JPS5730860Y2 - - Google Patents

Info

Publication number
JPS5730860Y2
JPS5730860Y2 JP1979058933U JP5893379U JPS5730860Y2 JP S5730860 Y2 JPS5730860 Y2 JP S5730860Y2 JP 1979058933 U JP1979058933 U JP 1979058933U JP 5893379 U JP5893379 U JP 5893379U JP S5730860 Y2 JPS5730860 Y2 JP S5730860Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979058933U
Other versions
JPS552180U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS552180U publication Critical patent/JPS552180U/ja
Application granted granted Critical
Publication of JPS5730860Y2 publication Critical patent/JPS5730860Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
JP1979058933U 1974-10-30 1979-05-04 Expired JPS5730860Y2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742451549 DE2451549A1 (de) 1974-10-30 1974-10-30 Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien

Publications (2)

Publication Number Publication Date
JPS552180U JPS552180U (ja) 1980-01-09
JPS5730860Y2 true JPS5730860Y2 (ja) 1982-07-07

Family

ID=5929593

Family Applications (2)

Application Number Title Priority Date Filing Date
JP50129427A Pending JPS5168182A (ja) 1974-10-30 1975-10-29
JP1979058933U Expired JPS5730860Y2 (ja) 1974-10-30 1979-05-04

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP50129427A Pending JPS5168182A (ja) 1974-10-30 1975-10-29

Country Status (3)

Country Link
US (1) US4002246A (ja)
JP (2) JPS5168182A (ja)
DE (1) DE2451549A1 (ja)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4186918A (en) * 1977-12-12 1980-02-05 International Business Machines Corporation Method and apparatus for locating and aligning flimsy sheets
US4224504A (en) * 1978-06-21 1980-09-23 General Electric Company Apparatus for practicing temperature gradient zone melting
US4221956A (en) * 1978-06-21 1980-09-09 General Electric Company Apparatus for practising temperature gradient zone melting
US4364707A (en) * 1980-05-06 1982-12-21 Advanced Semiconductor Materials Die Bonding Inc. Object transport apparatus
JPS57178754A (en) * 1981-04-25 1982-11-04 Shin Nippon Koki Kk Transfer unit for decorating machine of outer periphery of cylindrical article
DE3305934A1 (de) * 1983-02-21 1984-08-23 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur temperaturbehandlung von substraten, insbesondere von halbleiterkristallscheiben
DE3401856C2 (de) * 1984-01-20 1986-04-24 Dr. Johannes Heidenhain Gmbh, 8225 Traunreut Kontaktkopiereinrichtung
DE3421169A1 (de) * 1984-06-07 1985-12-12 Mauser-Werke Oberndorf Gmbh, 7238 Oberndorf Verfahren und vorrichtung zum automatischen uebergeben und spannen von werkstuecken
JPH0418798Y2 (ja) * 1985-06-08 1992-04-27
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung
US4899719A (en) * 1987-07-31 1990-02-13 Mitsubishi Kinsoku Kabushiki Kaisha Apparatus for collecting wafers
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
JPH0634923Y2 (ja) * 1988-11-09 1994-09-14 マツダ株式会社 研削盤におけるワーク移送装置
JP2714833B2 (ja) * 1988-12-18 1998-02-16 日本真空技術株式会社 仕込・取出室
DE4108780C2 (de) * 1991-03-18 1994-12-15 D Andres Malfaz Prieto Vorrichtung zum Zusammenlegen von dünnen Trägermaterialien
JPH05129796A (ja) * 1991-09-25 1993-05-25 Toshiba Corp 部品実装装置
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5398459A (en) * 1992-11-27 1995-03-21 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5755613A (en) * 1994-08-31 1998-05-26 Matsushita Electric Industrial Co., Ltd. Two grinder opposed grinding apparatus and a method of grinding with the apparatus
US5893794A (en) * 1996-02-28 1999-04-13 Ebara Corporation Polishing apparatus having robotic transport apparatus
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
JP3691345B2 (ja) 2000-05-25 2005-09-07 三菱電機株式会社 永久磁石型電動機
CN102001030B (zh) * 2010-09-27 2012-02-15 浙江大学 双端面磨床自动送取料机械手
DE102011100828A1 (de) * 2011-05-07 2012-11-08 Eisenmann Ag Vorrichtung zum Umsetzen von Fahrzeugrädern
CN109606806A (zh) * 2018-12-29 2019-04-12 楚天科技股份有限公司 一种变节距传输结构及其传输方法
CN110370111B (zh) * 2019-08-05 2021-02-19 桂林航天工业学院 汽车用碳纤维薄板制备装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4428387Y1 (ja) * 1966-10-19 1969-11-25
JPS4933186U (ja) * 1972-06-27 1974-03-23

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS424336Y1 (ja) * 1964-09-09 1967-03-09
US3272350A (en) * 1964-09-25 1966-09-13 Westinghouse Electric Corp Method and apparatus for semiconductor wafer handling
US3437096A (en) * 1967-02-13 1969-04-08 William H Warren Egg transferring device
US3601243A (en) * 1969-05-29 1971-08-24 Interpace Corp Transfer mechanism
US3753509A (en) * 1971-04-16 1973-08-21 Procter & Gamble Bottle uncaser-single liner
US3860125A (en) * 1973-06-08 1975-01-14 Ford Motor Co Trim separation
US3849944A (en) * 1973-11-05 1974-11-26 Corning Glass Works Transfer and grinding apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4428387Y1 (ja) * 1966-10-19 1969-11-25
JPS4933186U (ja) * 1972-06-27 1974-03-23

Also Published As

Publication number Publication date
JPS552180U (ja) 1980-01-09
DE2451549A1 (de) 1976-08-12
US4002246A (en) 1977-01-11
JPS5168182A (ja) 1976-06-12

Similar Documents

Publication Publication Date Title
JPS50102435A (ja)
JPS50119616A (ja)
BG20145A1 (ja)
BG20225A1 (ja)
BG20481A1 (ja)
BG20513A1 (ja)
BG20961A1 (ja)
BG21522A1 (ja)
BG21717A1 (ja)
BG21719A1 (ja)
BG22091A1 (ja)
BG22593A1 (ja)
CH567395A5 (ja)
CH571930A5 (ja)
CH573773A5 (ja)
CH574507A5 (ja)
CH576200A5 (ja)
CH577755A5 (ja)
CH578309A5 (ja)
CH579937A5 (ja)
CH580202A5 (ja)
CH580938A5 (ja)
CH581146A5 (ja)
CH581383A5 (ja)
CH581413A5 (ja)