JPS57185369A - Aromatic polyamide adhesive - Google Patents
Aromatic polyamide adhesiveInfo
- Publication number
- JPS57185369A JPS57185369A JP7049881A JP7049881A JPS57185369A JP S57185369 A JPS57185369 A JP S57185369A JP 7049881 A JP7049881 A JP 7049881A JP 7049881 A JP7049881 A JP 7049881A JP S57185369 A JPS57185369 A JP S57185369A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- aromatic polyamide
- compound
- added
- polar organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To provide the titled adhesive which does not lower the mechanical properties and electrical properties of adherends and is suitable for bonding heat- resistant materials, by dissolving an aromatic polyamide in a polar organic solvent, and adding a specific amount of a solvent which is a non-solvent of the polyamide.
CONSTITUTION: (A) An aromatic polyamide having an intrinsic viscosity of 0.8W 7.0 and containing the recurring units of formulaIor II (Ar1WAr3 are bifunctional aromatic ring) as ≥90mol% of the whole recurring units, is dissolved in (B) one or more polar organic solvents such as N,N-dialkylformamide, N,N- dialkylacetamide, N-alkyl-pyrrolidone, etc. at a concentration of 0.5W40(wt)%, preferably 2W25%. (C) A solvent (e.g. xylene) which is compatible with the solvent (B) and non-solvent of the compound (A), is added to the solution under stirring. The weight ratio of B/C is 97/3W30/70, preferably 93/7W60/40. If necessary, (D) the halide of an alkali metal or alkaline earth metal (e.g. CaCl2) is added to the compound (A) in an amount of ≤0.2%.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7049881A JPS57185369A (en) | 1981-05-11 | 1981-05-11 | Aromatic polyamide adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7049881A JPS57185369A (en) | 1981-05-11 | 1981-05-11 | Aromatic polyamide adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57185369A true JPS57185369A (en) | 1982-11-15 |
JPS6238396B2 JPS6238396B2 (en) | 1987-08-18 |
Family
ID=13433244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7049881A Granted JPS57185369A (en) | 1981-05-11 | 1981-05-11 | Aromatic polyamide adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57185369A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4675354A (en) * | 1982-12-01 | 1987-06-23 | A/S F. Heimann & Co. | Glue solution |
JP2003089783A (en) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | Adhesive for nylon resin molded product |
JP2003089773A (en) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | Joint for adhering nylon resin molded article and method for adhering |
-
1981
- 1981-05-11 JP JP7049881A patent/JPS57185369A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4675354A (en) * | 1982-12-01 | 1987-06-23 | A/S F. Heimann & Co. | Glue solution |
JP2003089783A (en) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | Adhesive for nylon resin molded product |
JP2003089773A (en) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | Joint for adhering nylon resin molded article and method for adhering |
JP4688373B2 (en) * | 2001-09-18 | 2011-05-25 | 宇部興産株式会社 | Nylon resin molded joint for bonding and bonding method |
Also Published As
Publication number | Publication date |
---|---|
JPS6238396B2 (en) | 1987-08-18 |
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