JPS57137498A - Bright nickel plating method for copper or copper alloy - Google Patents

Bright nickel plating method for copper or copper alloy

Info

Publication number
JPS57137498A
JPS57137498A JP202382A JP202382A JPS57137498A JP S57137498 A JPS57137498 A JP S57137498A JP 202382 A JP202382 A JP 202382A JP 202382 A JP202382 A JP 202382A JP S57137498 A JPS57137498 A JP S57137498A
Authority
JP
Japan
Prior art keywords
copper
azoles
alloy
polishing liquid
chemical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP202382A
Other languages
Japanese (ja)
Other versions
JPS601400B2 (en
Inventor
Akira Naito
Yutaka Oshida
Tamio Fukano
Itaru Iketani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP202382A priority Critical patent/JPS601400B2/en
Publication of JPS57137498A publication Critical patent/JPS57137498A/en
Publication of JPS601400B2 publication Critical patent/JPS601400B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To obtain bright plating having no partial clouding or irregulaties on copper (alloy) by chemically polishing the copper (alloy) with chemical polishing liquid contg. azoles then carrying out bright Ni plating thereon. CONSTITUTION:The above-described chemical polishing liquid is formulated to be present with at least 1 kind of >=10ppm azoles expressed by the formula, more particularly about 100-1,000ppm. Aqueous mixed liquids contg., for example, sulfuric acid, nitric acid and hydrochloric acid are used as the chemical polishing liquid. Thence, copper or copper alloy is chemically polished with the chemical polishing liquid present with the azoles, after which it is subjected to bright Ni plating by adapting a method used heretofore, for example, an electroplating method using a watts bath or th like. Here, for example, imidazole, pyrazole, benzoimidazole, indazole, benzotriazole, etc. are used as the azoles of the formula.
JP202382A 1982-01-09 1982-01-09 Bright nickel plating method for copper or copper alloy Expired JPS601400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP202382A JPS601400B2 (en) 1982-01-09 1982-01-09 Bright nickel plating method for copper or copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP202382A JPS601400B2 (en) 1982-01-09 1982-01-09 Bright nickel plating method for copper or copper alloy

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4844874A Division JPS5615473B2 (en) 1974-04-30 1974-04-30

Publications (2)

Publication Number Publication Date
JPS57137498A true JPS57137498A (en) 1982-08-25
JPS601400B2 JPS601400B2 (en) 1985-01-14

Family

ID=11517727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP202382A Expired JPS601400B2 (en) 1982-01-09 1982-01-09 Bright nickel plating method for copper or copper alloy

Country Status (1)

Country Link
JP (1) JPS601400B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102888628A (en) * 2012-10-11 2013-01-23 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
CN104846410A (en) * 2015-06-16 2015-08-19 沈阳飞机工业（集团）有限公司 Method for electroplating nickel on brass and red copper alloy

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102888628A (en) * 2012-10-11 2013-01-23 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
CN102888628B (en) * 2012-10-11 2015-04-01 合肥奥福表面处理科技有限公司 Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
CN104846410A (en) * 2015-06-16 2015-08-19 沈阳飞机工业（集团）有限公司 Method for electroplating nickel on brass and red copper alloy

Also Published As

Publication number Publication date
JPS601400B2 (en) 1985-01-14

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