JPS61214405A - High frequency inductor - Google Patents
High frequency inductorInfo
- Publication number
- JPS61214405A JPS61214405A JP5495985A JP5495985A JPS61214405A JP S61214405 A JPS61214405 A JP S61214405A JP 5495985 A JP5495985 A JP 5495985A JP 5495985 A JP5495985 A JP 5495985A JP S61214405 A JPS61214405 A JP S61214405A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- high frequency
- molded body
- resin
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 6
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 abstract 2
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 238000001721 transfer moulding Methods 0.000 abstract 1
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は各種電子機器に用いられる高周波インダクタ
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to high frequency inductors used in various electronic devices.
従来の技術
従来の、高周波インダクタは第６図ａ、ｂ、（１！のよ
うな構造になっていた。第６図ａは１本の銅線）よりな
る導ダを円筒状のフェライト焼結体８の中央穴８ａＫａ
してＬ値を取っている。第６図すは円柱状のフェライト
焼結体８に２つの穴８ｂをあけ、導体９をＶ字形に曲げ
前記フェライト焼結体８のおのおのの穴８ｂに通す事に
よって前記第６図ａより多くのＬ値を取る様な構成にな
っている。第６図Ｃでは前記２例よりさらに多くのＬ値
を取るために、円筒状のフェライト焼結体８の中央穴８
ａに一本の導体９を通してフェライトａ結体８のまわり
を長手方向に回転してもう一度フエライト焼結体８中央
穴８ａに通した構造となっている。Conventional technology A conventional high-frequency inductor had a structure as shown in Fig. 6a, b, (1!). Fig. 6a shows a single copper wire. A cylindrical ferrite sintered conductor Center hole 8aKa of body 8
Then, the L value is obtained. In Figure 6, two holes 8b are made in the cylindrical ferrite sintered body 8, and the conductor 9 is bent into a V shape and passed through each hole 8b of the ferrite sintered body 8. The configuration is such that it takes the L value of . In FIG. 6C, the center hole 8 of the cylindrical ferrite sintered body 8 is
The structure is such that one conductor 9 is passed through the ferrite sintered body 8, rotated in the longitudinal direction around the ferrite sintered body 8, and passed through the center hole 8a of the ferrite sintered body 8 again.
発明が解決しようとする問題点
しかしこのような構造のものでは、導体９とフェライト
焼結体８が一体化されておらず、導体９とフェライト焼
結体８の相互位置関係が不安定で特性が安定せず、寸法
精度が悪いという問題があった。また形状が不安定なた
め、実装機による供給組立の高速自動化が困難であった
０さらに近年電子機器の組立工程は、機器の軽薄短少、
多機能化に対応する為、チップ状電子部品を用いたりフ
ロー半田付による高密度実装を行っているが、前記従来
の技術で示した高周波インダクタ構成ではこのチップ状
電子部品と同等のりフロー半田付工程に使用する事が困
難であるという問題があった。Problems to be Solved by the Invention However, in such a structure, the conductor 9 and the ferrite sintered body 8 are not integrated, and the mutual positional relationship between the conductor 9 and the ferrite sintered body 8 is unstable, resulting in poor characteristics. There was a problem that the structure was not stable and the dimensional accuracy was poor. In addition, due to the unstable shape, it was difficult to automate high-speed supply and assembly using mounting machines.Moreover, in recent years, the assembly process of electronic devices has become more and more
In order to accommodate multi-functionality, chip-shaped electronic components are used and high-density mounting is performed using flow soldering. However, the high-frequency inductor configuration shown in the conventional technology described above has the same adhesive flow soldering as this chip-shaped electronic component. There was a problem that it was difficult to use in the process.
本発明はこのような問題点を解決するもので、寸法精度
の高い高周波インダクタを得るものである。The present invention solves these problems and provides a high frequency inductor with high dimensional accuracy.
問題点を解決するための手段
この問題点を解決するために本発明は、導体の中央部を
覆う様に酸化物磁性体を混合した樹脂からなる樹脂成形
体を設け、この樹脂成形体の両端に導出した前記導体の
両端を外部回路への接続用端子としたものである。Means for Solving the Problem In order to solve this problem, the present invention provides a resin molded body made of a resin mixed with an oxide magnetic material so as to cover the central part of the conductor, and covers both ends of the resin molded body. Both ends of the conductor led out are used as terminals for connection to an external circuit.
作 用 この技術的手段による作用は次のようになる。For production The effect of this technical means is as follows.
すなわち酸化物磁性体と熱硬化性樹脂の混合樹脂で導体
の中央部を覆うように外装成形するのでインダクタとし
ての代表特性値であるインダクタンスを確保できる。さ
らに成形体内に位置する所の導体の幅を狭くしたり、切
欠きを作成したりすることで、より多くのインダクタン
スを確保するように作用する。また外形形状が成形金型
で決まる為、寸法精度がよくなり形状が安定するととも
に、両端に残った外部接続用端子の加工が自由で実装形
態にあわせて外部接続用端子の形状を決める事ができる
。That is, since the conductor is externally molded with a mixed resin of an oxide magnetic material and a thermosetting resin so as to cover the central part of the conductor, the inductance, which is a typical characteristic value for an inductor, can be ensured. Furthermore, by narrowing the width of the conductor located within the molded body or creating a notch, more inductance can be ensured. In addition, since the external shape is determined by the molding die, dimensional accuracy is improved and the shape is stable, and the external connection terminals remaining at both ends can be processed freely, allowing the shape of the external connection terminals to be determined according to the mounting form. can.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
第１図において１は酸化物磁性体と熱硬化性樹脂を混合
した樹脂成形体、２はこの樹脂成形体１の内部に位置す
る導体部分、３は樹脂成形体１の両端に外部接続用端子
として導出した導体部分である。これは１本の導体を外
部接続用端子が樹脂成形体１の両端から導出されるよう
にトランス７ 。In Fig. 1, 1 is a resin molded body made of a mixture of oxide magnetic material and thermosetting resin, 2 is a conductor portion located inside this resin molded body 1, and 3 is a terminal for external connection at both ends of the resin molded body 1. This is the conductor part derived as . This is done by connecting one conductor to the transformer 7 so that external connection terminals are led out from both ends of the resin molded body 1.
７成形やインジエクシコン成形で成形封止して実施した
ものであり、樹脂成形体の形は第１図のような円筒に限
ったものでなく角形状であっても良い。また酸化物磁性
体や熱硬化性樹脂は必要特性。7 molding or Injiexicon molding, and the shape of the resin molded body is not limited to the cylindrical shape shown in FIG. 1, but may be square. Also, oxide magnetic materials and thermosetting resins have necessary characteristics.
必要信頼性に応じて自由に選択でき幅広い用途に使用さ
れる高周波インダクタとなる。It is a high-frequency inductor that can be freely selected depending on the required reliability and is used in a wide range of applications.
次に本発明の他の実施例について説明する。Next, other embodiments of the present invention will be described.
第２図は導体が短冊状の金属板４の例である。FIG. 2 shows an example of a metal plate 4 in which the conductor is in the form of a strip.
また樹脂成形体１の両端から導出した外部接続用端子を
第３図のように樹脂成形体１に沿って折り曲げる事によ
っていわゆるチップ状電子部品として自動実装にり７０
−半田付は工程が採用可能となる。In addition, by bending the external connection terminals led out from both ends of the resin molded body 1 along the resin molded body 1 as shown in FIG. 3, it can be automatically mounted as a so-called chip-shaped electronic component 70.
- Soldering process can be adopted.
第３図は樹脂成形体内で金属板４の幅を狭くした幅狭部
４ａを設けた例、第４図は樹脂成形体内で金属板４の端
子導出方向に対して直角方向から切欠き４ｂを互いに段
ちがいに設けた例であり、ともにインダクタとしての特
性りを多くとれるという効果を有している。Fig. 3 shows an example in which a narrow portion 4a is formed by narrowing the width of the metal plate 4 in the resin molded body, and Fig. 4 shows an example in which a notch 4b is formed in the resin molded body from a direction perpendicular to the terminal lead-out direction of the metal plate 4. This is an example in which the inductors are provided at different stages, and both have the effect that many characteristics can be obtained as an inductor.
発明の効果
本発明は、導体の中央部を纜う様に外装成形樹脂で成形
するので、外形形状が成形金型で決まり、寸法精度がよ
くなり、外形形状が安定し、特性バラツキが少なくなる
とともに実装機による供給組立の高速自動化も可能とな
る。また外部接続用端子の加工が自由で小形薄形化が可
能であり、超小形回路、高密度実装回−路にも対応でき
るとともに、他のチップ部品と同時にリフロー半田付け
も可能となり、実装コストの低減という効果を得ること
ができる。、さらに、熱硬化性樹脂で外装封止している
ので性能の経時変化が少く耐環境特性にも優れ高。信頼
性の高周波インダクタを安価に提供する事が可能であり
、その工業的価値が大である。Effects of the Invention In the present invention, since the conductor is molded with exterior molding resin so as to cover the central part of the conductor, the external shape is determined by the molding die, improving dimensional accuracy, stabilizing the external shape, and reducing variation in characteristics. At the same time, high-speed automation of supply and assembly using a mounting machine becomes possible. In addition, the external connection terminals can be processed freely and can be made smaller and thinner, making it compatible with ultra-small circuits and high-density mounting circuits.It also enables reflow soldering at the same time as other chip components, reducing mounting costs. It is possible to obtain the effect of reducing the Furthermore, since the exterior is sealed with thermosetting resin, there is little change in performance over time and it has excellent environmental resistance. It is possible to provide a reliable high frequency inductor at a low cost, and its industrial value is great.
【図面の簡単な説明】
第１図は本発明の一実施例による高周波インダクタを示
す透過斜視図、第２図は本発明の他の実施例を示す透過
斜視図、第３図は第２図に示す実施例の外部接続用端子
を加工した例を示す透過斜視図、第４図および第６図は
さらに本発明の他の実施例を示す透過斜視図、第６図ａ
％ Ｃは従来の高周波インダクタの透過斜視図である
。
１・・・・・樹脂成形体、２．３・・・・・・導体部分
、４・・・・・・金属板、４ａ・・・・・・幅狭部、４
ｂ・・・・・・切欠き。
代理人の氏名 弁理士 中尾 敏 男 ほか１名Ｊｆ！
；ｌ 図
／ −−−＃ ｎＡＪｉｊ、ｑ、３＝−％イλ二、自「
ｐ−ろう・
第２図
第３図
第４図
第５図
ｂ
第６図[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a transparent perspective view showing a high frequency inductor according to an embodiment of the present invention, FIG. 2 is a transparent perspective view showing another embodiment of the present invention, and FIG. FIGS. 4 and 6 are a transparent perspective view showing an example of processing the external connection terminal of the embodiment shown in FIG. 4, and FIG. 6 are a transparent perspective view and FIG.
% C is a transparent perspective view of a conventional high frequency inductor. 1...Resin molded body, 2.3...Conductor portion, 4...Metal plate, 4a...Narrow width part, 4
b...Notch. Name of agent: Patent attorney Toshio Nakao and one other person Jf!
;l Figure
/ ---# nAJij, q, 3=-%iλ2, self'
Figure 2 Figure 3 Figure 4 Figure 5 b Figure 6
Claims (4)
樹脂からなる樹脂成形体を設け、この樹脂成形体の両端
に導出した前記導体の両端を外部回路への接続用端子と
した高周波インダクタ。(1) A resin molded body made of a resin mixed with an oxide magnetic material was provided to cover the center part of the conductor, and both ends of the conductor led out to both ends of this resin molded body were used as terminals for connection to an external circuit. High frequency inductor.
項記載の高周波インダクタ。(2) Claim 1 in which the conductor is a strip-shaped metal plate
High frequency inductor described in section.
請求の範囲第２項記載の高周波インダクタ。(3) The high frequency inductor according to claim 2, wherein the width of the portion of the metal plate inside the resin molded body is narrowed.
対して直角方向から互いに段ちがいになる様に切欠きを
設けた特許請求の範囲第２項記載の高周波インダクタ。(4) The high-frequency inductor according to claim 2, wherein notches are provided in the resin molded body of the metal plate so as to be at different steps from each other in a direction perpendicular to the direction in which the terminals are led out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5495985A JPS61214405A (en) | 1985-03-19 | 1985-03-19 | High frequency inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5495985A JPS61214405A (en) | 1985-03-19 | 1985-03-19 | High frequency inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61214405A true JPS61214405A (en) | 1986-09-24 |
Family
ID=12985204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5495985A Pending JPS61214405A (en) | 1985-03-19 | 1985-03-19 | High frequency inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61214405A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048405U (en) * | 1990-05-11 | 1992-01-27 | ||
| JP2000012364A (en) * | 1998-06-23 | 2000-01-14 | Murata Mfg Co Ltd | Beads inductor and its manufacture |
| JP2018082136A (en) * | 2016-11-10 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Inductor |
| JP2020072097A (en) * | 2018-10-29 | 2020-05-07 | パナソニックＩｐマネジメント株式会社 | Inductor |
-
1985
- 1985-03-19 JP JP5495985A patent/JPS61214405A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH048405U (en) * | 1990-05-11 | 1992-01-27 | ||
| JP2000012364A (en) * | 1998-06-23 | 2000-01-14 | Murata Mfg Co Ltd | Beads inductor and its manufacture |
| US6801115B2 (en) | 1998-06-23 | 2004-10-05 | Murata Manufacturing Co., Ltd. | Bead inductor and method of manufacturing same |
| JP2018082136A (en) * | 2016-11-10 | 2018-05-24 | パナソニックＩｐマネジメント株式会社 | Inductor |
| JP2020072097A (en) * | 2018-10-29 | 2020-05-07 | パナソニックＩｐマネジメント株式会社 | Inductor |
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