JPS5740918B2 - - Google Patents

Info

Publication number
JPS5740918B2
JPS5740918B2 JP54100772A JP10077279A JPS5740918B2 JP S5740918 B2 JPS5740918 B2 JP S5740918B2 JP 54100772 A JP54100772 A JP 54100772A JP 10077279 A JP10077279 A JP 10077279A JP S5740918 B2 JPS5740918 B2 JP S5740918B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54100772A
Other languages
Japanese (ja)
Other versions
JPS56102590A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10077279A priority Critical patent/JPS56102590A/ja
Priority to US06/133,130 priority patent/US4287029A/en
Priority to US06/206,873 priority patent/US4348267A/en
Publication of JPS56102590A publication Critical patent/JPS56102590A/ja
Publication of JPS5740918B2 publication Critical patent/JPS5740918B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacture Of Switches (AREA)
JP10077279A 1979-08-09 1979-08-09 Method and device for plating of microarea Granted JPS56102590A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10077279A JPS56102590A (en) 1979-08-09 1979-08-09 Method and device for plating of microarea
US06/133,130 US4287029A (en) 1979-08-09 1980-03-24 Plating process
US06/206,873 US4348267A (en) 1979-08-09 1980-11-14 Plating means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10077279A JPS56102590A (en) 1979-08-09 1979-08-09 Method and device for plating of microarea

Publications (2)

Publication Number Publication Date
JPS56102590A JPS56102590A (en) 1981-08-17
JPS5740918B2 true JPS5740918B2 (OSRAM) 1982-08-31

Family

ID=14282771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10077279A Granted JPS56102590A (en) 1979-08-09 1979-08-09 Method and device for plating of microarea

Country Status (2)

Country Link
US (2) US4287029A (OSRAM)
JP (1) JPS56102590A (OSRAM)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827993A (ja) * 1981-08-10 1983-02-18 Sonitsukusu:Kk 微小部分メツキ方法及びその装置
JPS5852034B2 (ja) * 1981-08-26 1983-11-19 株式会社ソニツクス 部分メツキ方法及びその装置
JPS5887294A (ja) * 1981-11-18 1983-05-25 Sonitsukusu:Kk 微小部分表面処理方法及びその装置
JPS60257016A (ja) * 1984-06-04 1985-12-18 日本電気株式会社 リ−ドスイツチ接点メツキ方法
FR2592895B1 (fr) * 1986-01-16 1990-11-16 Selectrons France Installation pour la realisation de traitements electrolytiques localises de surfaces.
JP2673290B2 (ja) * 1987-08-06 1997-11-05 株式会社 生野製作所 リードスイッチ用リード片のメッキ方法及びメッキ装置
JP2624703B2 (ja) * 1987-09-24 1997-06-25 株式会社東芝 バンプの形成方法及びその装置
US5032235A (en) * 1988-07-27 1991-07-16 The Boeing Company Method and apparatus for plating through holes in graphite composites
US4890727A (en) * 1988-07-27 1990-01-02 Osteo-Dyne, Inc. Method and apparatus for plating through holes in graphite composites
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.
US5279725A (en) * 1992-03-18 1994-01-18 The Boeing Company Apparatus and method for electroplating a workpiece
FR2688804A1 (fr) * 1992-03-20 1993-09-24 Souriau & Cie Procede de depot electrolytique selectif d'un metal notamment d'un metal noble tel que l'or sur la face interne de corps creux en forme de douille notamment d'elements de contact de connecteur machine pour la mise en óoeuvre du procede, produit obtenu.
RU2077611C1 (ru) * 1996-03-20 1997-04-20 Виталий Макарович Рябков Способ обработки поверхностей и устройство для его осуществления
US5830334A (en) * 1996-11-07 1998-11-03 Kobayashi; Hideyuki Nozzle for fast plating with plating solution jetting and suctioning functions
JP3523197B2 (ja) * 1998-02-12 2004-04-26 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
WO2000061837A1 (en) 1999-04-13 2000-10-19 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7273535B2 (en) * 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
JPWO2002091350A1 (ja) 2001-05-02 2004-08-26 後藤ガット有限会社 弦楽器用糸巻装置
EP1481114A4 (en) 2001-08-31 2005-06-22 Semitool Inc DEVICE AND METHOD FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES
JP3949504B2 (ja) * 2002-04-25 2007-07-25 英夫 吉田 母材表面の活性化処理方法および活性化処理装置
JP2014040633A (ja) * 2012-08-22 2014-03-06 Jtekt Corp パターン形成装置及びパターン形成方法
CN111455438B (zh) * 2020-03-11 2022-07-15 贵州振华群英电器有限公司（国营第八九一厂） 一种继电器基座局部电镀夹具
JP7517250B2 (ja) * 2021-06-01 2024-07-17 トヨタ自動車株式会社 金属皮膜の成膜方法および金属皮膜の成膜装置
CN118179877A (zh) * 2024-03-18 2024-06-14 隆基绿能科技股份有限公司 一种镀覆方法、镀覆喷头和镀覆装置
CN118166412A (zh) * 2024-05-14 2024-06-11 苏州太阳井新能源有限公司 电镀设备及其使用方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL208297A (OSRAM) * 1955-06-23
US3075902A (en) * 1956-03-30 1963-01-29 Philco Corp Jet-electrolytic etching and measuring method
US2958636A (en) * 1956-09-10 1960-11-01 Philco Corp Method of the application of liquids to solids
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
US3962063A (en) * 1974-12-18 1976-06-08 Advanced Materials Systems, Inc. Selective plating apparatus
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
JPS51159731U (OSRAM) * 1975-06-14 1976-12-18
US4033844A (en) * 1975-11-03 1977-07-05 National Semiconductor Corporation Apparatus for selectively plating lead frames
US4118303A (en) * 1976-08-30 1978-10-03 Burroughs Corporation Apparatus for chemically treating a single side of a workpiece
DE2705158C2 (de) * 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum Teilgalvanisieren

Also Published As

Publication number Publication date
US4287029A (en) 1981-09-01
US4348267A (en) 1982-09-07
JPS56102590A (en) 1981-08-17

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