JPS57184243A - Molding material for sealing electronic part - Google Patents

Molding material for sealing electronic part

Info

Publication number
JPS57184243A
JPS57184243A JP56069652A JP6965281A JPS57184243A JP S57184243 A JPS57184243 A JP S57184243A JP 56069652 A JP56069652 A JP 56069652A JP 6965281 A JP6965281 A JP 6965281A JP S57184243 A JPS57184243 A JP S57184243A
Authority
JP
Japan
Prior art keywords
groups
polyester resin
unsaturated polyester
molding material
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56069652A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234182B2 (Direct
Inventor
Munetomo Torii
Tsutomu Hamada
Kenichi Tateno
Mami Yokozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56069652A priority Critical patent/JPS57184243A/ja
Publication of JPS57184243A publication Critical patent/JPS57184243A/ja
Publication of JPH0234182B2 publication Critical patent/JPH0234182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/476—

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56069652A 1981-05-08 1981-05-08 Molding material for sealing electronic part Granted JPS57184243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56069652A JPS57184243A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56069652A JPS57184243A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Publications (2)

Publication Number Publication Date
JPS57184243A true JPS57184243A (en) 1982-11-12
JPH0234182B2 JPH0234182B2 (Direct) 1990-08-01

Family

ID=13408980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56069652A Granted JPS57184243A (en) 1981-05-08 1981-05-08 Molding material for sealing electronic part

Country Status (1)

Country Link
JP (1) JPS57184243A (Direct)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122961A (ja) * 1981-11-05 1983-07-21 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ 熱硬化性樹脂状バインダー組成物
JPH10245480A (ja) * 1997-03-04 1998-09-14 Showa Highpolymer Co Ltd 封止用樹脂組成物
JP2013010947A (ja) * 2011-05-31 2013-01-17 Toto Ltd 樹脂成形体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122961A (ja) * 1981-11-05 1983-07-21 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ 熱硬化性樹脂状バインダー組成物
JPH10245480A (ja) * 1997-03-04 1998-09-14 Showa Highpolymer Co Ltd 封止用樹脂組成物
JP2013010947A (ja) * 2011-05-31 2013-01-17 Toto Ltd 樹脂成形体

Also Published As

Publication number Publication date
JPH0234182B2 (Direct) 1990-08-01

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