JPS5879706A - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JPS5879706A JPS5879706A JP17711081A JP17711081A JPS5879706A JP S5879706 A JPS5879706 A JP S5879706A JP 17711081 A JP17711081 A JP 17711081A JP 17711081 A JP17711081 A JP 17711081A JP S5879706 A JPS5879706 A JP S5879706A
- Authority
- JP
- Japan
- Prior art keywords
- conductive coating
- magnetic
- coating
- ferrite core
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 40
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 6
- 230000004927 fusion Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、閉磁路型のチップインダクタに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a closed magnetic circuit type chip inductor.
近年、電子機器の小形化、高密度化、高信頼性化にとも
ない、インダクタも小形化、チップ化などが要求されて
いるが、従来のリード線付のインダクタは、ロッド状あ
るいはドラム状のフェライトコアの周囲に、絶縁被覆導
線を巻線したものであるためチップ化、小形化が困難で
ある部品であった。とりわけチップ化の目的においては
、従来の巻線方式のものをチップ化した場合、プリント
配線基、板上へ直接固着するため半田付けしたとき（半
田のディラグ条件は、温度２４０℃において５秒間）半
田の熱で絶縁外装した樹脂が溶融して、しかも絶縁被覆
導線の絶縁樹脂（ポリウレタン樹脂）も溶融して、特性
ならびに機械的強度も劣化するために実用できなかった
。また従来のリード線付きのインダクターで磁路構造が
開磁路のものは、磁場をかけたとき磁束が漏れてインダ
クタとしての物性が低下するばかシでなく、他の回路部
品に干渉しやすいため電子機器のセットメーカーでは、
磁気遮蔽したり、部品の配置を考慮するなどの特別の対
策を施している。また従来のリード線付きのインダクタ
にも閉磁路構造のものもあるが、これはロッド状あるい
はドラム状のフェライトコアに巻線したものに磁気遮蔽
用のスリーブ状のフェライトコアを嵌合したものであシ
、小形化が困難で、しかもコストが割高であることや、
ロット状するいはドラム状のフェライトコアと、スリー
ブ状のフェライトコアとの間に間隙があって完全に磁気
遮蔽できないなどの欠点があった。In recent years, as electronic devices have become smaller, more dense, and more reliable, inductors have also been required to be smaller and made into chips, but conventional inductors with lead wires are made of rod-shaped or drum-shaped ferrite. Since it consists of an insulated conductor wire wound around a core, it is difficult to make it into a chip or miniaturize it. Especially for the purpose of making a chip, when converting a conventional wire-wound type into a chip, when soldering it directly to a printed wiring board or board (solder delag conditions are 5 seconds at a temperature of 240°C). The heat from the solder melted the insulating sheathing resin, and the insulating resin (polyurethane resin) of the insulated conductor wire also melted, deteriorating its properties and mechanical strength, making it impractical. In addition, conventional inductors with lead wires that have an open magnetic path structure do not suffer from leakage of magnetic flux when a magnetic field is applied, deteriorating the physical properties of the inductor, but also because they tend to interfere with other circuit components. As a set manufacturer of electronic equipment,
Special measures have been taken, such as magnetic shielding and consideration of component placement. Some conventional inductors with lead wires also have a closed magnetic circuit structure, but these are made by fitting a sleeve-shaped ferrite core for magnetic shielding onto a wire wound around a rod-shaped or drum-shaped ferrite core. However, it is difficult to downsize, and the cost is relatively high.
There was a drawback that there was a gap between the rod-shaped or drum-shaped ferrite core and the sleeve-shaped ferrite core, and complete magnetic shielding could not be achieved.
この発明は、これらの欠点を除去することを目的とした
新規な構成によるチップインダクタを提供するものであ
る。The present invention provides a chip inductor with a novel configuration aimed at eliminating these drawbacks.
この発明のチップインダクタは、ロッド状のフェライト
コアの全面に導電被膜を施して、フェライトコアの両端
部に金属キャップ端子を圧入して・金属キャップ端子に
おおわれていない導電被膜の一端部から軸方向に沿って
、所望するインダクタンスとなるようにカットして、ら
せん状のコイルを導体とした後、前記金属キャップ端子
におおわれていない、露出している導電被膜（コイル導
体）の全面に、熱硬化性樹脂と、フェライト粉末からな
る磁性被膜を形成したものである。The chip inductor of this invention has a conductive coating applied to the entire surface of a rod-shaped ferrite core, metal cap terminals are press-fitted to both ends of the ferrite core, and an axial direction from one end of the conductive coating that is not covered by the metal cap terminal. After making the spiral coil into a conductor by cutting it to the desired inductance along A magnetic film made of a magnetic resin and ferrite powder is formed.
図面に基づいてこの発明を説明すると、第１図はロッド
状のフェライトコアｉＶｃ、導電被膜２を施したものの
断面図である。ロッド状のフェライトコア１は、フェラ
イト粉末と、バインダーを主成分として従来から公知の
方法で成形、焼成したものを用いることができる。また
導電被膜２としては導電性がよく、かつフェライトコア
との密着性のよい銅、二、ケルなどを無電解メッキ、ま
たは電気メッキして、さらに銀、金、白金、・ぐラジウ
ムなどを無電解メッキまたは電気メッキをしたものが有
効である。なおロッド状のフェライトコアの外径および
、長さｉ最終形状のチップ形状、チップ寸法、特性など
から決定する。To explain the present invention based on the drawings, FIG. 1 is a sectional view of a rod-shaped ferrite core iVc and a conductive coating 2 coated thereon. The rod-shaped ferrite core 1 can be formed by molding and firing a ferrite powder and a binder as main components by a conventionally known method. The conductive film 2 is made by electroless plating or electroplating of copper, nickel, chloride, etc., which have good conductivity and good adhesion to the ferrite core, and is further coated with silver, gold, platinum, radium, etc. Electrolytic plating or electroplating is effective. Note that the outer diameter of the rod-shaped ferrite core and the length i are determined based on the final chip shape, chip dimensions, characteristics, etc.
第２図は、導電被膜２を施したフェライトコアｌの両端
部に、金属キャップ端子３を圧入したものの断面図であ
る。金属キャップ端子３Ｉｒｉ最終製品となるチップイ
ンダクタの電極として、プリント配線基板上に強固に装
着し易くすることと、チップの機械的強度を保つための
ものであり、従来から公知の方法で金属キャップ端子の
素材として鉄キャッグを用い、これに半田付けを良くす
るために銅メッキをした上に、さらに、半田メッキをし
たものが有効である。また金属キャップ端子の素材とし
ては、銅キャップなどを用いてもよい。FIG. 2 is a cross-sectional view of a ferrite core l coated with a conductive coating 2, with metal cap terminals 3 press-fitted into both ends. Metal cap terminal 3Iri is used to make it easy to firmly mount the chip on a printed wiring board as an electrode of the chip inductor that will be the final product, and to maintain the mechanical strength of the chip. It is effective to use an iron cap as the material, which is copper-plated to improve soldering, and then solder-plated. Further, as a material for the metal cap terminal, a copper cap or the like may be used.
金属キャップ端子の形状や、寸法もまた、最終のチップ
形状、チップの寸法、特性によって決める。The shape and dimensions of the metal cap terminal are also determined by the final chip shape, chip dimensions, and characteristics.
第３図は、金属キャップ端子３！／ｃおおわれていない
、露出している前記導電被膜２の一端部から軸方向に沿
って所望のインダクタンスとなるように、連続的にカッ
トして、らせん状のコイル導体２′とした状態を示す。Figure 3 shows metal cap terminal 3! /c shows a state in which a helical coil conductor 2' is obtained by cutting continuously from one end of the conductive coating 2 that is not covered and exposed along the axial direction so as to have the desired inductance. .
これにより、一応チッグインダクタとしての機能はある
が、コイル導体が表面に露出しているため、開磁路構造
になっておシ、この状態で実用した場合、前記したよう
に従来のインダクタと同様の問題を生ずる。即ち、磁場
をかけた場合、磁束の漏れにより、特性の低下をきたす
だけでなく他の回路部品に干渉したりするので、従来の
リード線付きのインダクタとさはどかわりがないもので
ある。As a result, it functions as a Chigg inductor, but since the coil conductor is exposed on the surface, it has an open magnetic path structure. A similar problem occurs. That is, when a magnetic field is applied, leakage of magnetic flux not only causes deterioration of characteristics but also interferes with other circuit components, so it is no different from conventional inductors with lead wires.
そこでさらに、閉磁路構造のものでかつ、半田の熱に対
しても安定なチップにするために、前記第３図の状態の
チップに、熱硬化性樹脂１００重量部に対して、フェラ
イト粉末を７０重量部〜６５０重量部含有させた磁性塗
料を、前記らせん状のコイル導体２′の全面に塗布し、
焼付して第４図に示すような磁性皮膜４ｔｌ−形成した
チップインダクタを見いだした。この場合、熱硬化性樹
脂としては、トリアジン樹脂、トリアジン樹脂樹脂、ジ
フェニルオキシド樹脂、プリアミドイミド樹脂、ポリ・
ぐラバン酸ポリイミド樹脂などが有効であるが、他の熱
硬化性樹脂、例えばエポキシ樹脂、ジアリルフタレート
樹脂、不飽和プリエステル樹脂などでも効果は認められ
る。またフェライト粉末の含有量が熱硬化性樹脂１００
重量部に対して、７０重量部以下になると、磁性被膜に
した場合、フェライト粉末が少ないために、完全な閉磁
路にならず、特性の劣化を招くばかりでなく、シリンド
配線基板上に直接固着する時は、半田の熱で溶融するた
めに実用できない。また、フェライト粉末の含有量が６
５０重量部以上になると磁性皮膜にした場合、フェライ
ト粉末が多いために粉末と樹脂との結合力が弱く、粉末
が脱落したシ、物理的強度が劣化して、しがもチップを
シリンド配線基板上に装着するときには、半田の熱にょ
シチッゾに亀裂が発生して実用できない。Therefore, in order to make a chip with a closed magnetic circuit structure and stable against the heat of soldering, ferrite powder was added to 100 parts by weight of thermosetting resin to the chip in the state shown in Figure 3. Applying a magnetic paint containing 70 parts by weight to 650 parts by weight over the entire surface of the spiral coil conductor 2',
A chip inductor was found which was baked to form a magnetic film of 4tl as shown in FIG. In this case, the thermosetting resin includes triazine resin, triazine resin, diphenyl oxide resin, priamidimide resin, polyamide resin,
Gravate polyimide resin and the like are effective, but other thermosetting resins such as epoxy resins, diallyl phthalate resins, and unsaturated preester resins are also effective. In addition, the content of ferrite powder is 100% of the thermosetting resin.
If the amount is less than 70 parts by weight, the magnetic film will not have a completely closed magnetic path due to the small amount of ferrite powder, which will not only cause deterioration of the characteristics but also cause it to stick directly to the cylinder wiring board. When using it, it is not practical because it melts due to the heat of the solder. In addition, the content of ferrite powder is 6
If the amount exceeds 50 parts by weight, the bonding force between the powder and resin will be weak due to the large amount of ferrite powder, and the physical strength will deteriorate, making it difficult to attach the chip to a cylinder wiring board. When attaching it to the top, the heat of the solder causes cracks in the solder, making it impractical.
次にこの発明の実施例について説明する。Next, embodiments of this invention will be described.
（１） ロッド状のフェライトコア用の材料としては
、Ｎｉ−Ｚｎ７エライト粉末 ［Ｎｉ ０．６２ Ｚｎ
０．４０Ｆａ １．９６０４℃モル比）〕を用い、Ｎｉ
−Ｚｎフェライト粉末２５重量部に対しては、ポリビニ
ルブチラール樹脂（積木化学製ニスレックスＢＭＳ ）
１．５重量部、フタル酸ジブチル２重量部を加え、金属
製２本ロールで分散して、混線物を作成して、のち押出
しノズル径が１．９φの金型で押出し成形してグリーン
ロッドを作る。これを６．４ ｍの長さに切断したのち
、温度１０５０℃で２時間の焼成をおこない、外径が１
．６７φで、長さが５．６朋のロッド状のフェライトコ
アを作成した。(1) As a material for the rod-shaped ferrite core, Ni-Zn7 elite powder [Ni 0.62 Zn
0.40Fa 1.9604℃ molar ratio)], Ni
- For 25 parts by weight of Zn ferrite powder, polyvinyl butyral resin (Nisrex BMS manufactured by Block Chemical Co., Ltd.)
Add 1.5 parts by weight and 2 parts by weight of dibutyl phthalate, disperse with two metal rolls to create a mixed wire, and then extrude into a mold with an extrusion nozzle diameter of 1.9φ to form a green rod. make. After cutting this into a length of 6.4 m, it was fired at a temperature of 1050°C for 2 hours, and the outer diameter was 1.
．． A rod-shaped ferrite core with a diameter of 67 mm and a length of 5.6 mm was prepared.
（２）次に（１）で作成したロッド状のフェライトコア
を６０℃の温度で加熱した市販の無電解銅メッキ液中に
、１時間浸漬したのち水洗して、約３，５μｍの銅被膜
を形成して、さらにこの上に４０℃に加熱した市販の無
電解銀メッキ液中に３時間浸漬した後水洗して、約３．
８μｍの銀被膜を形成した。(2) Next, the rod-shaped ferrite core prepared in (1) was immersed in a commercially available electroless copper plating solution heated at 60°C for 1 hour, and then washed with water to form a copper coating of approximately 3.5 μm. was formed, and further immersed in a commercially available electroless silver plating solution heated to 40°C for 3 hours, and then washed with water to form a plate of about 3.
A silver film of 8 μm was formed.
（３） 次に（２）で作成した導電被膜付きのロッド
状のフェライトコアの両端部に、内径１，６７φ、肉厚
０．２５ｍｘ長さ１．５ｍｍの金属キャップ端子を圧入
した。なおこの金属キャップ端子は鉄キャッグの表面に
無電解銅メッキにより約１，５μｍの銅被膜と、無電解
半田メッキによシ約２．５μｍの半田被膜を施したもの
を用いた。(3) Next, metal cap terminals with an inner diameter of 1.67φ, a wall thickness of 0.25 m, and a length of 1.5 mm were press-fitted into both ends of the rod-shaped ferrite core with a conductive coating prepared in (2). The metal cap terminal used was one in which a copper film of about 1.5 μm thick was applied to the surface of an iron cap by electroless copper plating, and a solder film of about 2.5 μm thick was applied by electroless solder plating.
（４） 次に金属キヤ、！端子におおわれていない導
電被膜の一端部から軸方向に沿って、レーザートリミン
グ法によシフ０μｍピッチの溝巾と、７０μｍのらせん
状のコイル導体となるようにカットした。このようにし
て作成したチップインダクタの巻数は、３４巻であった
。なおこれらは実施例１゜２および比較例１．２．３な
どに使用した。(4) Next, the metal gear! A spiral coil conductor with a groove width of 0 μm pitch and a 70 μm pitch was cut by laser trimming along the axial direction from one end of the conductive film not covered with the terminal. The number of turns of the chip inductor thus produced was 34 turns. These were used in Example 1.2 and Comparative Example 1.2.3.
（５）実施例１として、熱硬化性樹脂は、市販のジフェ
ニルオキシド樹脂（菱電化成（株）ドリル樹脂Ｖ−５２
０）１００重量部に対して、前記フェライトコア用の組
成と同じであるＮｉ −Ｚｎフェライト粉末７０重量部
を混合して、金属製の３本ロールで分散、混練して磁性
塗料を作成した。(5) As Example 1, the thermosetting resin was a commercially available diphenyl oxide resin (Ryoden Kasei Co., Ltd. Drill Resin V-52).
0) 70 parts by weight of Ni--Zn ferrite powder having the same composition as that for the ferrite core was mixed with 100 parts by weight, and the mixture was dispersed and kneaded using three metal rolls to prepare a magnetic paint.
また、実施例２として、前記ジフェニルオキシド樹Ｉｌ
ｌ １００重量部に対して、Ｎｌ −Ｚｎフェライト粉
末６５０重量部をロールで混合、分散して磁性塗料を作
成した。In addition, as Example 2, the diphenyl oxide tree Il
A magnetic paint was prepared by mixing and dispersing 650 parts by weight of Nl-Zn ferrite powder with 100 parts by weight using a roll.
また、比較例１，２などとして、比較例１においては、
前記ジフェニルオキシド樹脂１００重量部に対して、Ｎ
ｉ −Ｚｎフェライト粉末を６５重量部を加え、比較例
２においては、ジフェニルオキシド樹脂１００重量部に
対して、Ｎｉ −Ｚｎフェライト粉末を６７０重量部を
加えて、ロールで分散、混練して磁性塗料を作成した。In addition, as Comparative Examples 1 and 2, in Comparative Example 1,
With respect to 100 parts by weight of the diphenyl oxide resin, N
65 parts by weight of i-Zn ferrite powder was added, and in Comparative Example 2, 670 parts by weight of Ni-Zn ferrite powder was added to 100 parts by weight of diphenyl oxide resin, and the mixture was dispersed and kneaded with a roll to form a magnetic coating material. It was created.
これを前記（４）で作成したチップのコイル導体部の全
面に、ロール転写法によって、約３００μｍの膜厚をも
った磁性被膜を形成して、温度２４０℃で３時間の焼付
をおこないチップインダクタとした。この最終チップの
寸法は、最大径部２．２７φで、長さは６．１０鶴であ
った。A magnetic film with a thickness of approximately 300 μm was formed on the entire surface of the coil conductor portion of the chip created in (4) above using a roll transfer method, and baked at a temperature of 240°C for 3 hours to form a chip inductor. And so. The final chip had a maximum diameter of 2.27φ and a length of 6.10mm.
（６）つぎに（５）で見られた実施例１．２などと比較
例１．２および（４）で得られた磁性被膜のないチップ
インダクタを比較例３として、それぞれのインダクタン
ス（Ｌ）とＱについてＱメータ（ＹＨＰ（株）４３４２
Ａ ：］によって測定した結果は第１表のごとくであっ
た。(6) Next, consider Example 1.2 as seen in (5), Comparative Example 1.2, and the chip inductor without magnetic coating obtained in (4) as Comparative Example 3, and calculate the respective inductances (L). Q meter (YHP Co., Ltd. 4342)
The results measured by A:] are shown in Table 1.
（７） さらに前記の５種類のチップインダクタをプ
リント配線基板上に、温度２４０℃で５秒間の半田ディ
ップによシ直接固着したところ第１表のようになり、実
施例１，２などは全く問題ないことを確認した。(7) Furthermore, when the five types of chip inductors mentioned above were directly fixed on a printed wiring board by soldering dip for 5 seconds at a temperature of 240°C, the results were as shown in Table 1, and Examples 1 and 2 were completely fixed. I confirmed that there was no problem.
第 １ 表
以上のようにこの発明によるチップインダクタは、絶縁
被覆導線を用いずに、金属のみによる導電被膜でもって
コイル導体を形成し、さらに磁性被膜で被覆しているた
め、プリント配線基板上へ直接固定する際に、半田の熱
によって、亀裂の発。As shown in Table 1, the chip inductor according to the present invention does not use an insulated conductor, but forms a coil conductor with a conductive coating made of only metal, and is further coated with a magnetic coating, so that it can be easily mounted on a printed wiring board. When directly fixing, cracks may occur due to the heat of the solder.
生や、磁性被膜の溶融なども起らない安定なものである
。また磁性被膜により被覆していて一体イヒしているた
めに磁束の漏れがなくて完全表門磁路となっており、イ
ンダクタとしての特性の低下や特にインダクタンスの低
下がなくて、シカλも他の回路部品に干渉せずに、部品
の配置および磁気遮蔽対策などが不要になる。しかもチ
ップ化ができることによシ、プリント配線基板上に直接
固着できるために、従来のリード線付きのインダクタに
比べて高密度の装着が可能となシ、電子機器の小形化へ
の効果がある。さらにこの発明のチップインダクタを実
現するうえで、従来から公知の方法によって簡単に製造
できるものである。とりわけ円筒形のチップ抵抗器など
の製造技術を応用することによって、円形のチッグは容
易に量産できて低コスト化ができる。またたとえば角板
形のような寸法のチップインダクタにも任意に応用でき
ることが明らかであり、工業的価値が大きいものである
。It is stable and does not cause any melting or melting of the magnetic coating. In addition, since it is coated with a magnetic film and is integrated, there is no leakage of magnetic flux and it is a complete front-gate magnetic path, so there is no deterioration in the characteristics as an inductor, and there is no deterioration in inductance. It does not interfere with circuit components and eliminates the need for component placement and magnetic shielding measures. Furthermore, since it can be made into a chip, it can be directly fixed onto a printed wiring board, allowing for higher density mounting than conventional inductors with lead wires, which has the effect of downsizing electronic devices. . Furthermore, in realizing the chip inductor of the present invention, it can be easily manufactured by conventionally known methods. In particular, by applying manufacturing technology for cylindrical chip resistors, circular chips can be easily mass-produced and costs can be reduced. Furthermore, it is clear that the present invention can be arbitrarily applied to chip inductors having dimensions such as a square plate shape, and has great industrial value.
第１図はこの発明のチップインダクタにおけるロッド状
のフェライトコアに導電被膜を施した断面図、第２図は
導電被膜を施したフェライトコアの両端部に金属キャッ
ノ端子を圧入した断面図、第３図は導電被膜を軸方向に
沿ってカットして、らせん状のコイル導体とした断面図
、第４図は金属キャップ端子をおおっていたいコイル導
体上に磁性被膜を形成した断面図である。
１・・・ロッド状のフェライトコア、２・・・導電皮膜
、２′・・・導電被膜（らせん状のコイル導体）、３・
・・金属キャップ端子、４・・・磁性被膜。
第１図
覗
第２図
第３図
第４図Fig. 1 is a cross-sectional view of a rod-shaped ferrite core coated with a conductive coating in the chip inductor of the present invention, Fig. 2 is a cross-sectional view of a ferrite core coated with a conductive coating with metal terminals press-fitted into both ends, and Fig. 3 The figure is a cross-sectional view of the conductive film cut along the axial direction to form a spiral coil conductor, and FIG. 4 is a cross-sectional view of the conductive film formed on the coil conductor that covers the metal cap terminal. 1... Rod-shaped ferrite core, 2... Conductive film, 2'... Conductive film (spiral coil conductor), 3...
...Metal cap terminal, 4...Magnetic coating. Figure 1 Preview Figure 2 Figure 3 Figure 4
Claims (2)
アの全面に導電被膜を施し、導電被膜に接触するように
フェライトコアの両端部に圧入された金属キャップ端子
と、金属キャップ端子におおわれていない導電被膜の一
端部から軸方向に沿ってらせん状に導電被膜を力、ソト
して所望のインダクタンスをもつように形成されたコイ
ル導体と、金属キャップ端子におおわれていない導電被
膜の全面に形成された熱硬化性樹脂と、フェライト粉末
力）らなる磁性被膜とからなることを特徴とするチツォ
イ７ ｆ Ｉ ｌ 、’(1) A rod-shaped ferrite core, a conductive coating applied to the entire surface of the ferrite core, a metal cap terminal press-fitted into both ends of the ferrite core so as to make contact with the conductive coating, and a conductive coating not covered by the metal cap terminal. A coil conductor is formed by twisting the conductive coating spirally from one end along the axial direction to have the desired inductance, and heat is generated over the entire surface of the conductive coating that is not covered by the metal cap terminal. The invention is characterized by comprising a hardening resin and a magnetic coating made of ferrite powder).
性被膜は、熱硬化性樹脂１００重量部に対して、フェラ
イト粉末が７０〜６５０重量部含有させたことを特徴と
する特許請求の範囲第（１）項記載のチップインダクタ
。(2) The magnetic film made of the thermosetting resin and ferrite powder contains 70 to 650 parts by weight of ferrite powder based on 100 parts by weight of the thermosetting resin. The chip inductor described in (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17711081A JPS5879706A (en) | 1981-11-06 | 1981-11-06 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17711081A JPS5879706A (en) | 1981-11-06 | 1981-11-06 | Chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5879706A true JPS5879706A (en) | 1983-05-13 |
Family
ID=16025324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17711081A Pending JPS5879706A (en) | 1981-11-06 | 1981-11-06 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5879706A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0785559A1 (en) * | 1995-06-08 | 1997-07-23 | Matsushita Electric Industrial Co., Ltd. | Chip coil |
| US5886876A (en) * | 1995-12-13 | 1999-03-23 | Oki Electric Industry Co., Ltd. | Surface-mounted semiconductor package and its manufacturing method |
| US6087921A (en) * | 1998-10-06 | 2000-07-11 | Pulse Engineering, Inc. | Placement insensitive monolithic inductor and method of manufacturing same |
| US6087920A (en) * | 1997-02-11 | 2000-07-11 | Pulse Engineering, Inc. | Monolithic inductor |
| EP1103993A1 (en) * | 1999-11-26 | 2001-05-30 | Taiyo Yuden Co., Ltd. | Surface-mount coil and method for manufacturing same |
| US9153547B2 (en) | 2004-10-27 | 2015-10-06 | Intel Corporation | Integrated inductor structure and method of fabrication |
| US20160189849A1 (en) * | 2014-12-24 | 2016-06-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
-
1981
- 1981-11-06 JP JP17711081A patent/JPS5879706A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0785559A1 (en) * | 1995-06-08 | 1997-07-23 | Matsushita Electric Industrial Co., Ltd. | Chip coil |
| EP0785559A4 (en) * | 1995-06-08 | 1999-08-11 | Matsushita Electric Ind Co Ltd | Chip coil |
| US5886876A (en) * | 1995-12-13 | 1999-03-23 | Oki Electric Industry Co., Ltd. | Surface-mounted semiconductor package and its manufacturing method |
| US6087920A (en) * | 1997-02-11 | 2000-07-11 | Pulse Engineering, Inc. | Monolithic inductor |
| US6223419B1 (en) | 1997-02-11 | 2001-05-01 | Pulse Engineering, Inc. | Method of manufacture of an improved monolithic inductor |
| US6087921A (en) * | 1998-10-06 | 2000-07-11 | Pulse Engineering, Inc. | Placement insensitive monolithic inductor and method of manufacturing same |
| EP1103993A1 (en) * | 1999-11-26 | 2001-05-30 | Taiyo Yuden Co., Ltd. | Surface-mount coil and method for manufacturing same |
| US6566993B1 (en) | 1999-11-26 | 2003-05-20 | Taiyo Yuden Co., Ltd. | Surface-mount coil and method for manufacturing same |
| US9153547B2 (en) | 2004-10-27 | 2015-10-06 | Intel Corporation | Integrated inductor structure and method of fabrication |
| US20160189849A1 (en) * | 2014-12-24 | 2016-06-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
| US9899149B2 (en) * | 2014-12-24 | 2018-02-20 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
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