JPS57132348A - Manufacture of hybrid integrated circuit device - Google Patents
Manufacture of hybrid integrated circuit deviceInfo
- Publication number
- JPS57132348A JPS57132348A JP56209265A JP20926581A JPS57132348A JP S57132348 A JPS57132348 A JP S57132348A JP 56209265 A JP56209265 A JP 56209265A JP 20926581 A JP20926581 A JP 20926581A JP S57132348 A JPS57132348 A JP S57132348A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- resistor
- high accuracy
- substrate
- accuracy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
PURPOSE:To improve yield by mounting a resistor having high accuracy shaped separately to a resistance substrate to which a resistor having low accuracy is formed through a printing method. CONSTITUTION:Ag-Pd Conductor paste is printed and applied onto the ceramic substrate 1, and an electrode 2 and a conductor passage are formed. RuO2 Resistance paste is printed, dried and baked, and the resistor 3 having low accuracy is shaped. An electrode 2' and a printing resistor 3' are printed and baked onto another ceramic substrate 1', and the high accuracy resistance chip 5 having + or - 1% accuracy, resistance value thereof is adjusted through sandblasting or a laster or the like, is formed, the high accuracy resistance chip 5 is mounted at the predetermined position of the ceramic substrate 1 through soldering, etc., and the resistance substrate is completed. The yield of the resistance substrate has no relation to the yeild of the high accuracy resistor by incorporating the high accuracy resistance chip formed separately, and yield as a whole is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56209265A JPS57132348A (en) | 1981-12-25 | 1981-12-25 | Manufacture of hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56209265A JPS57132348A (en) | 1981-12-25 | 1981-12-25 | Manufacture of hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57132348A true JPS57132348A (en) | 1982-08-16 |
Family
ID=16570079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56209265A Pending JPS57132348A (en) | 1981-12-25 | 1981-12-25 | Manufacture of hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57132348A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4830353B1 (en) * | 1969-01-23 | 1973-09-19 |
-
1981
- 1981-12-25 JP JP56209265A patent/JPS57132348A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4830353B1 (en) * | 1969-01-23 | 1973-09-19 |
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