JPS5727189B2 - - Google Patents

Info

Publication number
JPS5727189B2
JPS5727189B2 JP5765773A JP5765773A JPS5727189B2 JP S5727189 B2 JPS5727189 B2 JP S5727189B2 JP 5765773 A JP5765773 A JP 5765773A JP 5765773 A JP5765773 A JP 5765773A JP S5727189 B2 JPS5727189 B2 JP S5727189B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5765773A
Other languages
Japanese (ja)
Other versions
JPS4952133A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4952133A publication Critical patent/JPS4952133A/ja
Publication of JPS5727189B2 publication Critical patent/JPS5727189B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP5765773A 1972-06-19 1973-05-23 Expired JPS5727189B2 (enrdf_load_html_response)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00264193A US3804729A (en) 1972-06-19 1972-06-19 Electrolyte and process for electro-depositing copper

Publications (2)

Publication Number Publication Date
JPS4952133A JPS4952133A (enrdf_load_html_response) 1974-05-21
JPS5727189B2 true JPS5727189B2 (enrdf_load_html_response) 1982-06-09

Family

ID=23004985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5765773A Expired JPS5727189B2 (enrdf_load_html_response) 1972-06-19 1973-05-23

Country Status (11)

Country Link
US (1) US3804729A (enrdf_load_html_response)
JP (1) JPS5727189B2 (enrdf_load_html_response)
AR (1) AR200018A1 (enrdf_load_html_response)
BR (1) BR7304502D0 (enrdf_load_html_response)
CA (1) CA1038326A (enrdf_load_html_response)
DE (1) DE2331180C2 (enrdf_load_html_response)
FR (1) FR2190943B1 (enrdf_load_html_response)
GB (1) GB1433039A (enrdf_load_html_response)
IT (1) IT988460B (enrdf_load_html_response)
NL (1) NL7308515A (enrdf_load_html_response)
ZA (1) ZA733838B (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
DE4126502C1 (enrdf_load_html_response) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating

Also Published As

Publication number Publication date
AR200018A1 (es) 1974-10-15
AU5622773A (en) 1974-12-05
CA1038326A (en) 1978-09-12
JPS4952133A (enrdf_load_html_response) 1974-05-21
FR2190943A1 (enrdf_load_html_response) 1974-02-01
US3804729A (en) 1974-04-16
ZA733838B (en) 1974-08-28
FR2190943B1 (enrdf_load_html_response) 1977-09-09
IT988460B (it) 1975-04-10
DE2331180A1 (de) 1974-01-17
BR7304502D0 (pt) 1974-08-15
GB1433039A (en) 1976-04-22
DE2331180C2 (de) 1982-12-23
NL7308515A (enrdf_load_html_response) 1973-12-21

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