JPS57211758A - Electronic refrigerating element - Google Patents

Electronic refrigerating element

Info

Publication number
JPS57211758A
JPS57211758A JP9802281A JP9802281A JPS57211758A JP S57211758 A JPS57211758 A JP S57211758A JP 9802281 A JP9802281 A JP 9802281A JP 9802281 A JP9802281 A JP 9802281A JP S57211758 A JPS57211758 A JP S57211758A
Authority
JP
Japan
Prior art keywords
layer
semiconductor layers
electrode layer
telluride
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9802281A
Other languages
Japanese (ja)
Inventor
Toshisuke Hishii
Hisahide Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9802281A priority Critical patent/JPS57211758A/en
Publication of JPS57211758A publication Critical patent/JPS57211758A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To cool integrated circuit elements and the like, by arranging P type and N type semiconductor layers which perform cooling function by Peltier effect on an insulating substrate so as to face to each other and providing a conducting layer which bridges those semiconductor layers. CONSTITUTION:Electrode layers 2 and 3 formed on the aluminum insulating substrate 1. The P type semiconductor layer 4 comprising solid solution of bismuth telluride and antimony telluride is formed on the electrode layer 2. The N type semiconductor layer 5 comprising solid solution of bismuth telluride and selenium telluride is formed on the electrode layer 3. An insulating layer 6 is formed between said semiconductor layers. The conducting layer 7 which bridges the semiconductor layers 4 and 5 is formed. In this constitution, the potential of the electrode layer 3 is made positive, and a current is flowed to the electrode layer 2. Then the heat is taken out of the conducting layer 7.
JP9802281A 1981-06-24 1981-06-24 Electronic refrigerating element Pending JPS57211758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9802281A JPS57211758A (en) 1981-06-24 1981-06-24 Electronic refrigerating element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9802281A JPS57211758A (en) 1981-06-24 1981-06-24 Electronic refrigerating element

Publications (1)

Publication Number Publication Date
JPS57211758A true JPS57211758A (en) 1982-12-25

Family

ID=14208253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9802281A Pending JPS57211758A (en) 1981-06-24 1981-06-24 Electronic refrigerating element

Country Status (1)

Country Link
JP (1) JPS57211758A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132763A1 (en) * 2001-07-10 2003-01-30 Bosch Gmbh Robert Integrated semiconductor circuit with substrate carrying microwave circuit region(s)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132763A1 (en) * 2001-07-10 2003-01-30 Bosch Gmbh Robert Integrated semiconductor circuit with substrate carrying microwave circuit region(s)
DE10132763B4 (en) * 2001-07-10 2007-10-11 Robert Bosch Gmbh A semiconductor integrated circuit, a method of cooling a microwave circuit region, and a method of manufacturing a semiconductor integrated circuit

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