JPS5168182A - - Google Patents

Info

Publication number
JPS5168182A
JPS5168182A JP50129427A JP12942775A JPS5168182A JP S5168182 A JPS5168182 A JP S5168182A JP 50129427 A JP50129427 A JP 50129427A JP 12942775 A JP12942775 A JP 12942775A JP S5168182 A JPS5168182 A JP S5168182A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50129427A
Inventor
Kooraru Ueruneru
Buranto Georuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PAURU MYUURERU
Original Assignee
PAURU MYUURERU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PAURU MYUURERU filed Critical PAURU MYUURERU
Publication of JPS5168182A publication Critical patent/JPS5168182A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Workpieces (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP50129427A 1974-10-30 1975-10-29 Pending JPS5168182A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742451549 DE2451549A1 (de) 1974-10-30 1974-10-30 Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien

Publications (1)

Publication Number Publication Date
JPS5168182A true JPS5168182A (ja) 1976-06-12

Family

ID=5929593

Family Applications (2)

Application Number Title Priority Date Filing Date
JP50129427A Pending JPS5168182A (ja) 1974-10-30 1975-10-29
JP1979058933U Expired JPS5730860Y2 (ja) 1974-10-30 1979-05-04

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1979058933U Expired JPS5730860Y2 (ja) 1974-10-30 1979-05-04

Country Status (3)

Country Link
US (1) US4002246A (ja)
JP (2) JPS5168182A (ja)
DE (1) DE2451549A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178754A (en) * 1981-04-25 1982-11-04 Shin Nippon Koki Kk Transfer unit for decorating machine of outer periphery of cylindrical article
JPS61201794U (ja) * 1985-06-08 1986-12-18
US6462452B2 (en) 2000-05-25 2002-10-08 Mitsubishi Denki Kabushiki Kaisha Permanent magnet motor

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4186918A (en) * 1977-12-12 1980-02-05 International Business Machines Corporation Method and apparatus for locating and aligning flimsy sheets
US4221956A (en) * 1978-06-21 1980-09-09 General Electric Company Apparatus for practising temperature gradient zone melting
US4224504A (en) * 1978-06-21 1980-09-23 General Electric Company Apparatus for practicing temperature gradient zone melting
US4364707A (en) * 1980-05-06 1982-12-21 Advanced Semiconductor Materials Die Bonding Inc. Object transport apparatus
DE3305934A1 (de) * 1983-02-21 1984-08-23 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur temperaturbehandlung von substraten, insbesondere von halbleiterkristallscheiben
DE3401856C2 (de) * 1984-01-20 1986-04-24 Dr. Johannes Heidenhain Gmbh, 8225 Traunreut Kontaktkopiereinrichtung
DE3421169A1 (de) * 1984-06-07 1985-12-12 Mauser-Werke Oberndorf Gmbh, 7238 Oberndorf Verfahren und vorrichtung zum automatischen uebergeben und spannen von werkstuecken
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4653231A (en) * 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung
US4899719A (en) * 1987-07-31 1990-02-13 Mitsubishi Kinsoku Kabushiki Kaisha Apparatus for collecting wafers
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
JPH0634923Y2 (ja) * 1988-11-09 1994-09-14 マツダ株式会社 研削盤におけるワーク移送装置
JP2714833B2 (ja) * 1988-12-18 1998-02-16 日本真空技術株式会社 仕込・取出室
DE4108780C2 (de) * 1991-03-18 1994-12-15 D Andres Malfaz Prieto Vorrichtung zum Zusammenlegen von dünnen Trägermaterialien
JPH05129796A (ja) * 1991-09-25 1993-05-25 Toshiba Corp 部品実装装置
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5398459A (en) * 1992-11-27 1995-03-21 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5755613A (en) * 1994-08-31 1998-05-26 Matsushita Electric Industrial Co., Ltd. Two grinder opposed grinding apparatus and a method of grinding with the apparatus
EP1498934A3 (en) * 1996-02-28 2005-12-21 Ebara Corporation Robotic wafer transport apparatus
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
CN102001030B (zh) * 2010-09-27 2012-02-15 浙江大学 双端面磨床自动送取料机械手
DE102011100828A1 (de) * 2011-05-07 2012-11-08 Eisenmann Ag Vorrichtung zum Umsetzen von Fahrzeugrädern
CN109606806A (zh) * 2018-12-29 2019-04-12 楚天科技股份有限公司 一种变节距传输结构及其传输方法
CN110370111B (zh) * 2019-08-05 2021-02-19 桂林航天工业学院 汽车用碳纤维薄板制备装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS424336Y1 (ja) * 1964-09-09 1967-03-09
JPS4428387Y1 (ja) * 1966-10-19 1969-11-25
JPS4933186U (ja) * 1972-06-27 1974-03-23

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272350A (en) * 1964-09-25 1966-09-13 Westinghouse Electric Corp Method and apparatus for semiconductor wafer handling
US3437096A (en) * 1967-02-13 1969-04-08 William H Warren Egg transferring device
US3601243A (en) * 1969-05-29 1971-08-24 Interpace Corp Transfer mechanism
US3753509A (en) * 1971-04-16 1973-08-21 Procter & Gamble Bottle uncaser-single liner
US3860125A (en) * 1973-06-08 1975-01-14 Ford Motor Co Trim separation
US3849944A (en) * 1973-11-05 1974-11-26 Corning Glass Works Transfer and grinding apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS424336Y1 (ja) * 1964-09-09 1967-03-09
JPS4428387Y1 (ja) * 1966-10-19 1969-11-25
JPS4933186U (ja) * 1972-06-27 1974-03-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178754A (en) * 1981-04-25 1982-11-04 Shin Nippon Koki Kk Transfer unit for decorating machine of outer periphery of cylindrical article
JPS6233952B2 (ja) * 1981-04-25 1987-07-23 Shin Nippon Koki Co Ltd
JPS61201794U (ja) * 1985-06-08 1986-12-18
JPH0418798Y2 (ja) * 1985-06-08 1992-04-27
US6462452B2 (en) 2000-05-25 2002-10-08 Mitsubishi Denki Kabushiki Kaisha Permanent magnet motor

Also Published As

Publication number Publication date
JPS5730860Y2 (ja) 1982-07-07
US4002246A (en) 1977-01-11
DE2451549A1 (de) 1976-08-12
JPS552180U (ja) 1980-01-09

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