JPS57154809A - Chip part - Google Patents
Chip partInfo
- Publication number
- JPS57154809A JPS57154809A JP4076981A JP4076981A JPS57154809A JP S57154809 A JPS57154809 A JP S57154809A JP 4076981 A JP4076981 A JP 4076981A JP 4076981 A JP4076981 A JP 4076981A JP S57154809 A JPS57154809 A JP S57154809A
- Authority
- JP
- Japan
- Prior art keywords
- printed substrate
- terminal sections
- outer circumferential
- circumferential surface
- magnetic substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To mount a core easily to a printed substrate by sintering a mixture of magnetic substance powder and resin onto an outer circumferential surface except the terminal sections at both ends of a cylindrical conductor. CONSTITUTION:The pasty material obtained by mixing the magnetic substance powder of ferrite, etc. and a binder such as acrylic resin is applied onto the outer circumferential surface of the cylindrical conductor 14 while leaving the both ends as the terminal sections 14a, 14b, and sintered, and the core 15 is formed. The surfaces of the terminal sections 14a, 14b are plated with solder as necessary. The chip part 13 shaped in this manner is mounted at the predetermined position of the printed substrate together with other chip parts, such as a capacitor, a resistor, a transistor, etc., and the printed substrate is passed in a melted solder tank. Accordingly, the surface of the printed substrate can be soldered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4076981A JPS57154809A (en) | 1981-03-20 | 1981-03-20 | Chip part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4076981A JPS57154809A (en) | 1981-03-20 | 1981-03-20 | Chip part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57154809A true JPS57154809A (en) | 1982-09-24 |
Family
ID=12589830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4076981A Pending JPS57154809A (en) | 1981-03-20 | 1981-03-20 | Chip part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57154809A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60194312U (en) * | 1984-06-04 | 1985-12-24 | 株式会社ピ−エフユ− | Noise removal device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5514708B2 (en) * | 1977-11-30 | 1980-04-18 |
-
1981
- 1981-03-20 JP JP4076981A patent/JPS57154809A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5514708B2 (en) * | 1977-11-30 | 1980-04-18 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60194312U (en) * | 1984-06-04 | 1985-12-24 | 株式会社ピ−エフユ− | Noise removal device |
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