JPS5724027B2 - - Google Patents
Info
- Publication number
- JPS5724027B2 JPS5724027B2 JP10189077A JP10189077A JPS5724027B2 JP S5724027 B2 JPS5724027 B2 JP S5724027B2 JP 10189077 A JP10189077 A JP 10189077A JP 10189077 A JP10189077 A JP 10189077A JP S5724027 B2 JPS5724027 B2 JP S5724027B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07502—
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- H10W72/07521—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/932—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10189077A JPS5435679A (en) | 1977-08-25 | 1977-08-25 | Semiconductor connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10189077A JPS5435679A (en) | 1977-08-25 | 1977-08-25 | Semiconductor connection method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58030851A Division JPS593850B2 (ja) | 1983-02-28 | 1983-02-28 | 半導体ワイヤ−ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5435679A JPS5435679A (en) | 1979-03-15 |
| JPS5724027B2 true JPS5724027B2 (enExample) | 1982-05-21 |
Family
ID=14312515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10189077A Granted JPS5435679A (en) | 1977-08-25 | 1977-08-25 | Semiconductor connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5435679A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0180321U (enExample) * | 1987-11-16 | 1989-05-30 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127031A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Wire bonding |
| JPS55132049A (en) * | 1979-03-30 | 1980-10-14 | Nec Corp | Method and device for wire bonding |
| JPS55156334A (en) * | 1979-05-25 | 1980-12-05 | Hitachi Ltd | Wire bonding method and apparatus thereof |
| JPS55166934A (en) * | 1979-06-15 | 1980-12-26 | Hitachi Ltd | Automatic wire bonding method |
| JPS5630785A (en) * | 1979-08-21 | 1981-03-27 | Nippon Electric Co | Method of forming electrode on ceramic crude sheet |
| JPS5785290A (en) * | 1980-11-17 | 1982-05-27 | Fujitsu Ltd | Method of producing ceramic printed board |
| JPS61179548A (ja) * | 1986-02-07 | 1986-08-12 | Hitachi Ltd | ワイヤボンデイング装置 |
| CN108883539B (zh) | 2016-03-29 | 2021-11-02 | 生活机器人学股份有限公司 | 机械臂机构及旋转关节装置 |
| DE112017001742T5 (de) | 2016-03-29 | 2018-12-27 | Life Robotics Inc. | Torsionsgelenkmechanismus, Roboterarmmechanismus und freitragender Drehmechanismus |
| DE112017001677T5 (de) | 2016-03-29 | 2018-12-13 | Life Robotics Inc. | Näherungssensorvorrichtung und Roboterarmmechanismus |
| JP6734364B2 (ja) | 2016-03-29 | 2020-08-05 | ライフロボティクス株式会社 | 直動伸縮機構及びロボットアーム機構 |
| JP6740339B2 (ja) | 2016-03-29 | 2020-08-12 | ライフロボティクス株式会社 | 直動伸縮機構及びロボットアーム機構 |
| WO2017208872A1 (ja) | 2016-05-31 | 2017-12-07 | ライフロボティクス株式会社 | 直動伸縮機構 |
| JP6659846B2 (ja) | 2016-07-30 | 2020-03-04 | ライフロボティクス株式会社 | ロボットアーム機構 |
| WO2018079771A1 (ja) | 2016-10-31 | 2018-05-03 | ライフロボティクス株式会社 | 近接センサ装置及びロボットアーム機構 |
| WO2018079772A1 (ja) | 2016-10-31 | 2018-05-03 | ライフロボティクス株式会社 | ロボットアーム機構 |
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1977
- 1977-08-25 JP JP10189077A patent/JPS5435679A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0180321U (enExample) * | 1987-11-16 | 1989-05-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5435679A (en) | 1979-03-15 |