JPS57146340A - Data transfer system - Google Patents
Data transfer systemInfo
- Publication number
- JPS57146340A JPS57146340A JP56031315A JP3131581A JPS57146340A JP S57146340 A JPS57146340 A JP S57146340A JP 56031315 A JP56031315 A JP 56031315A JP 3131581 A JP3131581 A JP 3131581A JP S57146340 A JPS57146340 A JP S57146340A
- Authority
- JP
- Japan
- Prior art keywords
- data
- prc
- output
- printer
- latch circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To achieve error detection, by connecting a printer controller (PRC) and a printer with a bidirectionally transferrable interface circuit, returning data transferred from the PRC from the printer and comparing transmission and reception data at the PRC.
CONSTITUTION: Data to be transmitted from a PRC 1 are set to a transmission data storage latch circuit 3 from a data line 2. The output is given to a transmission gate 11, which is driven with a transmission gate signal 8 from a print instruction line 4, the data is transmitted to a cable 12 and latched to a latch circuit 15 of a printer 17 with a strobe signal 9. Next, the output of the latch circuit 15 is inputted to a latch circuit 18 through a reception gate 10 at the PRC 1 side via a transmission gate 22 and the cable 12 with a gate signal 14. A comparison circuit 19 compares stored data of the latch circuits 3 and 8 and if they are coincident, an output 21 goes to low level, and if discident, the output goes to high level and set to a flip-flop 20. The PRC 1 retransmits data when discidence and the next data is transmitted at coincidence.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031315A JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56031315A JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57146340A true JPS57146340A (en) | 1982-09-09 |
Family
ID=12327842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56031315A Pending JPS57146340A (en) | 1981-03-06 | 1981-03-06 | Data transfer system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57146340A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173819A (en) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | Input device |
JPS614226U (en) * | 1984-06-12 | 1986-01-11 | ブラザー工業株式会社 | printing device |
JPH01173221A (en) * | 1987-12-28 | 1989-07-07 | Nec Corp | Printing device |
US5965943A (en) * | 1997-10-01 | 1999-10-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with bonding pad electrode |
US6087840A (en) * | 1997-10-21 | 2000-07-11 | Mitsubishi Denki Kabushiki Kaisha | Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same |
US6100708A (en) * | 1997-09-26 | 2000-08-08 | Mitsubishi Denki Kabushiki Kaisha | Probe card and wafer testing method using the same |
US6144212A (en) * | 1997-10-21 | 2000-11-07 | Mitsubishi Denki Kabushiki Kaisha | Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card |
-
1981
- 1981-03-06 JP JP56031315A patent/JPS57146340A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173819A (en) * | 1983-03-23 | 1984-10-02 | Hitachi Ltd | Input device |
JPS6336540B2 (en) * | 1983-03-23 | 1988-07-20 | Hitachi Ltd | |
JPS614226U (en) * | 1984-06-12 | 1986-01-11 | ブラザー工業株式会社 | printing device |
JPH01173221A (en) * | 1987-12-28 | 1989-07-07 | Nec Corp | Printing device |
US6100708A (en) * | 1997-09-26 | 2000-08-08 | Mitsubishi Denki Kabushiki Kaisha | Probe card and wafer testing method using the same |
US5965943A (en) * | 1997-10-01 | 1999-10-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with bonding pad electrode |
US6087840A (en) * | 1997-10-21 | 2000-07-11 | Mitsubishi Denki Kabushiki Kaisha | Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same |
US6144212A (en) * | 1997-10-21 | 2000-11-07 | Mitsubishi Denki Kabushiki Kaisha | Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card |
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