JPS5216864U - - Google Patents

Info

Publication number
JPS5216864U
JPS5216864U JP1975102164U JP10216475U JPS5216864U JP S5216864 U JPS5216864 U JP S5216864U JP 1975102164 U JP1975102164 U JP 1975102164U JP 10216475 U JP10216475 U JP 10216475U JP S5216864 U JPS5216864 U JP S5216864U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1975102164U
Other languages
Japanese (ja)
Other versions
JPS5535807Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975102164U priority Critical patent/JPS5535807Y2/ja
Publication of JPS5216864U publication Critical patent/JPS5216864U/ja
Application granted granted Critical
Publication of JPS5535807Y2 publication Critical patent/JPS5535807Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1975102164U 1975-07-22 1975-07-22 Expired JPS5535807Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975102164U JPS5535807Y2 (enExample) 1975-07-22 1975-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975102164U JPS5535807Y2 (enExample) 1975-07-22 1975-07-22

Publications (2)

Publication Number Publication Date
JPS5216864U true JPS5216864U (enExample) 1977-02-05
JPS5535807Y2 JPS5535807Y2 (enExample) 1980-08-23

Family

ID=28583613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975102164U Expired JPS5535807Y2 (enExample) 1975-07-22 1975-07-22

Country Status (1)

Country Link
JP (1) JPS5535807Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170561U (enExample) * 1981-04-20 1982-10-27
JPH0456257A (ja) * 1990-06-25 1992-02-24 Matsushita Electron Corp 樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170561U (enExample) * 1981-04-20 1982-10-27
JPH0456257A (ja) * 1990-06-25 1992-02-24 Matsushita Electron Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS5535807Y2 (enExample) 1980-08-23

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