade |
| CN111825460A (en) * | 2020-07-31 | 2020-10-27 | 贵州师范学院 | High-efficiency low-cost thermal reduction nickel plating method for silicon carbide particle surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6241317B2 (en) | 1987-09-02 |
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