JPS572890A - Gold alloy plating bath - Google Patents
Gold alloy plating bathInfo
- Publication number
- JPS572890A JPS572890A JP7739880A JP7739880A JPS572890A JP S572890 A JPS572890 A JP S572890A JP 7739880 A JP7739880 A JP 7739880A JP 7739880 A JP7739880 A JP 7739880A JP S572890 A JPS572890 A JP S572890A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- metals
- plating bath
- excess
- complexing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 5
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 4
- 239000010931 gold Substances 0.000 abstract 4
- 229910052737 gold Inorganic materials 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 150000002739 metals Chemical class 0.000 abstract 3
- 229910052755 nonmetal Inorganic materials 0.000 abstract 3
- 150000002843 nonmetals Chemical class 0.000 abstract 3
- 230000000536 complexating effect Effects 0.000 abstract 2
- 239000008139 complexing agent Substances 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 abstract 1
- 230000000737 periodic effect Effects 0.000 abstract 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7739880A JPS572890A (en) | 1980-06-09 | 1980-06-09 | Gold alloy plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7739880A JPS572890A (en) | 1980-06-09 | 1980-06-09 | Gold alloy plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS572890A true JPS572890A (en) | 1982-01-08 |
JPS6312954B2 JPS6312954B2 (enrdf_load_stackoverflow) | 1988-03-23 |
Family
ID=13632785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7739880A Granted JPS572890A (en) | 1980-06-09 | 1980-06-09 | Gold alloy plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS572890A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1300487A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455839U (enrdf_load_stackoverflow) * | 1990-09-19 | 1992-05-13 |
-
1980
- 1980-06-09 JP JP7739880A patent/JPS572890A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1300487A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6773573B2 (en) | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS6312954B2 (enrdf_load_stackoverflow) | 1988-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES434856A1 (es) | Perfeccionamientos en la produccion de banos acidos acuososde electro-deposicion de estano. | |
ES438408A1 (es) | Procedimiento para la preparacion de un bano para la depo- sicion de aleaciones de metales nobles por via galvanica. | |
JPS569386A (en) | Production of electro-zinc plated steel plate | |
JPS56116894A (en) | Neutral tin electroplating bath for obtaining dense plated coating | |
JPS572890A (en) | Gold alloy plating bath | |
JPS5689716A (en) | Spectacle frame material | |
DE3463528D1 (en) | Process for the deposition of low carat brilliant gold-silver alloy coatings | |
JPS56152958A (en) | Electroless gold plating solution | |
JPS55110792A (en) | Surface treated steel plate | |
JPS5481777A (en) | Lead frame structure with intermediate layer | |
KR840004185A (ko) | 금속의 킬레이트화 | |
KR850000538A (ko) | 고속 은도금 | |
JPS5726190A (en) | Strong acid bath for electroplating gold alloy with low platinum metal content | |
DE69011549D1 (de) | Elektroplattierung von Gold enthaltenden Legierungen. | |
JPS55107795A (en) | Gold tin alloy electroplating bath and plating method | |
JPS5521513A (en) | Immersion plating method of lead or lead alloy on casting | |
JPS5760092A (en) | Copper-tin alloy plating bath | |
JPS5684495A (en) | Pure gold plating liquid | |
JPS56126094A (en) | Welding wire | |
KR0168321B1 (ko) | 동 합금 및 철-니켈 합금 소재의 하지도금 조성물 및 하지도금 방법 | |
JPS565997A (en) | Manufacture of hard gold alloy coating | |
JPS5760089A (en) | Electroplating solution used to form zn-ti alloy plated film on steel surface | |
JPS5554589A (en) | Plating method of electronic parts which prevent production of zinc whisker | |
Schulze-Berge | Palladium--Nickel: An Alternative to Gold | |
JPS575886A (en) | Gold alloy plating bath |