JPS5721085B2 - - Google Patents
Info
- Publication number
- JPS5721085B2 JPS5721085B2 JP2959774A JP2959774A JPS5721085B2 JP S5721085 B2 JPS5721085 B2 JP S5721085B2 JP 2959774 A JP2959774 A JP 2959774A JP 2959774 A JP2959774 A JP 2959774A JP S5721085 B2 JPS5721085 B2 JP S5721085B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34127573A | 1973-03-14 | 1973-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS501040A JPS501040A (hu) | 1975-01-08 |
| JPS5721085B2 true JPS5721085B2 (hu) | 1982-05-04 |
Family
ID=23336917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2959774A Expired JPS5721085B2 (hu) | 1973-03-14 | 1974-03-14 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5721085B2 (hu) |
| DE (1) | DE2411988A1 (hu) |
| FR (1) | FR2221533A1 (hu) |
| NL (1) | NL7403364A (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0117833Y2 (hu) * | 1981-06-25 | 1989-05-24 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5682855A (en) * | 1979-12-11 | 1981-07-06 | Matsushita Electric Ind Co Ltd | Conductive paint |
| GB2072707B (en) * | 1980-03-31 | 1984-01-25 | Hitachi Chemical Co Ltd | Electroconductive paste and process for producing electroconductive metallized ceramics using the same |
| US4400214A (en) * | 1981-06-05 | 1983-08-23 | Matsushita Electric Industrial, Co., Ltd. | Conductive paste |
| US4434084A (en) * | 1981-09-23 | 1984-02-28 | E. I. Du Pont De Nemours And Company | Base metal conductor cathode coating for tantalum capacitors |
| FR2515675A1 (fr) * | 1981-11-05 | 1983-05-06 | Comp Generale Electricite | Encre conductrice pour prise de contact par serigraphie sur du silicium semi-conducteur et procede de realisation de contacts par serigraphie sur du silicium semi-conducteur |
| JPS59193972A (ja) * | 1983-04-15 | 1984-11-02 | Nippon Engeruharudo Kk | 熱可塑性導電ペ−スト組成物 |
| JPS63213975A (ja) * | 1987-03-03 | 1988-09-06 | Matsushita Electric Ind Co Ltd | 光起電力装置 |
| AT398675B (de) * | 1989-08-29 | 1995-01-25 | Austria Tech & System Tech | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
| JPH0467509A (ja) * | 1990-07-06 | 1992-03-03 | Kao Corp | 導電性ペースト及び導電性塗膜 |
| WO1996022670A1 (en) * | 1995-01-18 | 1996-07-25 | Coates Brothers Plc | Production of electrical circuit boards |
| JP6029222B1 (ja) * | 2015-07-08 | 2016-11-24 | 有限会社 ナプラ | 金属粒子、ペースト、成形体、及び、積層体 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494057A (hu) * | 1972-05-09 | 1974-01-14 |
-
1974
- 1974-03-13 NL NL7403364A patent/NL7403364A/xx unknown
- 1974-03-13 DE DE19742411988 patent/DE2411988A1/de active Pending
- 1974-03-13 FR FR7408542A patent/FR2221533A1/fr active Granted
- 1974-03-14 JP JP2959774A patent/JPS5721085B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494057A (hu) * | 1972-05-09 | 1974-01-14 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0117833Y2 (hu) * | 1981-06-25 | 1989-05-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7403364A (hu) | 1974-09-17 |
| JPS501040A (hu) | 1975-01-08 |
| FR2221533B3 (hu) | 1976-12-24 |
| DE2411988A1 (de) | 1974-09-19 |
| FR2221533A1 (en) | 1974-10-11 |