JPH0330299B2 - - Google Patents
Info
- Publication number
- JPH0330299B2 JPH0330299B2 JP11063782A JP11063782A JPH0330299B2 JP H0330299 B2 JPH0330299 B2 JP H0330299B2 JP 11063782 A JP11063782 A JP 11063782A JP 11063782 A JP11063782 A JP 11063782A JP H0330299 B2 JPH0330299 B2 JP H0330299B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- transfer base
- support
- base
- wafer support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001179 sorption measurement Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 51
- 239000000428 dust Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は半導体装置製造用ウエハー搬送装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a wafer transfer device for manufacturing semiconductor devices.
(2) 技術の背景
半導体装置製造過程において、半導体素子を形
成するウエハーを各処理装置から次の処理装置に
移送する場合、各処理装置におけるウエハーの位
置決めに手間を要さず処理工程の自動化を容易に
し、またウエハー表面への塵埃の付着が確実に防
止されるウエハー搬送装置が望まれている。(2) Background of the technology In the process of manufacturing semiconductor devices, when wafers forming semiconductor elements are transferred from each processing device to the next, it is possible to automate the processing process without requiring the effort of positioning the wafer in each processing device. There is a need for a wafer transfer device that facilitates the transfer and reliably prevents dust from adhering to the wafer surface.
(3) 従来技術と問題点
従来のウエハー搬送装置はベルトコンベヤ等を
用いベルト上に直接ウエハーを搭載して各処理工
程間を搬送するものであり、搬送中にウエハー表
面に塵埃が付着することがあり、またベルト上の
汚れがウエハーに付着する場合があり、このため
ウエハーの品質を低下させ、また搬送時のウエハ
ー位置が固定されず各処理装置において作業者が
ウエハーの位置合せを行つていたため搬送作業の
完全自動化ができなかつた。(3) Conventional technology and problems Conventional wafer transport devices use a belt conveyor or the like to directly load wafers onto the belt and transport them between processing steps, and dust may adhere to the wafer surface during transport. In addition, dirt on the belt may adhere to the wafer, which reduces the quality of the wafer, and the wafer position during transportation is not fixed, making it difficult for workers to align the wafer in each processing device. Because of this, it was not possible to fully automate the transport work.
(4) 発明の目的
本発明は上記従来技術の欠点に鑑みなされたも
のであつて、簡単な構造で搬送中のウエハー位置
を固定し、ウエハーの位置合せを自動化可能と
し、これにより各ウエハー毎に防塵手段を設ける
ことを可能とするウエハー搬送装置の提供を目的
とする。(4) Purpose of the Invention The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has a simple structure that fixes the position of the wafer during transportation and enables automation of wafer alignment. The object of the present invention is to provide a wafer transfer device that can be provided with a dustproof means.
(5) 発明の構成
この目的を達成するため本発明に係るウエハー
搬送装置は、ウエハー搬送基台と、該搬送基台の
上に固定されたウエハー支持台と、該ウエハー支
持台を覆う様にして搬送基台に開閉可能に設けら
れた防塵カバーと、前記搬送基台及びウエハー支
持台を貫通して設けられた真空吸着機構とよりな
り、前記ウエハー搬送基台には、外部装置に設け
られたガイド受に嵌合して位置決めされるための
ガイド部材が突出して設けられ、前記ウエハー支
持台には、ウエハーを載置したとき、その一端を
当接して位置決めするための基準面が設けられ、
前記吸着機構は、前記ウエハー搬送基台及びウエ
ハー支持台の貫通孔に挿入される真空通路と、該
真空通路に接続した弾性体からなる空気室とを有
し、ウエハー支持台上に載置されたウエハーを吸
着保持できるようにしたことを特徴とする。(5) Structure of the Invention In order to achieve this object, a wafer transfer device according to the present invention includes a wafer transfer base, a wafer support stand fixed on the transfer base, and a wafer support stand that covers the wafer support stand. The wafer transfer base includes a dustproof cover that can be opened and closed on the transfer base, and a vacuum suction mechanism that is provided through the transfer base and the wafer support. A guide member is provided protrudingly to be fitted into the guide receiver for positioning, and the wafer support is provided with a reference surface for positioning the wafer by abutting one end of the wafer when the wafer is placed thereon. ,
The suction mechanism has a vacuum passage inserted into the through hole of the wafer transfer base and the wafer support, and an air chamber made of an elastic body connected to the vacuum passage, and is mounted on the wafer support. It is characterized by being able to suction and hold wafers.
(6) 発明の実施例
図面は本発明に係るウエハー搬送装置の断面図
である。ウエハー搬送基台１上にウエハー支持台
２が設けられ、この支持台２上にウエハー３が搭
載される。ウエハー３は開閉可能な防塵カバー４
で覆われる。搬送基台１および支持台２を貫通し
て真空通路５が設けられその先端にゴム等の弾性
体からなる空気室６が設けられる。このゴム等か
らなる空気室６を一旦圧縮しこれを解放するとき
の空気室の復帰力により真空通路５を介して真空
吸引力を生じさせこれによつてウエハー３を下側
から吸着し支持台２上に固定する。搬送基台１に
はガイド材７が突出して設けられる。このガイド
材７が嵌合するガイド受け９が外部の処理装置８
に設けられる。ウエハー３を支持台２の基準面１
０に当接させて配置して固定することにより、各
処理装置において一定基準位置にガイド受け９を
形成しておけばウエハー搬送基台１のガイド材７
をガイド受け９に嵌入することによりウエハー３
は各処理装置において一定位置に位置合せされ
る。空気室６の圧縮、解放動作は手動で行つても
よいし又はリンク機構等を用いてガイド材７のガ
イド受け９への挿入動作に連動して吸引力を発生
するように構成し搬送基台１を処理装置に固定し
た位置でウエハー３を固定し別の処理装置に移送
した場合にこの別の処理装置に対しウエハー３が
前の処理装置に対応した同じ位置に位置合せされ
るように構成してもよい。真空吸引力発生手段と
してピストンあるいは真空ポンプ等を用いてもよ
い。(6) Embodiments of the invention The drawing is a cross-sectional view of a wafer transfer device according to the invention. A wafer support stand 2 is provided on a wafer transfer base 1, and a wafer 3 is mounted on this support stand 2. The wafer 3 has a dustproof cover 4 that can be opened and closed.
covered with A vacuum passage 5 is provided passing through the transfer base 1 and the support base 2, and an air chamber 6 made of an elastic material such as rubber is provided at the tip thereof. The air chamber 6 made of rubber or the like is once compressed, and when it is released, a return force of the air chamber generates a vacuum suction force through the vacuum passage 5, which attracts the wafer 3 from below to the support table. 2. Fix it on top. A guide member 7 is provided in a protruding manner on the conveyance base 1 . The guide receiver 9 into which this guide material 7 fits is an external processing device 8.
established in The wafer 3 is placed on the reference surface 1 of the support stand 2.
By placing and fixing the guide member 9 in contact with the wafer transfer base 1, the guide member 9 of the wafer transfer base 1 can be formed at a constant reference position in each processing device.
The wafer 3 is inserted into the guide receiver 9.
is aligned at a fixed position in each processing device. The compression and release operations of the air chamber 6 may be performed manually, or a link mechanism or the like may be used to generate a suction force in conjunction with the insertion operation of the guide material 7 into the guide receiver 9. The wafer 3 is fixed at the position where the wafer 1 is fixed to the processing device, and when the wafer 3 is transferred to another processing device, the wafer 3 is aligned with the other processing device at the same position corresponding to the previous processing device. You may. A piston, a vacuum pump, or the like may be used as the vacuum suction force generating means.
(7) 発明の効果
以上説明したように、本発明に係るウエハー搬
送装置においては、ウエハーを真空吸引力により
支持台上に固定して搬送しているためガイド材等
の簡単な手段により各処理装置に対するウエハー
の相対位置を一定位置に位置合せすることがで
き、従つて、各処理装置において作業者が位置合
せのためにウエハーに触れる必要はなくなりウエ
ハー毎に防塵カバーを設けることが可能となり塵
埃の付着は確実に防止され搬送の完全自動化が達
成されるとともに製品の品質が向上する。(7) Effects of the Invention As explained above, in the wafer transfer device according to the present invention, since the wafer is fixed on the support table by vacuum suction force and is transferred, each processing is carried out using a simple means such as a guide material. The relative position of the wafer with respect to the equipment can be aligned at a fixed position. Therefore, there is no need for the operator to touch the wafer for alignment in each processing equipment, and it is possible to provide a dust-proof cover for each wafer to prevent dust. adhesion is reliably prevented, complete automation of conveyance is achieved, and product quality is improved.
図面は本発明に係るウエハー搬送装置の断面図
である。
１……搬送基台、２……支持台、３……ウエハ
ー、４……防塵カバー、５……真空通路、６……
空気室、７……ガイド材、８……処理装置、９…
…ガイド受け、１０……基準面。
The drawing is a sectional view of a wafer transfer device according to the present invention. 1... Transfer base, 2... Support stand, 3... Wafer, 4... Dust cover, 5... Vacuum passage, 6...
Air chamber, 7... Guide material, 8... Processing device, 9...
...Guide receiver, 10...Reference surface.
Claims (1)
されたウエハー支持台と、該ウエハー支持台を覆
う様にして搬送基台に開閉可能に設けられた防塵
カバーと、前記搬送基台及びウエハー支持台を貫
通して設けられた真空吸着機構とよりなり、前記
ウエハー搬送基台には、外部装置に設けられたガ
イド受に嵌合して位置決めされるためのガイド部
材が突出して設けられ、前記ウエハー支持台に
は、ウエハーを載置したとき、その一端を当接し
て位置決めするための基準面が設けられ、前記吸
着機構は、前記ウエハー搬送基台及びウエハー支
持台の貫通孔に挿入される真空通路と、該真空通
路に接続した弾性体からなる空気室とを有し、ウ
エハー支持台上に載置されたウエハーを吸着保持
できるようにしたことを特徴とするウエハー搬送
装置。1. A wafer transfer base, a wafer support fixed on the transfer base, a dustproof cover provided on the transfer base so as to be openable and closable so as to cover the wafer support, and the transfer base and The wafer transfer base includes a vacuum suction mechanism provided through the wafer support base, and the wafer transfer base is provided with a protruding guide member for fitting into and positioning a guide receiver provided on an external device. , the wafer support is provided with a reference surface for abutting and positioning one end of the wafer when the wafer is placed thereon, and the adsorption mechanism is inserted into the through hole of the wafer transfer base and the wafer support. What is claimed is: 1. A wafer transfer device comprising: a vacuum passageway in which a wafer is placed; and an air chamber made of an elastic body connected to the vacuum passageway, and capable of sucking and holding a wafer placed on a wafer support table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11063782A JPS593944A (en) | 1982-06-29 | 1982-06-29 | Wafer conveyer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11063782A JPS593944A (en) | 1982-06-29 | 1982-06-29 | Wafer conveyer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS593944A JPS593944A (en) | 1984-01-10 |
| JPH0330299B2 true JPH0330299B2 (en) | 1991-04-26 |
Family
ID=14540771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11063782A Granted JPS593944A (en) | 1982-06-29 | 1982-06-29 | Wafer conveyer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593944A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60264338A (en) * | 1984-06-11 | 1985-12-27 | Furukawa Electric Co Ltd:The | Manufacture of optical fiber preform |
| JP2728766B2 (en) * | 1990-07-18 | 1998-03-18 | 株式会社東芝 | Semiconductor processing method and apparatus |
| JP2754297B2 (en) * | 1991-09-30 | 1998-05-20 | 株式会社フジクラ | Optical fiber for laser treatment |
-
1982
- 1982-06-29 JP JP11063782A patent/JPS593944A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS593944A (en) | 1984-01-10 |
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