JPS5716159A - Copper electroless plating liquid - Google Patents

Copper electroless plating liquid

Info

Publication number
JPS5716159A
JPS5716159A JP8936480A JP8936480A JPS5716159A JP S5716159 A JPS5716159 A JP S5716159A JP 8936480 A JP8936480 A JP 8936480A JP 8936480 A JP8936480 A JP 8936480A JP S5716159 A JPS5716159 A JP S5716159A
Authority
JP
Japan
Prior art keywords
plating liquid
electroless plating
hexacyanoferrate
phenanthroline
dimethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8936480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233307B2 (cs
Inventor
Masahiro Oida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8936480A priority Critical patent/JPS5716159A/ja
Publication of JPS5716159A publication Critical patent/JPS5716159A/ja
Publication of JPS6233307B2 publication Critical patent/JPS6233307B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP8936480A 1980-06-30 1980-06-30 Copper electroless plating liquid Granted JPS5716159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8936480A JPS5716159A (en) 1980-06-30 1980-06-30 Copper electroless plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8936480A JPS5716159A (en) 1980-06-30 1980-06-30 Copper electroless plating liquid

Publications (2)

Publication Number Publication Date
JPS5716159A true JPS5716159A (en) 1982-01-27
JPS6233307B2 JPS6233307B2 (cs) 1987-07-20

Family

ID=13968641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8936480A Granted JPS5716159A (en) 1980-06-30 1980-06-30 Copper electroless plating liquid

Country Status (1)

Country Link
JP (1) JPS5716159A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365839A (en) * 1992-07-24 1994-11-22 Fujitsu Limited Shuttle printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365839A (en) * 1992-07-24 1994-11-22 Fujitsu Limited Shuttle printer

Also Published As

Publication number Publication date
JPS6233307B2 (cs) 1987-07-20

Similar Documents

Publication Publication Date Title
DE3363448D1 (en) Water soluble copper complexes of disazo compounds, process for their preparation and their use as dyestuffs
JPS5716159A (en) Copper electroless plating liquid
JPS5524914A (en) Nonelectrolytic gold plating liquor
JPS542396A (en) Purification of urokinase
JPS56271A (en) Non-electrolytic copper plating solution
CS189788B2 (en) Agent for acid water solution for galvanic plating
JPS53147691A (en) Method of producing transparent solution of magnesium salt for anion surface acitive agnet
JPS54101866A (en) Molded polyester article and its manufacture
EP0087113A3 (en) Water soluble disazo compounds, process for their preparation and their use as dyestuffs
JPS5217335A (en) Chemical copper plating solution
JPS532383A (en) Treatment of sludge contained oil
JPS5716158A (en) Copper electroless plating liquid
JPS5289577A (en) Electrodialysis of aqueous salt solution containing dissolved gypsum
FR2187940A1 (en) Electroless nickel plating concentrate - contg boric and citric acids
JPS527819A (en) Process for smooth electrodeposition of copper
JPS5268118A (en) Preparation of acrylamide
JPS56136970A (en) Chemical copper plating bath
JPS5319971A (en) Neutralizing method of water solution
JPS5421108A (en) Judging method of most suited delivery speed of modem
JPS5217334A (en) Electroless copper plating solution
JPS5257294A (en) Preparation of high-impact block copolyamides
JPS52119481A (en) Water treatment apparatus
JPS5717422A (en) Removal of chlorate in caustic solution by electrodeposition iron
JPS5237599A (en) Regeneration of exhausted chromic acid solution
JPS56123363A (en) Pretreating liquid for chemical plating