JPS57200591A - Plating apparatus - Google Patents
Plating apparatusInfo
- Publication number
- JPS57200591A JPS57200591A JP8456681A JP8456681A JPS57200591A JP S57200591 A JPS57200591 A JP S57200591A JP 8456681 A JP8456681 A JP 8456681A JP 8456681 A JP8456681 A JP 8456681A JP S57200591 A JPS57200591 A JP S57200591A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- work
- fine holes
- displaced
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 8
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8456681A JPS57200591A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8456681A JPS57200591A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57200591A true JPS57200591A (en) | 1982-12-08 |
JPS639035B2 JPS639035B2 (ja) | 1988-02-25 |
Family
ID=13834203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8456681A Granted JPS57200591A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200591A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60194156A (ja) * | 1984-03-08 | 1985-10-02 | 西村 貞三 | 横式メリヤス編機における選針ジヤツク装置 |
WO1994003655A1 (de) * | 1992-08-01 | 1994-02-17 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen behandeln von insbesondere flachem behandlungsgut, sowie anordnung, insbesondere zur durchführung dieses verfahrens |
-
1981
- 1981-06-02 JP JP8456681A patent/JPS57200591A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60194156A (ja) * | 1984-03-08 | 1985-10-02 | 西村 貞三 | 横式メリヤス編機における選針ジヤツク装置 |
WO1994003655A1 (de) * | 1992-08-01 | 1994-02-17 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen behandeln von insbesondere flachem behandlungsgut, sowie anordnung, insbesondere zur durchführung dieses verfahrens |
Also Published As
Publication number | Publication date |
---|---|
JPS639035B2 (ja) | 1988-02-25 |
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