JPS57211222A - Method of marking semiconductor chip - Google Patents

Method of marking semiconductor chip

Info

Publication number
JPS57211222A
JPS57211222A JP57099116A JP9911682A JPS57211222A JP S57211222 A JPS57211222 A JP S57211222A JP 57099116 A JP57099116 A JP 57099116A JP 9911682 A JP9911682 A JP 9911682A JP S57211222 A JPS57211222 A JP S57211222A
Authority
JP
Japan
Prior art keywords
semiconductor chip
marking semiconductor
semiconductor chips
marking
optically detectable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57099116A
Other languages
English (en)
Inventor
Shindorubetsuku Giyuntaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of JPS57211222A publication Critical patent/JPS57211222A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)
JP57099116A 1981-06-10 1982-06-09 Method of marking semiconductor chip Pending JPS57211222A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813123031 DE3123031A1 (de) 1981-06-10 1981-06-10 Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer halbleiterchip

Publications (1)

Publication Number Publication Date
JPS57211222A true JPS57211222A (en) 1982-12-25

Family

ID=6134368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57099116A Pending JPS57211222A (en) 1981-06-10 1982-06-09 Method of marking semiconductor chip

Country Status (5)

Country Link
US (1) US4947114A (ja)
EP (1) EP0066835B1 (ja)
JP (1) JPS57211222A (ja)
AT (1) ATE34487T1 (ja)
DE (2) DE3123031A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2182207B (en) * 1985-10-29 1988-12-14 Marconi Instruments Ltd Electrical circuit identification
CH670592A5 (ja) * 1986-09-22 1989-06-30 Lasarray Holding Ag
US5060371A (en) * 1988-10-05 1991-10-29 Applied Precision, Inc. Method of making probe cards
JPH02234085A (ja) * 1989-03-08 1990-09-17 Mitsubishi Electric Corp 半導体装置
ATE123705T1 (de) * 1989-03-24 1995-06-15 Canon Kk Tintendruckkopf-substrat und tintendruckkopf mit einem solchen substrat.
US5237343A (en) * 1989-03-24 1993-08-17 Canon Kabushiki Kaisha Ink jet head substrate, ink jet head having same and manufacturing method for ink jet head
ATE84637T1 (de) * 1989-06-29 1993-01-15 Siemens Ag Schaltungsanordnung zur identifikation integrierter halbleiterschaltkreise.
US5388577A (en) * 1990-06-08 1995-02-14 Boston University Electrode array microchip
US5420522A (en) * 1991-12-04 1995-05-30 Texas Instruments Incorporated Method and system for fault testing integrated circuits using a light source
US5300797A (en) * 1992-03-31 1994-04-05 Sgs-Thomson Microelectronics, Inc. Coplanar twin-well integrated circuit structure
US5357192A (en) * 1993-02-01 1994-10-18 Motorola, Inc. Method of contacting a semiconductor die with probes
IT1273339B (it) * 1994-02-24 1997-07-08 Circuit Line Spa Sistema di marcatura di circuiti stampati
DE19632116A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Chiperkennungsvorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034913A (ja) * 1972-08-22 1975-04-03
JPS5146067A (en) * 1974-10-18 1976-04-20 Nippon Electric Co Handotaisochino seizohoho

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885877A (en) * 1973-10-11 1975-05-27 Ibm Electro-optical fine alignment process
GB1520925A (en) * 1975-10-06 1978-08-09 Mullard Ltd Semiconductor device manufacture
DE2603747A1 (de) * 1976-01-31 1977-08-04 Licentia Gmbh Integrierte schaltungsanordnung
GB1584343A (en) * 1977-06-07 1981-02-11 Tokyo Shibaura Electric Co Apparatus for marking identification symbols on wafer
DE3014127A1 (de) * 1979-05-09 1980-11-27 Elektromat Veb Pruefspitze zur zwischenmessung von halbleiterchips und deren herstellungsverfahren
JPS5612755A (en) * 1979-07-11 1981-02-07 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034913A (ja) * 1972-08-22 1975-04-03
JPS5146067A (en) * 1974-10-18 1976-04-20 Nippon Electric Co Handotaisochino seizohoho

Also Published As

Publication number Publication date
EP0066835A3 (en) 1985-05-08
ATE34487T1 (de) 1988-06-15
DE3123031A1 (de) 1983-01-05
DE3278525D1 (en) 1988-06-23
EP0066835A2 (de) 1982-12-15
US4947114A (en) 1990-08-07
EP0066835B1 (de) 1988-05-18

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