JPS57165193A - Hole machining method by laser - Google Patents

Hole machining method by laser

Info

Publication number
JPS57165193A
JPS57165193A JP56049389A JP4938981A JPS57165193A JP S57165193 A JPS57165193 A JP S57165193A JP 56049389 A JP56049389 A JP 56049389A JP 4938981 A JP4938981 A JP 4938981A JP S57165193 A JPS57165193 A JP S57165193A
Authority
JP
Japan
Prior art keywords
worked
laser light
hole
laser
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56049389A
Other languages
Japanese (ja)
Inventor
Yoshio Kado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56049389A priority Critical patent/JPS57165193A/en
Publication of JPS57165193A publication Critical patent/JPS57165193A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To make machining of holes of the work sure by setting a combustible material which emits light and burns when irradiated with laser light on the rear side of a material to be worked consisting of a transparent material. CONSTITUTION:A black colored thin paper sheet 3 is affixed on the rear of a material to be worked 1 consisting of a transparent material (methyl methacrylate), and the material to be worked is placed on a stand. Next, the pulse laser light 5 focused through a condenser lens 4 is irradiated to the material 1. When the machining of the hole in the material 1 progresses and the hole penetrates through the work, the thin paper sheet is burned by the laser light 5 and emits light, from which the penetration of the hole is easily confirmed.
JP56049389A 1981-04-03 1981-04-03 Hole machining method by laser Pending JPS57165193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56049389A JPS57165193A (en) 1981-04-03 1981-04-03 Hole machining method by laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56049389A JPS57165193A (en) 1981-04-03 1981-04-03 Hole machining method by laser

Publications (1)

Publication Number Publication Date
JPS57165193A true JPS57165193A (en) 1982-10-12

Family

ID=12829667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56049389A Pending JPS57165193A (en) 1981-04-03 1981-04-03 Hole machining method by laser

Country Status (1)

Country Link
JP (1) JPS57165193A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5887520A (en) * 1994-12-28 1999-03-30 Ricoh Microelectronics Co., Ltd. Method of fabricating plastic mask for paste printing with an excimer laser
EP1073321A3 (en) * 1999-07-27 2005-09-07 Matsushita Electric Works, Ltd. Processing method of printed wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5887520A (en) * 1994-12-28 1999-03-30 Ricoh Microelectronics Co., Ltd. Method of fabricating plastic mask for paste printing with an excimer laser
EP0985526A1 (en) * 1994-12-28 2000-03-15 Ricoh Microelectronics Co., Ltd. Plastic mask for paste printing and paste printing method
US6063476A (en) * 1994-12-28 2000-05-16 Ricoh Microelectronics Co., Ltd. Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method
US6170394B1 (en) 1994-12-28 2001-01-09 Ricoh Microelectronics Co., Ltd. Method of preparing and using a plastic mask for paste printing
EP1073321A3 (en) * 1999-07-27 2005-09-07 Matsushita Electric Works, Ltd. Processing method of printed wiring board

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