JPS57166046A - Wafer transferring device - Google Patents

Wafer transferring device

Info

Publication number
JPS57166046A
JPS57166046A JP5140381A JP5140381A JPS57166046A JP S57166046 A JPS57166046 A JP S57166046A JP 5140381 A JP5140381 A JP 5140381A JP 5140381 A JP5140381 A JP 5140381A JP S57166046 A JPS57166046 A JP S57166046A
Authority
JP
Japan
Prior art keywords
wafer
aperture
valve
pressure
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5140381A
Other languages
Japanese (ja)
Inventor
Yutaka Yoriume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP5140381A priority Critical patent/JPS57166046A/en
Publication of JPS57166046A publication Critical patent/JPS57166046A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To transfer a wafer with no damage by a method wherein an exhaust aperture is provided in a slipping plate forming the inside wall face of a preliminary exhaust chamber, and the wafer is made to be attracted to the exhaust aperture to perform temporary stop or gradual transference. CONSTITUTION:Valves 6, 7 are closed, and after the preliminary exhaust chamber 16 is exhausted from apertures 3, 5, the valve 7 is opened, the wafer 1' is put in the preliminary exhaust chamber and the valve is closed. The wafer slips on the plate 8, and when the wafer reaches the aperture 3, the wafer stops being attracted to the plate 8. When the exhasut is proceeded moreover, and pressure in the chamber 16 is reduced to pressure being less than pressure in the aperture 3, the wafer 1 is released from sucking, and is made to slip toward the position of the valve 6 slowly by gravity. When pressure in the chamber 16 is reduced to the prescribed value, opening and closing of the valve 6 is performed to complete transference. When the diameter of the aperture 3, quantity of exhaust, and inclination of the plate 8 are regulated, the wafer can be transferred on a holding base 2 being made to slip slowly after it is nearly stopped. By this constitution, damage of the wafer to be generated by a stopper can be avoided.
JP5140381A 1981-04-06 1981-04-06 Wafer transferring device Pending JPS57166046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5140381A JPS57166046A (en) 1981-04-06 1981-04-06 Wafer transferring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5140381A JPS57166046A (en) 1981-04-06 1981-04-06 Wafer transferring device

Publications (1)

Publication Number Publication Date
JPS57166046A true JPS57166046A (en) 1982-10-13

Family

ID=12885964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5140381A Pending JPS57166046A (en) 1981-04-06 1981-04-06 Wafer transferring device

Country Status (1)

Country Link
JP (1) JPS57166046A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236479B2 (en) * 1972-12-28 1977-09-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236479B2 (en) * 1972-12-28 1977-09-16

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