JPS57188839A - Vertical moving mechanism for capillary - Google Patents
Vertical moving mechanism for capillaryInfo
- Publication number
- JPS57188839A JPS57188839A JP56074027A JP7402781A JPS57188839A JP S57188839 A JPS57188839 A JP S57188839A JP 56074027 A JP56074027 A JP 56074027A JP 7402781 A JP7402781 A JP 7402781A JP S57188839 A JPS57188839 A JP S57188839A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- shaft
- bearing
- motor
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56074027A JPS57188839A (en) | 1981-05-15 | 1981-05-15 | Vertical moving mechanism for capillary |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56074027A JPS57188839A (en) | 1981-05-15 | 1981-05-15 | Vertical moving mechanism for capillary |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57188839A true JPS57188839A (en) | 1982-11-19 |
| JPS6229896B2 JPS6229896B2 (enrdf_load_stackoverflow) | 1987-06-29 |
Family
ID=13535232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56074027A Granted JPS57188839A (en) | 1981-05-15 | 1981-05-15 | Vertical moving mechanism for capillary |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57188839A (enrdf_load_stackoverflow) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49124971A (enrdf_load_stackoverflow) * | 1973-04-02 | 1974-11-29 | ||
| JPS5055263A (enrdf_load_stackoverflow) * | 1973-09-12 | 1975-05-15 | ||
| JPS53144262A (en) * | 1977-05-23 | 1978-12-15 | Toshiba Corp | Bonding unit for semiconductor device |
| JPS5574152A (en) * | 1978-11-22 | 1980-06-04 | Kulicke & Soffa Ind Inc | Wire bonding device |
| JPS5773933U (enrdf_load_stackoverflow) * | 1980-10-21 | 1982-05-07 |
-
1981
- 1981-05-15 JP JP56074027A patent/JPS57188839A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49124971A (enrdf_load_stackoverflow) * | 1973-04-02 | 1974-11-29 | ||
| JPS5055263A (enrdf_load_stackoverflow) * | 1973-09-12 | 1975-05-15 | ||
| JPS53144262A (en) * | 1977-05-23 | 1978-12-15 | Toshiba Corp | Bonding unit for semiconductor device |
| JPS5574152A (en) * | 1978-11-22 | 1980-06-04 | Kulicke & Soffa Ind Inc | Wire bonding device |
| JPS5773933U (enrdf_load_stackoverflow) * | 1980-10-21 | 1982-05-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6229896B2 (enrdf_load_stackoverflow) | 1987-06-29 |
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