JPS61121410A - Chip type coil element - Google Patents
Chip type coil elementInfo
- Publication number
- JPS61121410A JPS61121410A JP24559084A JP24559084A JPS61121410A JP S61121410 A JPS61121410 A JP S61121410A JP 24559084 A JP24559084 A JP 24559084A JP 24559084 A JP24559084 A JP 24559084A JP S61121410 A JPS61121410 A JP S61121410A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- core
- chip
- weight
- coil element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- 230000005291 magnetic effect Effects 0.000 abstract description 17
- 230000004907 flux Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004814 polyurethane Substances 0.000 description 12
- 229920002635 polyurethane Polymers 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000012778 molding material Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はチップ型コイル素子の改良に関するものである
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in chip-type coil elements.
（従来の技術）
近年、半導体素子の発展に伴ない電子機器、電子回路の
小型化、薄型化が急激に進んでおり、該電子回路等を構
成するコイル素子も小型化、チップ型化が試みられてい
る。(Prior art) In recent years, with the development of semiconductor devices, electronic devices and electronic circuits have rapidly become smaller and thinner, and attempts have been made to miniaturize and chip-type the coil elements that make up the electronic circuits. It is being
従来のチップ型コイル素子はフェライトから成るコアと
、ポリウレタン被覆銅線を多数巻回して成るコイルと、
コイルを外部回路に電気的に接続するための一対の端子
板とから構成されており、該チップ型コイル素子はフェ
ライトから成るコアの外周にポリウレタン被覆銅線を多
数巻回してコイルを形成し、コイルが巻回されたコアを
一対の端子板に接着材を介し取着するととも多こコイル
を形成するポリウレタン被覆銅線の両端を端子板ｌこロ
ウ付けすることによって作製されている。A conventional chip-type coil element has a core made of ferrite, a coil made of many turns of polyurethane-coated copper wire,
It consists of a pair of terminal plates for electrically connecting the coil to an external circuit, and the chip-type coil element is formed by winding a large number of polyurethane-coated copper wires around the outer periphery of a core made of ferrite to form a coil. It is manufactured by attaching a core around which a coil is wound to a pair of terminal plates via an adhesive, and then brazing both ends of a polyurethane-coated copper wire forming a multi-coil to the terminal plates.
（発明が解決しようとする問題点）
しかし乍ら、この従来のチップ型コイル素子はコア及び
コイルがそれぞれ磁気的に開放となっていることからコ
アの外周は巻回したコイルによって形成される磁束はそ
の一部が外部多こ漏れてしまい、その結果、コイルの磁
束密度が小となってチップ型コイル素子のインダクタン
スが大きく低下するという欠点を有していた。またこの
チップ型コイル素子を電気回路基板に取着した場合、電
気回路基板の各電気回路間が前記コイルの漏洩磁束１こ
よって相互干渉を起こし、電気回路に雑音や不要な発振
を発生して所望する回路特性が得られないという重大な
欠点を誘発する。(Problem to be solved by the invention) However, since the core and coil of this conventional chip-type coil element are each magnetically open, the outer periphery of the core is affected by the magnetic flux formed by the wound coil. However, a part of the magnetic flux leaks to the outside, and as a result, the magnetic flux density of the coil decreases, and the inductance of the chip-type coil element decreases significantly. Furthermore, when this chip-type coil element is attached to an electric circuit board, mutual interference occurs between each electric circuit on the electric circuit board due to the leakage magnetic flux 1 of the coil, causing noise and unnecessary oscillation in the electric circuit. This causes a serious drawback in that desired circuit characteristics cannot be obtained.
更には、このチップ型コイル素子は電気回路基板に取着
した場合、電気回路基板の電気配線導体等からの電磁気
が直接、コイルに作用することとなり、これによってコ
イルのインダクタンスが太き（変動し、チップ型コイル
素子の特性が極めて不安定となる欠点も有していた。Furthermore, when this chip-type coil element is attached to an electric circuit board, electromagnetic energy from the electric wiring conductors of the electric circuit board acts directly on the coil, which causes the inductance of the coil to increase (and fluctuate). However, it also had the disadvantage that the characteristics of the chip-type coil element were extremely unstable.
（発明の目的）
本発明者は丘記欠点に鑑み種々の実験の結果、チップ型
コイル素子のコイルが巻回されたコアの外周を、フェラ
イトを含有した樹脂モールド材で被覆すると、コアの外
周に巻回したコイルは外部に対し閉磁路となって、コイ
ルの磁束の漏れが皆無となり、コイルのインダクタンス
の低下や外部電気回路に与える悪影響が有効に防止され
、また同時に外部電気回路基板等からの磁気的な作用も
完全に遮断することができ、コイルのインダクタンスを
常に一定としてチップ型コイル素子の特性を極めて安定
なものになし得ることを知見した。(Object of the Invention) In view of the drawbacks described above, the present inventor has conducted various experiments and found that when the outer periphery of the core around which the coil of a chip-type coil element is wound is covered with a resin molding material containing ferrite, the outer periphery of the core The coil wound around the coil becomes a closed magnetic circuit to the outside, and there is no leakage of magnetic flux from the coil, effectively preventing a decrease in coil inductance and adverse effects on the external electric circuit. It was discovered that the magnetic effect of the coil can be completely blocked, and that the characteristics of the chip-type coil element can be made extremely stable by keeping the coil inductance constant.
本発明者は上記知見に基づき、外部電気回路に悪影響を
与えるような磁束の漏れを皆無とし、インダクタンスが
極めて高く、高安定性のチップ型コイル素子を提供する
ことをその目的とするものである。Based on the above findings, the present inventor aims to provide a highly stable chip-type coil element with extremely high inductance and no leakage of magnetic flux that would adversely affect external electric circuits. .
（問題点を解決するための手段）
本発明は一対の端子板にコイルが巻回されたコアを取着
して成るチップ型コイル素子に諸いて、前記コイルが巻
回されたコアを、フェライト粉末を３０乃至７０重量％
含有して成る樹脂モールド材で被覆したことを特徴とす
るものである。(Means for Solving the Problems) The present invention provides a chip-type coil element in which a core with a coil wound thereon is attached to a pair of terminal plates. 30 to 70% by weight of powder
It is characterized by being coated with a resin molding material containing.
（実施例）
次に本発明を第１図及び第２図に示す実施例１こ基づい
て詳細に説明する。(Example) Next, the present invention will be described in detail based on Example 1 shown in FIGS. 1 and 2.
第１図は本発明のチップ型コイル素子の一実施例を示し
、１はコア、２はコイル、３ａ、３ｂは端子板である。FIG. 1 shows an embodiment of the chip-type coil element of the present invention, in which 1 is a core, 2 is a coil, and 3a and 3b are terminal plates.
前記コア１は高周波特性がよく、かつ機械的強度が大の
フェライトから成り、その側面にコイルを巻回するため
の凹部が設けである。このコア１は円柱状のフェライト
焼結体を従来周知の切削加工法により切削し、側面１ζ
凹部を有する鼓状に構成される。The core 1 is made of ferrite which has good high frequency characteristics and high mechanical strength, and has a recessed portion on its side surface for winding a coil. This core 1 is made by cutting a cylindrical ferrite sintered body using a conventionally well-known cutting method.
It is configured like a drum with a concave part.
前記コア１はその側面凹部内に直径約０．０３〜０．１
５ ｍφのポリウレタン被覆銅線が多数巻回されており
、該ポリウレタン被覆銅線の巻回によりコイル２が形成
される。The core 1 has a diameter of about 0.03 to 0.1 in its side recess.
A large number of 5 mφ polyurethane-coated copper wires are wound, and the coil 2 is formed by winding the polyurethane-coated copper wires.
前記コイル２はポリウレタン被覆銅線の巻回数によって
そのインダクタンスの大きさが決定され、コイル２の巻
回数（ポリウレタン被覆鋼線の巻回数）はチップ型コイ
ル素子が所望するインダクタンスの大きさに合わせて決
定される。The inductance of the coil 2 is determined by the number of turns of the polyurethane-coated copper wire, and the number of turns of the coil 2 (the number of turns of the polyurethane-coated steel wire) is determined according to the desired inductance of the chip-type coil element. It is determined.
また前記コイル２を構成するポリウレタン被覆鋼線はそ
の太さがチップ型コイル素子の所望するインダクタンス
の大きさ、即ち、コイル２の巻回数によって決定され、
大きなインダクタンスを有するチップ型コイル素子の場
合、コイル２の巻回数が大となることからポリウレタン
被覆銅線は細いものが使用され、また小さなインダクタ
ンスを有するチップ型コイル素子の場合はコイル２の巻
回数が小となることからポリウレタン被覆銅線は太いも
のが使用される。The thickness of the polyurethane-coated steel wire constituting the coil 2 is determined by the desired inductance of the chip-type coil element, that is, the number of turns of the coil 2,
In the case of a chip-type coil element with a large inductance, the number of turns of the coil 2 is large, so a thin polyurethane-coated copper wire is used, and in the case of a chip-type coil element with a small inductance, the number of turns of the coil 2 is large. Because of this, thick polyurethane-coated copper wire is used.
尚、前記コイル２はポリウレタン被覆銅線を従来周知の
フライヤ方式もしくはスピンドル方式によりコア１側面
の凹部内に多数巻回することにより形成される。The coil 2 is formed by winding a large number of polyurethane-coated copper wires into the recessed portion of the side surface of the core 1 using a conventionally known flyer method or spindle method.
前記コイル２が巻回されたコア１はその底面が一定の間
隔をあけて平面状に配設された一対の端子板３ａ、３ｂ
ｋにエポキシ樹脂等から成る接着材を介し取着されてお
り、該端子板３ａ、３ｂにはコイル２を構成するポリウ
レタン被覆銅線の両端がそれぞれ半田等のロウ材を介し
ロウ付けされる。The core 1, around which the coil 2 is wound, has a pair of terminal plates 3a and 3b arranged in a plane with the bottom surfaces spaced apart from each other by a certain distance.
The terminal plates 3a and 3b are respectively attached to terminal plates 3a and 3b by soldering material such as solder at both ends of the polyurethane-coated copper wire constituting the coil 2.
尚、一対の端子板３ａ、３１）は第２図に示すようにリ
ードフレーム４に一体的に形成されており、上面にコア
１が取着された后は、点線Ａ＋こ沿ってリードフレーム
４から切断分離される。Note that the pair of terminal plates 3a, 31) are integrally formed on the lead frame 4 as shown in FIG. It is cut and separated from.
また前ｇコイル２が巻回されたコア１はその外周部が被
覆体５により完全に被覆されており、該被覆体５は樹脂
にフェライトの粉末を３０乃至７０重量％含有させて成
る樹脂モールド材により形成されている。Further, the outer periphery of the core 1 around which the front coil 2 is wound is completely covered with a covering 5, and the covering 5 is a resin mold made of a resin containing 30 to 70% by weight of ferrite powder. It is made of material.
前記被覆体５はコア１に巻回されたコイル２を外部に対
し閉磁路となす作用を為し、該被覆体５によってコイル
２の磁束は外部に漏れることは一切なく、漏洩磁束によ
るコイル２のインダクタンスの低下が有効に防止され、
フィル２のインダクタンスをコイル２の巻回数によって
決定される極めて高いものとなすことができる。また同
時に漏洩磁束による外部電気回路等への悪影響も有効１
こ防止でき、外部電気回路の回路特性も所望のものとな
すことができる。更【こは被覆体５は外部の磁気を完全
に遮断することからコイル２への外部磁気の作用が皆無
となり、コイル２はそのインダクタンスが常１こ一定と
なって、チップ型コイル素子としての特性を極めて安定
なものとなす。The covering 5 acts to make the coil 2 wound around the core 1 a closed magnetic path to the outside, and the covering 5 prevents the magnetic flux of the coil 2 from leaking to the outside, and prevents the coil 2 from leaking magnetic flux. This effectively prevents the inductance from decreasing.
The inductance of the fill 2 can be made extremely high, which is determined by the number of turns of the coil 2. At the same time, it is also effective in preventing negative effects on external electrical circuits due to leakage magnetic flux.
This can be prevented and the circuit characteristics of the external electric circuit can be made as desired. Furthermore, since the covering 5 completely blocks external magnetism, there is no effect of external magnetism on the coil 2, and the coil 2 always has a constant inductance of 1, so it can function as a chip-type coil element. The characteristics are extremely stable.
前記被覆体５を構成する樹脂モールド材において添加さ
れるフェライト粉末はコイル２を閉磁路とするためのシ
ールド部材であり、その添加量が３０重量％未満であれ
ば前記性質は付与されず、また７０重量％以とであれば
樹脂モールド材の粘度が大となりトランスファーモール
ド法等による成形ができなくなる。よって樹脂モールド
材中のフェライト粉末の含有量は３０乃至７０重量％の
範囲に特定される。The ferrite powder added to the resin molding material constituting the coating 5 is a shielding member for making the coil 2 a closed magnetic path, and if the amount added is less than 30% by weight, the above properties will not be imparted. If it is 70% by weight or more, the viscosity of the resin molding material becomes so high that it becomes impossible to mold it by a transfer molding method or the like. Therefore, the content of ferrite powder in the resin molding material is specified in the range of 30 to 70% by weight.
また前記樹脂モールド材Ｉζ使用される樹脂としてはチ
ップ型コイル素子を半田等のロウ材を介し電気回路基板
に取着することを考慮し、耐熱性１ζ優れた例えば、エ
ポキシ樹脂等が使用される。In addition, as the resin used in the resin molding material Iζ, for example, an epoxy resin having excellent heat resistance 1ζ is used, considering that the chip-type coil element is attached to an electric circuit board through a brazing material such as solder. .
前起樹脂モールド材はフェライトの含有量を５０乃至６
０重量％とじておくとコア１の外ＲＩこ巻回されたコイ
ル２を外部に対し完全な閉磁路となすとともにコア１及
びコイル２の外Ｆｉｌｌこ所望厚みの被覆体５を容易に
被着形成できることからフェライトの含有量は５０乃至
６０重量％の範囲とすることが好ましい。The pre-generated resin molding material has a ferrite content of 50 to 6.
By keeping it at 0% by weight, the coil 2 wound around the outside of the core 1 forms a completely closed magnetic circuit to the outside, and the coating 5 of a desired thickness can be easily applied to the outside of the core 1 and the coil 2. Since it can be formed, the content of ferrite is preferably in the range of 50 to 60% by weight.
尚、前記被覆体５は樹脂モールド材を従来周知のトラン
スファーモールド法を採用すること多こよりコイル２が
巻回されコア１の外周に被着形成される。The covering body 5 is formed by applying a conventionally known transfer molding method using a resin molding material, and the coil 2 is wound around the outer periphery of the core 1.
（発明の効果）
かくして、本発明のチップ型コイル素子によればコイル
が巻回されたコアの外周を、フェライト粉末を３０乃至
７０重量％含有して成る樹脂モールド材で被覆したこと
からコアの外周に巻回したコイルは外部に対し完全な閉
磁路となって外部電気回路に悪影響を与えるような磁束
の漏れが皆無となり、コイルのインダクタンスを極めて
高いものとなす。また外部磁気の作用を全く受けないこ
とからフィルのインダクタンスを常に一定となし、これ
によって極めて高品質高安定性のチップ型コイル素子を
得ることができる。(Effects of the Invention) Thus, according to the chip-type coil element of the present invention, the outer periphery of the core around which the coil is wound is coated with a resin molding material containing 30 to 70% by weight of ferrite powder. The coil wound around the outer periphery forms a completely closed magnetic path to the outside, and there is no leakage of magnetic flux that would adversely affect the external electric circuit, making the inductance of the coil extremely high. Moreover, since it is not affected by external magnetism at all, the inductance of the fill is always constant, and as a result, a chip-type coil element of extremely high quality and high stability can be obtained.
第１図は本発明のチップ型コイル素子の一実施例を示す
断面図、９１２図は第１図のチップ型コイル素子の分解
斜視図である。
１：コア ２：コイル、３ａ 、 ３ｂ 二端子板５
：被被覆FIG. 1 is a cross-sectional view showing one embodiment of the chip-type coil element of the present invention, and FIG. 912 is an exploded perspective view of the chip-type coil element of FIG. 1. 1: Core 2: Coil, 3a, 3b Two terminal board 5
: Covered
Claims (1)
チップ型コイル素子において、前記コイルが巻回された
コアの外周を、フェライト粉末を３０乃至７０重量％含
有して成る樹脂モールド材で被覆したことを特徴とする
チップ型コイル素子。In a chip-type coil element comprising a core wound with a coil attached to a pair of terminal plates, the outer periphery of the core around which the coil is wound is molded with a resin containing 30 to 70% by weight of ferrite powder. A chip-type coil element characterized by being coated with a material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24559084A JPS61121410A (en) | 1984-11-19 | 1984-11-19 | Chip type coil element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24559084A JPS61121410A (en) | 1984-11-19 | 1984-11-19 | Chip type coil element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121410A true JPS61121410A (en) | 1986-06-09 |
Family
ID=17135988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24559084A Pending JPS61121410A (en) | 1984-11-19 | 1984-11-19 | Chip type coil element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121410A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02194603A (en) * | 1989-01-24 | 1990-08-01 | Top Denshi Kk | Choke coil |
| JPH02284509A (en) * | 1989-04-25 | 1990-11-21 | Mitsubishi Electric Corp | Noise filter for surface mounting |
-
1984
- 1984-11-19 JP JP24559084A patent/JPS61121410A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02194603A (en) * | 1989-01-24 | 1990-08-01 | Top Denshi Kk | Choke coil |
| JPH02284509A (en) * | 1989-04-25 | 1990-11-21 | Mitsubishi Electric Corp | Noise filter for surface mounting |
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