JPS57194561A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57194561A
JPS57194561A JP7926381A JP7926381A JPS57194561A JP S57194561 A JPS57194561 A JP S57194561A JP 7926381 A JP7926381 A JP 7926381A JP 7926381 A JP7926381 A JP 7926381A JP S57194561 A JPS57194561 A JP S57194561A
Authority
JP
Japan
Prior art keywords
header
lead
slope
gradually reduced
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7926381A
Other languages
Japanese (ja)
Inventor
Toshio Iwama
Kazutoyo Narita
Tadashi Sakagami
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP7926381A priority Critical patent/JPS57194561A/en
Publication of JPS57194561A publication Critical patent/JPS57194561A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To control the wetting of solder material improving the quality level by a method wherein, when the lead with the header at the end is fixed to a semiconductor device making use of a solder material, the sectional area of the header is gradually reduced from the surface facing to the tip down to the lead. CONSTITUTION:The lead 6 is provided with the heater 6a comprising the slope 6b while said slope 6b slants so that the sectional areas of surfaces in parallel with the both main surfaces from the facing to the bottom surface of the header i.e. the tip 3 to the other one fixed to the lead 6 may be gradually reduced. Through these procedures, the bottom surface of the header 6a meets at accute angle with the slope 6b preventing the wax material 5 from getting wet at the bottom surface of the header 6a to maintain the specified thickness without deteriorating the heat resistant fatigue and the radiating capacity.
JP7926381A 1981-05-27 1981-05-27 Semiconductor device Pending JPS57194561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7926381A JPS57194561A (en) 1981-05-27 1981-05-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7926381A JPS57194561A (en) 1981-05-27 1981-05-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57194561A true JPS57194561A (en) 1982-11-30

Family

ID=13684966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7926381A Pending JPS57194561A (en) 1981-05-27 1981-05-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57194561A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020061547A (en) * 2018-10-11 2020-04-16 朋程科技股▲ふん▼有限公司 Vehicle rectifying device, rectifier, power generator, and power train

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033088U (en) * 1973-07-18 1975-04-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5033088U (en) * 1973-07-18 1975-04-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020061547A (en) * 2018-10-11 2020-04-16 朋程科技股▲ふん▼有限公司 Vehicle rectifying device, rectifier, power generator, and power train
US11508808B2 (en) 2018-10-11 2022-11-22 Actron Technology Corporation Rectifier device, rectifier, generator device, and powertrain for vehicle

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