JPS57201037A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57201037A
JPS57201037A JP56086584A JP8658481A JPS57201037A JP S57201037 A JPS57201037 A JP S57201037A JP 56086584 A JP56086584 A JP 56086584A JP 8658481 A JP8658481 A JP 8658481A JP S57201037 A JPS57201037 A JP S57201037A
Authority
JP
Japan
Prior art keywords
electrode
area
layer
stray capacity
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56086584A
Other languages
Japanese (ja)
Inventor
Takeshi Kajimura
Kazuo Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56086584A priority Critical patent/JPS57201037A/en
Publication of JPS57201037A publication Critical patent/JPS57201037A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor device having no increase in the stray capacity caused by a bonding wire and no electric shortcircuit accident by connecting the wire to an electrode in an area smaller than the area of the electrode on the operating layer of a pellet. CONSTITUTION:A bonding wire 12 is mechanically and electrically connected to an electrode 15 in an area 14 smaller than the area of the electrode 15 on an operating layer 13 of a pellet 11. In this manner, a stray capacity between collapsed bonding part at the external periphery of the layer 13 and the substrate can be eliminated. Further, the deterioration in the characteristics of a semiconductor element due to a shortcircuit of the outer periphery of an electrode metal 15 to be depressed to a substrate layer or the increase in the stray capacity between the electrode metal and the substrate layer can be prevented.
JP56086584A 1981-06-05 1981-06-05 Semiconductor device Pending JPS57201037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56086584A JPS57201037A (en) 1981-06-05 1981-06-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56086584A JPS57201037A (en) 1981-06-05 1981-06-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57201037A true JPS57201037A (en) 1982-12-09

Family

ID=13891053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56086584A Pending JPS57201037A (en) 1981-06-05 1981-06-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57201037A (en)

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