JPS57184243A - Molding material for sealing electronic part - Google Patents
Molding material for sealing electronic partInfo
- Publication number
- JPS57184243A JPS57184243A JP56069652A JP6965281A JPS57184243A JP S57184243 A JPS57184243 A JP S57184243A JP 56069652 A JP56069652 A JP 56069652A JP 6965281 A JP6965281 A JP 6965281A JP S57184243 A JPS57184243 A JP S57184243A
- Authority
- JP
- Japan
- Prior art keywords
- groups
- polyester resin
- unsaturated polyester
- molding material
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56069652A JPH0234182B2 (ja) | 1981-05-08 | 1981-05-08 | Denshibuhinfushoseikeizairyo |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56069652A JPH0234182B2 (ja) | 1981-05-08 | 1981-05-08 | Denshibuhinfushoseikeizairyo |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57184243A true JPS57184243A (en) | 1982-11-12 |
| JPH0234182B2 JPH0234182B2 (ja) | 1990-08-01 |
Family
ID=13408980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56069652A Expired - Lifetime JPH0234182B2 (ja) | 1981-05-08 | 1981-05-08 | Denshibuhinfushoseikeizairyo |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234182B2 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122961A (ja) * | 1981-11-05 | 1983-07-21 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | 熱硬化性樹脂状バインダー組成物 |
| JPH10245480A (ja) * | 1997-03-04 | 1998-09-14 | Showa Highpolymer Co Ltd | 封止用樹脂組成物 |
| JP2013010947A (ja) * | 2011-05-31 | 2013-01-17 | Toto Ltd | 樹脂成形体 |
-
1981
- 1981-05-08 JP JP56069652A patent/JPH0234182B2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122961A (ja) * | 1981-11-05 | 1983-07-21 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | 熱硬化性樹脂状バインダー組成物 |
| JPH0372670B2 (ja) * | 1981-11-05 | 1991-11-19 | Sheru Intern Risaachi Maachatsupii Bv | |
| JPH10245480A (ja) * | 1997-03-04 | 1998-09-14 | Showa Highpolymer Co Ltd | 封止用樹脂組成物 |
| JP2013010947A (ja) * | 2011-05-31 | 2013-01-17 | Toto Ltd | 樹脂成形体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0234182B2 (ja) | 1990-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX9606181A (es) | Composiciones curables. | |
| FI902943A0 (fi) | I hetta haerdbara reaktionshartsblandningar. | |
| GB2235925B (en) | Photocurable compositions | |
| ATE224425T1 (de) | Kunststoff-formmasse zur herstellung von formteilen mit dekoreffekt | |
| FR2527620B1 (fr) | Composition pour moulage a base de polymeres thermoplastiques renforces par des charges minerales | |
| ES439984A1 (es) | Un procedimiento para preparar una resina moldeable de po- liester. | |
| KR940013815A (ko) | 폴리프로필렌계 수지와 실리콘 고무의 일체 성형체 및 그의 제조 방법 | |
| JPS57184242A (en) | Molding material for sealing electronic part | |
| GB944061A (en) | Improvements in or relating to organosilicon polymers | |
| KR880000511A (ko) | 열가소성 성형 조성물 | |
| ATE145222T1 (de) | Flammwidrige giessharzformstoffe | |
| JPS57184243A (en) | Molding material for sealing electronic part | |
| GB1057423A (en) | Organosiloxane block copolymers | |
| EP0294148A3 (en) | Epoxy resin composition | |
| GR852212B (ja) | ||
| ES452211A1 (es) | Procedimiento para la obtencion de compuestos de moldeo ter-moplasticos a base de polimerizados de estireno. | |
| ES438519A1 (es) | Procedimiento para la preparacion de masas de moldeo a base de resina de melamina. | |
| AU6310998A (en) | A Polyester resin composition, a cured resin, and a paint | |
| ES463746A1 (es) | Un metodo para preparar una composicion de moldeo curable. | |
| JPS6469685A (en) | Composition for composite vibration-damping material | |
| GB1450362A (en) | Free-flowing unsaturated polyester moulding compositions hardenable with very littleshrinkage | |
| KR910008075A (ko) | 성형물 이형제 및 방향족 폴리카보네이트 수지를 포함하는 조성물 및 그 성형물 | |
| JPS5616547A (en) | Flame-resistant polyester resin composition | |
| JPS57179215A (en) | Thermosetting resin composition | |
| JPS5318692A (en) | Molding resin material compositions of low shrinkability |