JPS5742156A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5742156A JPS5742156A JP11761880A JP11761880A JPS5742156A JP S5742156 A JPS5742156 A JP S5742156A JP 11761880 A JP11761880 A JP 11761880A JP 11761880 A JP11761880 A JP 11761880A JP S5742156 A JPS5742156 A JP S5742156A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- glass tube
- leads
- glass
- flanges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain an inexpensive device which can prevent cracks without using Jumet wire, by filling low melting point glass or synthetic resin in a gap between the vicinity of flange parts of electrode leads and a glass tube. CONSTITUTION:An Si diode 11 is compressed and supported by the flanges 13 machined at the tips of a pair of the electrode leads 12, and arranged in the glass tube 14. The leads 12 are fixed by the low melting point glass 15 or the synthetic resin which is filled and solidified in the gap between the vicinity of the flanges and the tube 14. Therefore, a supporting material made of expensive wire and welding to external leads as seen in conventional methods are not required, and the cost is reduced. Since the diameter of the lead 12 is smaller than that of the tube 14, stress applied on the glass tube 14 due to thermal expansion can be eased by the pressure of the layer 15, and the cracks are not generated in the glass tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761880A JPS5742156A (en) | 1980-08-26 | 1980-08-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761880A JPS5742156A (en) | 1980-08-26 | 1980-08-26 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5742156A true JPS5742156A (en) | 1982-03-09 |
Family
ID=14716205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11761880A Pending JPS5742156A (en) | 1980-08-26 | 1980-08-26 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5742156A (en) |
-
1980
- 1980-08-26 JP JP11761880A patent/JPS5742156A/en active Pending
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