JPS57210809A - Molding method for resin and mold thereof - Google Patents

Molding method for resin and mold thereof

Info

Publication number
JPS57210809A
JPS57210809A JP9578681A JP9578681A JPS57210809A JP S57210809 A JPS57210809 A JP S57210809A JP 9578681 A JP9578681 A JP 9578681A JP 9578681 A JP9578681 A JP 9578681A JP S57210809 A JPS57210809 A JP S57210809A
Authority
JP
Japan
Prior art keywords
cavity
molten resin
bottom face
mold
pinholes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9578681A
Other languages
Japanese (ja)
Other versions
JPS6012781B2 (en
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP9578681A priority Critical patent/JPS6012781B2/en
Publication of JPS57210809A publication Critical patent/JPS57210809A/en
Publication of JPS6012781B2 publication Critical patent/JPS6012781B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the formation of voids, pinholes in inside and outside parts of a molded product, by avoiding direct contact of molten resin to the tip part of a lead frame protruding in a cavity for resin molding between upper and lower molds, pressure-injecting it to a bottom face side of said cavity. CONSTITUTION:Step parts 1a, 2a in vertical direction are shaped in a neighboring part of a wall face of a cavity 3 at both molds 1, 2, also a gate 4 provided to the upper mold 1 side is constituted to connect and open at a position so as to be at the almost same level as the bottom face 3a of the cavity at the lower mold 2, and molten resin 7 is pressure-injected from the bottom face 3a side of the cavity corresponding to a lower face side without touching a tip part 6a of a lead frame 6 directly. In such a way, molten resin poured in the cavity does not cause turbulent flow, air entrapping is hindered and formation of voids, pinholes in molded products is prevented.
JP9578681A 1981-06-19 1981-06-19 Resin sealing molding method for light emitting diode element and its mold device Expired JPS6012781B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9578681A JPS6012781B2 (en) 1981-06-19 1981-06-19 Resin sealing molding method for light emitting diode element and its mold device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9578681A JPS6012781B2 (en) 1981-06-19 1981-06-19 Resin sealing molding method for light emitting diode element and its mold device

Publications (2)

Publication Number Publication Date
JPS57210809A true JPS57210809A (en) 1982-12-24
JPS6012781B2 JPS6012781B2 (en) 1985-04-03

Family

ID=14147135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9578681A Expired JPS6012781B2 (en) 1981-06-19 1981-06-19 Resin sealing molding method for light emitting diode element and its mold device

Country Status (1)

Country Link
JP (1) JPS6012781B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042614U (en) * 1983-08-31 1985-03-26 ロ−ム株式会社 Ejection pin of resin sealing mold
JPS6096424A (en) * 1983-11-01 1985-05-30 Nec Corp Molding die
JPS63112124A (en) * 1986-10-31 1988-05-17 Nippon Zeon Co Ltd Method for reaction injection molding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124782A (en) * 1984-11-21 1986-06-12 Yasusada Sakai Gas container valve with gas discharge preventive device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042614U (en) * 1983-08-31 1985-03-26 ロ−ム株式会社 Ejection pin of resin sealing mold
JPH0225613Y2 (en) * 1983-08-31 1990-07-13
JPS6096424A (en) * 1983-11-01 1985-05-30 Nec Corp Molding die
JPH0153614B2 (en) * 1983-11-01 1989-11-15 Nippon Electric Co
JPS63112124A (en) * 1986-10-31 1988-05-17 Nippon Zeon Co Ltd Method for reaction injection molding
JPH0729320B2 (en) * 1986-10-31 1995-04-05 日本ゼオン株式会社 Reaction injection molding method

Also Published As

Publication number Publication date
JPS6012781B2 (en) 1985-04-03

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