JPS5725295A - Covered material for ornament - Google Patents

Covered material for ornament

Info

Publication number
JPS5725295A
JPS5725295A JP10079480A JP10079480A JPS5725295A JP S5725295 A JPS5725295 A JP S5725295A JP 10079480 A JP10079480 A JP 10079480A JP 10079480 A JP10079480 A JP 10079480A JP S5725295 A JPS5725295 A JP S5725295A
Authority
JP
Japan
Prior art keywords
silver
covering
stainless steel
thickness
ornament
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10079480A
Other languages
Japanese (ja)
Inventor
Fujimatsu Takiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP10079480A priority Critical patent/JPS5725295A/en
Publication of JPS5725295A publication Critical patent/JPS5725295A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To obtain a covered material for ornament which has a large mechanical strength and the covering material of which, a silver based metal, will not exfoliate. This material is manufactured by covering a stainless steel material in the lengthwise direction with a silver base metal having a specific thickness ratio.
CONSTITUTION: This covered material is manufactured by covering a stainless steel material in the lengthwise direction with silver or a silver alloy having a thickness ratio of 1/200W1/2 against the thickness of the stainless steel material. Because of the stainless steel used as the base material, the mechanical strength of ornamemts manufactured from this material is improved and occurrences of rust are prevented. Moreover, because of the thickness ratio mentioned above, at least a color tone of silver is maintained and, at the same time, the cost can be reduced. A covered material 1 for ornament is obtained by covering, for example, a silver made belt material 3 having a thickness of approx. 0.01mm and the same width as the base material has, on the surface of another belt material 2 of base material, SUS 316, having a thickness of approx. 0.99mm and a width of approx. 300mm by means of a hot rolling process.
COPYRIGHT: (C)1982,JPO&Japio
JP10079480A 1980-07-23 1980-07-23 Covered material for ornament Pending JPS5725295A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10079480A JPS5725295A (en) 1980-07-23 1980-07-23 Covered material for ornament

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10079480A JPS5725295A (en) 1980-07-23 1980-07-23 Covered material for ornament

Publications (1)

Publication Number Publication Date
JPS5725295A true JPS5725295A (en) 1982-02-10

Family

ID=14283325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10079480A Pending JPS5725295A (en) 1980-07-23 1980-07-23 Covered material for ornament

Country Status (1)

Country Link
JP (1) JPS5725295A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190526A (en) * 1984-03-09 1985-09-28 Hitachi Cable Ltd Manufacture of ag-sus clad material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543467A (en) * 1977-06-09 1979-01-11 Nec Corp Semiconductor integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543467A (en) * 1977-06-09 1979-01-11 Nec Corp Semiconductor integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190526A (en) * 1984-03-09 1985-09-28 Hitachi Cable Ltd Manufacture of ag-sus clad material
JPH0354178B2 (en) * 1984-03-09 1991-08-19

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