JPS5742155A - Heat pipe type heat sink - Google Patents

Heat pipe type heat sink

Info

Publication number
JPS5742155A
JPS5742155A JP55117607A JP11760780A JPS5742155A JP S5742155 A JPS5742155 A JP S5742155A JP 55117607 A JP55117607 A JP 55117607A JP 11760780 A JP11760780 A JP 11760780A JP S5742155 A JPS5742155 A JP S5742155A
Authority
JP
Japan
Prior art keywords
heat
fins
heat pipe
pushing
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55117607A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634352B2 (cg-RX-API-DMAC7.html
Inventor
Shinichi Ishida
Hideo Sakurai
Susumu Ogiwara
Takashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP55117607A priority Critical patent/JPS5742155A/ja
Publication of JPS5742155A publication Critical patent/JPS5742155A/ja
Publication of JPS634352B2 publication Critical patent/JPS634352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55117607A 1980-08-26 1980-08-26 Heat pipe type heat sink Granted JPS5742155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55117607A JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55117607A JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Publications (2)

Publication Number Publication Date
JPS5742155A true JPS5742155A (en) 1982-03-09
JPS634352B2 JPS634352B2 (cg-RX-API-DMAC7.html) 1988-01-28

Family

ID=14715950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55117607A Granted JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Country Status (1)

Country Link
JP (1) JPS5742155A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013011636A1 (ja) * 2011-07-20 2013-01-24 ダイキン工業株式会社 冷媒配管の取付構造

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013011636A1 (ja) * 2011-07-20 2013-01-24 ダイキン工業株式会社 冷媒配管の取付構造
JP2013042115A (ja) * 2011-07-20 2013-02-28 Daikin Ind Ltd 冷媒配管の取付構造
CN103688605A (zh) * 2011-07-20 2014-03-26 大金工业株式会社 制冷剂管道的安装构造
AU2012285311B2 (en) * 2011-07-20 2015-04-02 Daikin Industries, Ltd. Refrigerant pipe attachment structure
US9784506B2 (en) 2011-07-20 2017-10-10 Dakin Industries, Ltd. Refrigerant pipe attachment structure

Also Published As

Publication number Publication date
JPS634352B2 (cg-RX-API-DMAC7.html) 1988-01-28

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