JPS57134563A - Etching agent for electroless plated thin nickel film - Google Patents
Etching agent for electroless plated thin nickel filmInfo
- Publication number
- JPS57134563A JPS57134563A JP1816181A JP1816181A JPS57134563A JP S57134563 A JPS57134563 A JP S57134563A JP 1816181 A JP1816181 A JP 1816181A JP 1816181 A JP1816181 A JP 1816181A JP S57134563 A JPS57134563 A JP S57134563A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- pattern
- etching agent
- free
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 8
- 238000005530 etching Methods 0.000 title abstract 4
- 239000003795 chemical substances by application Substances 0.000 title abstract 3
- 229910052759 nickel Inorganic materials 0.000 title abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 3
- 239000000460 chlorine Substances 0.000 abstract 3
- 239000003352 sequestering agent Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 230000003628 erosive effect Effects 0.000 abstract 2
- 230000002401 inhibitory effect Effects 0.000 abstract 2
- 150000002923 oximes Chemical class 0.000 abstract 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical class Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 abstract 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 abstract 1
- 239000012190 activator Substances 0.000 abstract 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001565 benzotriazoles Chemical class 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- -1 chlorine ions Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910017604 nitric acid Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011780 sodium chloride Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1816181A JPS57134563A (en) | 1981-02-12 | 1981-02-12 | Etching agent for electroless plated thin nickel film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1816181A JPS57134563A (en) | 1981-02-12 | 1981-02-12 | Etching agent for electroless plated thin nickel film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57134563A true JPS57134563A (en) | 1982-08-19 |
| JPS6214034B2 JPS6214034B2 (enrdf_load_stackoverflow) | 1987-03-31 |
Family
ID=11963877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1816181A Granted JPS57134563A (en) | 1981-02-12 | 1981-02-12 | Etching agent for electroless plated thin nickel film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57134563A (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123878A (ja) * | 1982-01-11 | 1983-07-23 | エンソ−ン・インコ−ポレ−テツド | 剥離材 |
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| US6544436B2 (en) * | 1996-07-29 | 2003-04-08 | Ebara Dansan Ltd. | Etchant, method for roughening copper surface and method for producing printed wiring board |
| WO2005095673A1 (de) * | 2004-03-25 | 2005-10-13 | Dr.-Ing. Max Schlötter Gmbh & Co. Kg | Entmetallisierungslösung und deren verwendung |
| JP2009147336A (ja) * | 2007-12-12 | 2009-07-02 | Rohm & Haas Electronic Materials Llc | 密着性の促進 |
| GB2452174B (en) * | 2006-05-03 | 2012-01-25 | Omg Electronic Chemicals Inc | A method and composition for selectively stripping nickel from a substrate |
| WO2024096006A1 (ja) * | 2022-11-01 | 2024-05-10 | 三菱瓦斯化学株式会社 | エッチング用水性組成物、それを用いたエッチング方法及び半導体基板の製造方法 |
-
1981
- 1981-02-12 JP JP1816181A patent/JPS57134563A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123878A (ja) * | 1982-01-11 | 1983-07-23 | エンソ−ン・インコ−ポレ−テツド | 剥離材 |
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| US6544436B2 (en) * | 1996-07-29 | 2003-04-08 | Ebara Dansan Ltd. | Etchant, method for roughening copper surface and method for producing printed wiring board |
| US7189336B2 (en) | 1996-07-29 | 2007-03-13 | Ebara Densan Ltd. | Etchant, method for roughening copper surface and method for producing printed wiring board |
| WO2005095673A1 (de) * | 2004-03-25 | 2005-10-13 | Dr.-Ing. Max Schlötter Gmbh & Co. Kg | Entmetallisierungslösung und deren verwendung |
| GB2452174B (en) * | 2006-05-03 | 2012-01-25 | Omg Electronic Chemicals Inc | A method and composition for selectively stripping nickel from a substrate |
| JP2009147336A (ja) * | 2007-12-12 | 2009-07-02 | Rohm & Haas Electronic Materials Llc | 密着性の促進 |
| WO2024096006A1 (ja) * | 2022-11-01 | 2024-05-10 | 三菱瓦斯化学株式会社 | エッチング用水性組成物、それを用いたエッチング方法及び半導体基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6214034B2 (enrdf_load_stackoverflow) | 1987-03-31 |
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