JPS57211471A - High accuracy polishing device for thin board member - Google Patents

High accuracy polishing device for thin board member

Info

Publication number
JPS57211471A
JPS57211471A JP56092290A JP9229081A JPS57211471A JP S57211471 A JPS57211471 A JP S57211471A JP 56092290 A JP56092290 A JP 56092290A JP 9229081 A JP9229081 A JP 9229081A JP S57211471 A JPS57211471 A JP S57211471A
Authority
JP
Japan
Prior art keywords
wafer
thickness
thin board
basis
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56092290A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6141706B2 (cg-RX-API-DMAC7.html
Inventor
Takao Nakamura
Noriyoshi Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56092290A priority Critical patent/JPS57211471A/ja
Publication of JPS57211471A publication Critical patent/JPS57211471A/ja
Publication of JPS6141706B2 publication Critical patent/JPS6141706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56092290A 1981-06-17 1981-06-17 High accuracy polishing device for thin board member Granted JPS57211471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56092290A JPS57211471A (en) 1981-06-17 1981-06-17 High accuracy polishing device for thin board member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56092290A JPS57211471A (en) 1981-06-17 1981-06-17 High accuracy polishing device for thin board member

Publications (2)

Publication Number Publication Date
JPS57211471A true JPS57211471A (en) 1982-12-25
JPS6141706B2 JPS6141706B2 (cg-RX-API-DMAC7.html) 1986-09-17

Family

ID=14050273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56092290A Granted JPS57211471A (en) 1981-06-17 1981-06-17 High accuracy polishing device for thin board member

Country Status (1)

Country Link
JP (1) JPS57211471A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347051A (ja) * 1986-08-13 1988-02-27 Hitachi Ltd 両面研削装置の砥石形状検出方法および砥石形状検出手段を備えた両面研削装置
JPH0160860U (cg-RX-API-DMAC7.html) * 1987-05-21 1989-04-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347051A (ja) * 1986-08-13 1988-02-27 Hitachi Ltd 両面研削装置の砥石形状検出方法および砥石形状検出手段を備えた両面研削装置
JPH0160860U (cg-RX-API-DMAC7.html) * 1987-05-21 1989-04-18

Also Published As

Publication number Publication date
JPS6141706B2 (cg-RX-API-DMAC7.html) 1986-09-17

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