JPS57170561U - - Google Patents
Info
- Publication number
- JPS57170561U JPS57170561U JP1981058020U JP5802081U JPS57170561U JP S57170561 U JPS57170561 U JP S57170561U JP 1981058020 U JP1981058020 U JP 1981058020U JP 5802081 U JP5802081 U JP 5802081U JP S57170561 U JPS57170561 U JP S57170561U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981058020U JPS6223096Y2 (enExample) | 1981-04-20 | 1981-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981058020U JPS6223096Y2 (enExample) | 1981-04-20 | 1981-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57170561U true JPS57170561U (enExample) | 1982-10-27 |
| JPS6223096Y2 JPS6223096Y2 (enExample) | 1987-06-12 |
Family
ID=29854459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981058020U Expired JPS6223096Y2 (enExample) | 1981-04-20 | 1981-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223096Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252159A (ja) * | 1986-04-25 | 1987-11-02 | Hitachi Ltd | 半導体装置用リ−ドフレ−ム |
| JPWO2016016985A1 (ja) * | 2014-07-31 | 2017-04-27 | 三菱電機株式会社 | 半導体装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038257U (enExample) * | 1973-08-06 | 1975-04-21 | ||
| JPS51131174U (enExample) * | 1975-04-15 | 1976-10-22 | ||
| JPS5216864U (enExample) * | 1975-07-22 | 1977-02-05 |
-
1981
- 1981-04-20 JP JP1981058020U patent/JPS6223096Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038257U (enExample) * | 1973-08-06 | 1975-04-21 | ||
| JPS51131174U (enExample) * | 1975-04-15 | 1976-10-22 | ||
| JPS5216864U (enExample) * | 1975-07-22 | 1977-02-05 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252159A (ja) * | 1986-04-25 | 1987-11-02 | Hitachi Ltd | 半導体装置用リ−ドフレ−ム |
| JPWO2016016985A1 (ja) * | 2014-07-31 | 2017-04-27 | 三菱電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6223096Y2 (enExample) | 1987-06-12 |