JPS56115963A - Transfer apparatus for electronic parts - Google Patents

Transfer apparatus for electronic parts

Info

Publication number
JPS56115963A
JPS56115963A JP1037580A JP1037580A JPS56115963A JP S56115963 A JPS56115963 A JP S56115963A JP 1037580 A JP1037580 A JP 1037580A JP 1037580 A JP1037580 A JP 1037580A JP S56115963 A JPS56115963 A JP S56115963A
Authority
JP
Japan
Prior art keywords
package
chuck
testing
socket
solenoid valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1037580A
Other languages
Japanese (ja)
Other versions
JPS6031636B2 (en
Inventor
Kenji Takatsuka
Seiichi Iwasaki
Kyohei Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55010375A priority Critical patent/JPS6031636B2/en
Publication of JPS56115963A publication Critical patent/JPS56115963A/en
Publication of JPS6031636B2 publication Critical patent/JPS6031636B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable an IC package to be speedily positioned and set to the socket terminals for testing IC characteristics by providing a chuck having a set of tools which support a flat IC package by pinching its outer side surfaces. CONSTITUTION:The vacuum chuck is so controlled as to be directly above an IC package 8 on the conveyor, and then the solenoid valve is turned on to send a high- pressure air from a tube 2 into an air cylinder 1, whose piston pushes a stopper 3, so that the chuck 6 is opened. Then, with the IC package 8 sucked up by a vacuum suction tube 7, turning off the solenoid valve causes the chuck 6 to be pulled back by a coiled spring 4, so that the IC is positioned inside the chuck 6. After the presence of the IC in the chuck has been confirmed by a pressure-sensitive sensor in the vacuum system, this is moved to above a testing socket, and testing is performed, with the IC package terminals pressed to the socket. Thereby, an IC package can be set in a short period of time.
JP55010375A 1980-01-31 1980-01-31 Flat type electronic component transfer and characteristic sorting device Expired JPS6031636B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55010375A JPS6031636B2 (en) 1980-01-31 1980-01-31 Flat type electronic component transfer and characteristic sorting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55010375A JPS6031636B2 (en) 1980-01-31 1980-01-31 Flat type electronic component transfer and characteristic sorting device

Publications (2)

Publication Number Publication Date
JPS56115963A true JPS56115963A (en) 1981-09-11
JPS6031636B2 JPS6031636B2 (en) 1985-07-23

Family

ID=11748381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55010375A Expired JPS6031636B2 (en) 1980-01-31 1980-01-31 Flat type electronic component transfer and characteristic sorting device

Country Status (1)

Country Link
JP (1) JPS6031636B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100444701B1 (en) * 1997-09-13 2004-10-14 삼성전자주식회사 Socket opening apparatus for preventing damage of socket in package inserting/drawing process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216034U (en) * 1988-07-19 1990-02-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100444701B1 (en) * 1997-09-13 2004-10-14 삼성전자주식회사 Socket opening apparatus for preventing damage of socket in package inserting/drawing process

Also Published As

Publication number Publication date
JPS6031636B2 (en) 1985-07-23

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