JPS49124971A - - Google Patents

Info

Publication number
JPS49124971A
JPS49124971A JP48036755A JP3675573A JPS49124971A JP S49124971 A JPS49124971 A JP S49124971A JP 48036755 A JP48036755 A JP 48036755A JP 3675573 A JP3675573 A JP 3675573A JP S49124971 A JPS49124971 A JP S49124971A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48036755A
Other languages
Japanese (ja)
Other versions
JPS5823743B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48036755A priority Critical patent/JPS5823743B2/ja
Publication of JPS49124971A publication Critical patent/JPS49124971A/ja
Publication of JPS5823743B2 publication Critical patent/JPS5823743B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP48036755A 1973-04-02 1973-04-02 ワイヤボンデイングソウチ Expired JPS5823743B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48036755A JPS5823743B2 (ja) 1973-04-02 1973-04-02 ワイヤボンデイングソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48036755A JPS5823743B2 (ja) 1973-04-02 1973-04-02 ワイヤボンデイングソウチ

Publications (2)

Publication Number Publication Date
JPS49124971A true JPS49124971A (enrdf_load_stackoverflow) 1974-11-29
JPS5823743B2 JPS5823743B2 (ja) 1983-05-17

Family

ID=12478544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48036755A Expired JPS5823743B2 (ja) 1973-04-02 1973-04-02 ワイヤボンデイングソウチ

Country Status (1)

Country Link
JP (1) JPS5823743B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121241A (en) * 1981-01-21 1982-07-28 Shinkawa Ltd Capillary up-and-down motion mechanism
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121241A (en) * 1981-01-21 1982-07-28 Shinkawa Ltd Capillary up-and-down motion mechanism
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary

Also Published As

Publication number Publication date
JPS5823743B2 (ja) 1983-05-17

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