JPS51129457U - - Google Patents
Info
- Publication number
- JPS51129457U JPS51129457U JP4682375U JP4682375U JPS51129457U JP S51129457 U JPS51129457 U JP S51129457U JP 4682375 U JP4682375 U JP 4682375U JP 4682375 U JP4682375 U JP 4682375U JP S51129457 U JPS51129457 U JP S51129457U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Cutting Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4682375U JPS51129457U (enExample) | 1975-04-07 | 1975-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4682375U JPS51129457U (enExample) | 1975-04-07 | 1975-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51129457U true JPS51129457U (enExample) | 1976-10-19 |
Family
ID=28183952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4682375U Pending JPS51129457U (enExample) | 1975-04-07 | 1975-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51129457U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63129638A (ja) * | 1986-11-20 | 1988-06-02 | Nissei Plastics Ind Co | 発光ダイオ−ドの製造装置 |
| JPH0382052A (ja) * | 1989-08-24 | 1991-04-08 | Rohm Co Ltd | フープ状電子部品集合体の製造方法 |
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1975
- 1975-04-07 JP JP4682375U patent/JPS51129457U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63129638A (ja) * | 1986-11-20 | 1988-06-02 | Nissei Plastics Ind Co | 発光ダイオ−ドの製造装置 |
| JPH0382052A (ja) * | 1989-08-24 | 1991-04-08 | Rohm Co Ltd | フープ状電子部品集合体の製造方法 |