JPS52141576A - Semiconductor device having surge absorber - Google Patents

Semiconductor device having surge absorber

Info

Publication number
JPS52141576A
JPS52141576A JP5437277A JP5437277A JPS52141576A JP S52141576 A JPS52141576 A JP S52141576A JP 5437277 A JP5437277 A JP 5437277A JP 5437277 A JP5437277 A JP 5437277A JP S52141576 A JPS52141576 A JP S52141576A
Authority
JP
Japan
Prior art keywords
semiconductor device
surge absorber
surge
highvoltage
withstand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5437277A
Other languages
Japanese (ja)
Other versions
JPS5516540B2 (en
Inventor
Tatsuo Shimura
Kazunori Nakayama
Koichi Wajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5437277A priority Critical patent/JPS52141576A/en
Publication of JPS52141576A publication Critical patent/JPS52141576A/en
Publication of JPS5516540B2 publication Critical patent/JPS5516540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE: To obtain the semiconductor device which can withstand the highvoltage surge by installing each one of the respective electrodes of the ceramic varistor element and the Si semiconductor element as a common electrode on one metal plate.
COPYRIGHT: (C)1977,JPO&Japio
JP5437277A 1977-05-13 1977-05-13 Semiconductor device having surge absorber Granted JPS52141576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5437277A JPS52141576A (en) 1977-05-13 1977-05-13 Semiconductor device having surge absorber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5437277A JPS52141576A (en) 1977-05-13 1977-05-13 Semiconductor device having surge absorber

Publications (2)

Publication Number Publication Date
JPS52141576A true JPS52141576A (en) 1977-11-25
JPS5516540B2 JPS5516540B2 (en) 1980-05-02

Family

ID=12968830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5437277A Granted JPS52141576A (en) 1977-05-13 1977-05-13 Semiconductor device having surge absorber

Country Status (1)

Country Link
JP (1) JPS52141576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219715A (en) * 2015-05-26 2016-12-22 住友ベークライト株式会社 Insulation gate bipolar transistor element, resin composition, and surge countermeasure member

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335559U (en) * 1989-08-19 1991-04-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219715A (en) * 2015-05-26 2016-12-22 住友ベークライト株式会社 Insulation gate bipolar transistor element, resin composition, and surge countermeasure member

Also Published As

Publication number Publication date
JPS5516540B2 (en) 1980-05-02

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