JPS57143475A - Partially coating method for metal - Google Patents

Partially coating method for metal

Info

Publication number
JPS57143475A
JPS57143475A JP56030227A JP3022781A JPS57143475A JP S57143475 A JPS57143475 A JP S57143475A JP 56030227 A JP56030227 A JP 56030227A JP 3022781 A JP3022781 A JP 3022781A JP S57143475 A JPS57143475 A JP S57143475A
Authority
JP
Japan
Prior art keywords
metal
groove
substrate
coating method
molten metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56030227A
Other languages
Japanese (ja)
Inventor
Eerushiyureegeru Deiitoritsuhi
Shinichi Nishiyama
Kuniaki Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP56030227A priority Critical patent/JPS57143475A/en
Publication of JPS57143475A publication Critical patent/JPS57143475A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106—Coating with metal alloys or metal elements only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To partially coat a metal onto a substrate with accuracy by cutting a groove of a desired shape in the surface of the substrate, arranging a powdered, foil-shaped, sheetlike or wiry metal along the groove, melting the metal by heating, and solidifying the molten metal. CONSTITUTION:A groove 2 of a desired shape is cut in the surface of an insulating substrate 1, and a powdered metal is arranged along the groove 2. The metal is melted by concentric heating with laser,and the molten metal 3 is solidified and bonded to the surface of the substrate 1. Since the groove 2 prevents the molten metal from overflowing and spreading over the plane, the metal 3 can be partially coated with accuracy.
JP56030227A 1981-03-02 1981-03-02 Partially coating method for metal Pending JPS57143475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56030227A JPS57143475A (en) 1981-03-02 1981-03-02 Partially coating method for metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56030227A JPS57143475A (en) 1981-03-02 1981-03-02 Partially coating method for metal

Publications (1)

Publication Number Publication Date
JPS57143475A true JPS57143475A (en) 1982-09-04

Family

ID=12297823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56030227A Pending JPS57143475A (en) 1981-03-02 1981-03-02 Partially coating method for metal

Country Status (1)

Country Link
JP (1) JPS57143475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100695A (en) * 1988-11-30 1992-03-31 Nippon Cmk Corp. Method of manufacturing a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100695A (en) * 1988-11-30 1992-03-31 Nippon Cmk Corp. Method of manufacturing a printed circuit board

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