JPS5724112A - Package construction for piezoelectric oscillating element and its forming method - Google Patents

Package construction for piezoelectric oscillating element and its forming method

Info

Publication number
JPS5724112A
JPS5724112A JP10013380A JP10013380A JPS5724112A JP S5724112 A JPS5724112 A JP S5724112A JP 10013380 A JP10013380 A JP 10013380A JP 10013380 A JP10013380 A JP 10013380A JP S5724112 A JPS5724112 A JP S5724112A
Authority
JP
Japan
Prior art keywords
cracks
paint
coating film
oscillating element
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10013380A
Other languages
Japanese (ja)
Inventor
Kiyoshi Iyama
Junichi Nishino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP10013380A priority Critical patent/JPS5724112A/en
Publication of JPS5724112A publication Critical patent/JPS5724112A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1042—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To form the package of a piezoelectric oscillating element through the use of fast drying and low cost material, by using a paint causing cracks through rapid drying and absorbing the solid phase body for air gap forming to the cracks. CONSTITUTION:A coating film 4 made of wax such as paraffin is formed to an electrode forming part of a piezoelectric porcelain plate 1. After the coating film 4 is dried and cured, for example water soluble vinyl paint is coated on the plate 1 to form a paint layer 5' having a number of cracks 7 with quick drying and curing. The wax of the coating film 4 is melted through dhe heating of the entire film and it is absorbed to the cracks 7 to form air gaps 6. Epoxy resin having airtightness is coated on the paint layer 5' to form an airtight resin layer 8.
JP10013380A 1980-07-21 1980-07-21 Package construction for piezoelectric oscillating element and its forming method Pending JPS5724112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10013380A JPS5724112A (en) 1980-07-21 1980-07-21 Package construction for piezoelectric oscillating element and its forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10013380A JPS5724112A (en) 1980-07-21 1980-07-21 Package construction for piezoelectric oscillating element and its forming method

Publications (1)

Publication Number Publication Date
JPS5724112A true JPS5724112A (en) 1982-02-08

Family

ID=14265808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10013380A Pending JPS5724112A (en) 1980-07-21 1980-07-21 Package construction for piezoelectric oscillating element and its forming method

Country Status (1)

Country Link
JP (1) JPS5724112A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025923U (en) * 1988-06-23 1990-01-16

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546874A (en) * 1977-06-20 1979-01-19 Nippon Telegr & Teleph Corp <Ntt> Thin film forming apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546874A (en) * 1977-06-20 1979-01-19 Nippon Telegr & Teleph Corp <Ntt> Thin film forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025923U (en) * 1988-06-23 1990-01-16

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