JPS57141944A - Microwave semiconductor device - Google Patents

Microwave semiconductor device

Info

Publication number
JPS57141944A
JPS57141944A JP56027211A JP2721181A JPS57141944A JP S57141944 A JPS57141944 A JP S57141944A JP 56027211 A JP56027211 A JP 56027211A JP 2721181 A JP2721181 A JP 2721181A JP S57141944 A JPS57141944 A JP S57141944A
Authority
JP
Japan
Prior art keywords
image lines
conductor
earthing
covered
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56027211A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6363121B2 (enExample
Inventor
Sunao Takagi
Koji Ogiso
Fumio Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56027211A priority Critical patent/JPS57141944A/ja
Publication of JPS57141944A publication Critical patent/JPS57141944A/ja
Publication of JPS6363121B2 publication Critical patent/JPS6363121B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
JP56027211A 1981-02-26 1981-02-26 Microwave semiconductor device Granted JPS57141944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56027211A JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56027211A JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Publications (2)

Publication Number Publication Date
JPS57141944A true JPS57141944A (en) 1982-09-02
JPS6363121B2 JPS6363121B2 (enExample) 1988-12-06

Family

ID=12214763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56027211A Granted JPS57141944A (en) 1981-02-26 1981-02-26 Microwave semiconductor device

Country Status (1)

Country Link
JP (1) JPS57141944A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221015A (ja) * 1983-05-31 1984-12-12 Nippon Ueebu Gaido Kk 導波管形増幅器
US6236366B1 (en) 1996-09-02 2001-05-22 Olympus Optical Co., Ltd. Hermetically sealed semiconductor module composed of semiconductor integrated circuit and antenna element
JP2019013015A (ja) * 2014-10-21 2019-01-24 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． 電磁波を伝送するための方法及び装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3034714U (ja) * 1996-08-13 1997-03-07 有限会社日医商事 間仕切り装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112753A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro
JPS5112754A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112753A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro
JPS5112754A (ja) * 1974-07-22 1976-01-31 Nippon Electric Co Hyomenhaimeejisenro

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221015A (ja) * 1983-05-31 1984-12-12 Nippon Ueebu Gaido Kk 導波管形増幅器
US6236366B1 (en) 1996-09-02 2001-05-22 Olympus Optical Co., Ltd. Hermetically sealed semiconductor module composed of semiconductor integrated circuit and antenna element
JP2019013015A (ja) * 2014-10-21 2019-01-24 エイ・ティ・アンド・ティ インテレクチュアル プロパティ アイ，エル．ピー． 電磁波を伝送するための方法及び装置

Also Published As

Publication number Publication date
JPS6363121B2 (enExample) 1988-12-06

Similar Documents

Publication Publication Date Title
GB1309033A (en) Connection to a flat cable
DE3263865D1 (en) Shielded electrical cable
DE3166648D1 (en) Electrical connector for coaxial cables and bifilar cables
BR8002338A (pt) Conector eletrico coaxial
EP0322128A3 (en) Leaky cables
JPS57123609A (en) High frequency attenuating cable and device using same
EP0137370A3 (en) Surface mating coaxial connector
BR8206735A (pt) Blindagem eletromagnetica para conector eletrico;conector eletrico e parte de conector eletrico
FR2455343A1 (fr) Ruban plat electrique a conducteurs multiples blindes
EP0031869A3 (en) Transition between a coaxial cable and a multipolar pluggable connector
ATE18106T1 (de) Verbinder fuer ein abgeschirmtes koaxialkabel.
JPS57141944A (en) Microwave semiconductor device
GB1141721A (en) Shielded common return pairs and coaxial cable
GB615216A (en) Improvements in or relating to device for interconnecting wave guides
GB2007911A (en) Microwave device package
JPS57181204A (en) Microstrip type hybrid circuit
ATE37631T1 (de) Steckverbinder fuer koaxial abgeschirmtes kabel.
JPS55143819A (en) Surface magnetostatic wave device
JPS57145403A (en) Transducer
JPS5413981A (en) Micro strip line
JPS56111301A (en) Impedance matching device
ATE145299T1 (de) Elektromagnetisch abgeschirmtes kabel bzw. leitung
JPS534878A (en) Measuring void in submarine coaxial cable
JPS5571301A (en) Micro wave integrated circuit device
JPS57132411A (en) Lumped constant type circulator