JPS572538A - Automatic bonding apparatus - Google Patents

Automatic bonding apparatus

Info

Publication number
JPS572538A
JPS572538A JP7638580A JP7638580A JPS572538A JP S572538 A JPS572538 A JP S572538A JP 7638580 A JP7638580 A JP 7638580A JP 7638580 A JP7638580 A JP 7638580A JP S572538 A JPS572538 A JP S572538A
Authority
JP
Japan
Prior art keywords
pellets
corrected
bonding
detecting
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7638580A
Other languages
Japanese (ja)
Inventor
Tomio Kashihara
Toshiro Tsuruta
Nobushi Suzuki
Sumio Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7638580A priority Critical patent/JPS572538A/en
Publication of JPS572538A publication Critical patent/JPS572538A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable the high speed and accurate detection of the bonding position of a workpiece by performing displacement detecting treatment in two steps. CONSTITUTION:A plurality of semiconductor pellets 1a-1h are provided on a lead frame 2, and are conveyed in a direction designated by the arrow. The displacement of two electrodes at two specified points of the pellets positioned on a detecting station 3 from the regular positions is roughly detected by the first image pickup unit 4, the detecting information from the unit is processed by arithmetic processors 6, 7, and the bonding positions of the pellets are thus corrected. Subsequently, the second image pickup unit 9 having high magnification is guided to the corrected position to precisely detect the position, an X-Y table 14 is moved and adjusted in accordance with the precise position detecting information, and the bonding positions of all the pellets are corrected. Thereafer, the pellets are bonded in accordance with the corrected position information by a bonding unit 15.
JP7638580A 1980-06-06 1980-06-06 Automatic bonding apparatus Pending JPS572538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7638580A JPS572538A (en) 1980-06-06 1980-06-06 Automatic bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7638580A JPS572538A (en) 1980-06-06 1980-06-06 Automatic bonding apparatus

Publications (1)

Publication Number Publication Date
JPS572538A true JPS572538A (en) 1982-01-07

Family

ID=13603860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7638580A Pending JPS572538A (en) 1980-06-06 1980-06-06 Automatic bonding apparatus

Country Status (1)

Country Link
JP (1) JPS572538A (en)

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