JPS57141943A - Mounting device for semiconductor device - Google Patents

Mounting device for semiconductor device

Info

Publication number
JPS57141943A
JPS57141943A JP56028136A JP2813681A JPS57141943A JP S57141943 A JPS57141943 A JP S57141943A JP 56028136 A JP56028136 A JP 56028136A JP 2813681 A JP2813681 A JP 2813681A JP S57141943 A JPS57141943 A JP S57141943A
Authority
JP
Japan
Prior art keywords
ball
plate
bolt
control plate
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56028136A
Other languages
Japanese (ja)
Inventor
Toshio Mikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56028136A priority Critical patent/JPS57141943A/en
Publication of JPS57141943A publication Critical patent/JPS57141943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To simplify the removal of welding pressure as well as to reduce the time required for replacement of an element by a method wherein a pressure-adjusting bolt, having a device with which the bolt can be moved in the axial direction without making a pivotal movement, is screwed in the controlling plate which was arranged facing the side plates through the intermediary of a spring, an element is held by pressing in between the side plates. CONSTITUTION:A guide plate 16 is fixed on one of the side plates 8 using a screw, a control plate 15 is arranged between the section below the neck of the pressure-adjusting bolt 11, to be penetratingly inserted, and a guide plate 16 through the intermediary of a bearing 14 and a ball 17. On the surface facing the guide plate 16 of the control plate 15, a ring-shaped groove having the same center shaft as the bolt 11 is provided, three grooves, for example, which are inclined in the same direction are provided on the other guide plate 16a in such a manner that it is overlapping the ring-shaped groove, and the ball 17 is held between each groove. When the element is retained, the ball 17 is located at the deepest position in the groove 16a, and the ball is pressed by the force of a spring 12, located between the control plate 10 and the side plate 8, and the screw-in position of the bolt 4. When the ball is removed, a handle 20 is inserted in the control plate 15, the control plate is rotated, the ball 17 is shifted to the shallow position of the groove 16a, and the pressing force can be removed easily by pressing the spring 12.
JP56028136A 1981-02-26 1981-02-26 Mounting device for semiconductor device Pending JPS57141943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56028136A JPS57141943A (en) 1981-02-26 1981-02-26 Mounting device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56028136A JPS57141943A (en) 1981-02-26 1981-02-26 Mounting device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57141943A true JPS57141943A (en) 1982-09-02

Family

ID=12240350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56028136A Pending JPS57141943A (en) 1981-02-26 1981-02-26 Mounting device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57141943A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310271B2 (en) * 1974-11-25 1978-04-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310271B2 (en) * 1974-11-25 1978-04-12

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