JPS57156451A - Preparation of amine compound - Google Patents

Preparation of amine compound

Info

Publication number
JPS57156451A
JPS57156451A JP3938781A JP3938781A JPS57156451A JP S57156451 A JPS57156451 A JP S57156451A JP 3938781 A JP3938781 A JP 3938781A JP 3938781 A JP3938781 A JP 3938781A JP S57156451 A JPS57156451 A JP S57156451A
Authority
JP
Japan
Prior art keywords
compound
diamine
acid anhydride
amine compound
formulai
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3938781A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Ritsuro Tada
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3938781A priority Critical patent/JPS57156451A/en
Publication of JPS57156451A publication Critical patent/JPS57156451A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled compound having low melting point and excellent solubility, capable of reacting uniformly without solvent, and useful as a component of a thermosetting resin composition, at low cost, by the thermal reaction of a diamine with a specific carboxylic acid anhydride.
CONSTITUTION: An amine compound is prepared by reacting a diamine with a carboxylic acid anhydride of formulaI[R is group of formula II or formula III (CH3 may exist in place of arbitrary H atoms of the carbon atoms having one H atom; m is 0 or 1)](e.g. endomethylenetetrahydrophthalic acid anhydride) with heating. The amount of the compound of formulaIis preferably 0.05W1.2mol per 1mol of the diamine. Heating of the amine compound together with an epoxy resin, etc. at 150W200°C gives a cured product having excellent high-temperature mechanical properties, thermal aging resistance, etc. The compound of formulaI has an amide bond and an imide bond in the molecular skeleton.
COPYRIGHT: (C)1982,JPO&Japio
JP3938781A 1981-03-20 1981-03-20 Preparation of amine compound Pending JPS57156451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3938781A JPS57156451A (en) 1981-03-20 1981-03-20 Preparation of amine compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3938781A JPS57156451A (en) 1981-03-20 1981-03-20 Preparation of amine compound

Publications (1)

Publication Number Publication Date
JPS57156451A true JPS57156451A (en) 1982-09-27

Family

ID=12551587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3938781A Pending JPS57156451A (en) 1981-03-20 1981-03-20 Preparation of amine compound

Country Status (1)

Country Link
JP (1) JPS57156451A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258348A (en) * 1985-09-09 1987-03-14 Alps Electric Co Ltd Memory control integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258348A (en) * 1985-09-09 1987-03-14 Alps Electric Co Ltd Memory control integrated circuit

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