JPS5738351A - Glass connected structure - Google Patents

Glass connected structure

Info

Publication number
JPS5738351A
JPS5738351A JP10923480A JP10923480A JPS5738351A JP S5738351 A JPS5738351 A JP S5738351A JP 10923480 A JP10923480 A JP 10923480A JP 10923480 A JP10923480 A JP 10923480A JP S5738351 A JPS5738351 A JP S5738351A
Authority
JP
Japan
Prior art keywords
glass
duct
solder
connected structure
overlapping part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10923480A
Other languages
Japanese (ja)
Inventor
Eizo Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10923480A priority Critical patent/JPS5738351A/en
Publication of JPS5738351A publication Critical patent/JPS5738351A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent a soft metallic duct from being oxidizing and cracked during soldering and to obtain a strong glass connected structure by coating the outside of the overlapping part of the duct with a glass film when an opposite member is inserted in the duct and connected with glass.
CONSTITUTION: An open end 21a of a soft metallic duct 21 is dipped in molten glass solder to electrodeposit glass solder 24 on the inner and outer surfaces of the overlapping part. This overlapping part 23 is heated with a flame from a burner to soften the solder 24, and the end part 22a of an opposite member 22 is inserted in the end 21a of the duct 21. After further heating the part 23 to melt the solder 24, the heating is stopped to finish glass soldering work. By this operation the part 23 is strengthened with a glass film 26 to prevent the glass joined part from being peeled off, and a strong glass connected structure withstanding bending and twisting is obtd.
COPYRIGHT: (C)1982,JPO&Japio
JP10923480A 1980-08-11 1980-08-11 Glass connected structure Pending JPS5738351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10923480A JPS5738351A (en) 1980-08-11 1980-08-11 Glass connected structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10923480A JPS5738351A (en) 1980-08-11 1980-08-11 Glass connected structure

Publications (1)

Publication Number Publication Date
JPS5738351A true JPS5738351A (en) 1982-03-03

Family

ID=14505009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10923480A Pending JPS5738351A (en) 1980-08-11 1980-08-11 Glass connected structure

Country Status (1)

Country Link
JP (1) JPS5738351A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114163145A (en) * 2021-11-01 2022-03-11 中国科学院上海光学精密机械研究所 Sealing method of quartz substrate with metal electrode and special clamp thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114163145A (en) * 2021-11-01 2022-03-11 中国科学院上海光学精密机械研究所 Sealing method of quartz substrate with metal electrode and special clamp thereof
CN114163145B (en) * 2021-11-01 2023-12-01 中国科学院上海光学精密机械研究所 Sealing method of quartz substrate with metal electrode and special fixture thereof

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