JPS5736841A - Chip testing device - Google Patents
Chip testing deviceInfo
- Publication number
- JPS5736841A JPS5736841A JP11280380A JP11280380A JPS5736841A JP S5736841 A JPS5736841 A JP S5736841A JP 11280380 A JP11280380 A JP 11280380A JP 11280380 A JP11280380 A JP 11280380A JP S5736841 A JPS5736841 A JP S5736841A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- tested
- mercury
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE:To enable the electric connection of a chip to an external circuit without damage to the chip to be tested by utilizing the projection of mercury filled in a substrate as the end of a probe. CONSTITUTION:A chip 5 to be tested is supported by a support 9 for the chip to be tested, and a socket substrate 10 is secured by a guide post 11 to a base substrate 8. An elevationally movable wiring substrate 12 is mounted on the post 11. The substrate 10 has a lower half part 10-1 and an upper half part 10-2 with a plurality of cavities 10 having wide interior and narrow inlet and mercury 13 filled therein. A terminal 6 of the chip 5 to be tested is inserted into one inlet of the substrate 10, and a test pin 15 on the wire 14 of a strip line formed on the substrate 12 is inserted into the other inlet. In this manner the chip 5 to be tested and the wire 14 on the substrate 12 are electrically connected via the mercury 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11280380A JPS5736841A (en) | 1980-08-15 | 1980-08-15 | Chip testing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11280380A JPS5736841A (en) | 1980-08-15 | 1980-08-15 | Chip testing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5736841A true JPS5736841A (en) | 1982-02-27 |
JPS6138857B2 JPS6138857B2 (en) | 1986-09-01 |
Family
ID=14595913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11280380A Granted JPS5736841A (en) | 1980-08-15 | 1980-08-15 | Chip testing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5736841A (en) |
-
1980
- 1980-08-15 JP JP11280380A patent/JPS5736841A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6138857B2 (en) | 1986-09-01 |
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